公开(公告)号：US20150069638A1

公开(公告)日：2015-03-12

申请号：US14337624

申请日：2014-07-22

申请人： Kabushiki Kaisha Toshiba

发明人： Daisuke HIRATSUKA ,  Tomohiro IGUCHI ,  Masayuki UCHIDA

IPC分类号： B23K35/02 ,  H01L23/00 ,  B23K35/24

CPC分类号： B23K35/025 ,  B22F1/0003 ,  B22F1/0018 ,  B22F1/0074 ,  B22F2999/00 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K35/282 ,  B23K35/286 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/32 ,  B23K35/322 ,  B23K35/325 ,  B23K35/3601 ,  B23K35/362 ,  C22C1/0491 ,  C22C5/06 ,  H01L21/4867 ,  H01L23/3737 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0381 ,  H01L2224/04026 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/2744 ,  H01L2224/29006 ,  H01L2224/29294 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29372 ,  H01L2224/29373 ,  H01L2224/29376 ,  H01L2224/29378 ,  H01L2224/2938 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/8322 ,  H01L2224/83411 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/8384 ,  H01L2924/01102 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1067 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/0543 ,  H01L2924/01031 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  B22F1/0022

摘要： According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.

摘要翻译： 根据一个实施方案，金属颗粒糊包括极性溶剂和分散在极性溶剂中并含有第一金属的颗粒。 与第一金属不同的第二金属溶解在极性溶剂中。

公开(公告)号：US20050127134A1

公开(公告)日：2005-06-16

申请号：US10941014

申请日：2004-09-15

申请人： Guo-Quan Lu ,  Zhiye Zhang ,  Jesus Calata ,  Guofeng Bai ,  Yanjing Liu ,  Bryan Koene ,  Paige Phillips

发明人： Guo-Quan Lu ,  Zhiye Zhang ,  Jesus Calata ,  Guofeng Bai ,  Yanjing Liu ,  Bryan Koene ,  Paige Phillips

IPC分类号： H01L21/60 ,  H01L23/492 ,  H05K3/32 ,  B23K1/00

CPC分类号： H01L24/83 ,  H01L23/4924 ,  H01L24/29 ,  H01L2224/27332 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29372 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8322 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/321 ,  H05K2201/0257 ,  H05K2203/1131 ,  H01L2924/20271 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014

摘要： Methods of attaching high-temperature electrical components to substrates are provided. The methods involve of attachment of high-temperature components to substrates via a nano-metal film.

摘要翻译： 提供了将高温电气部件附接到基板的方法。 该方法涉及通过纳米金属膜将高温组分附着到基底上。

公开(公告)号：US20240203754A1

公开(公告)日：2024-06-20

申请号：US18527731

申请日：2023-12-04

申请人： Arieca Inc.

发明人： Navid Kazem ,  Dylan S. Shah ,  Jeffrey Gelorme ,  Hing Jii Mea ,  Keyton D. Feller

IPC分类号： H01L21/48 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L21/4882 ,  H01L23/3733 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29005 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/2936 ,  H01L2224/29366 ,  H01L2224/29372 ,  H01L2224/29379 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32221 ,  H01L2224/83201 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2924/0108 ,  H01L2924/0133 ,  H01L2924/0615 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/0695 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/095

摘要： A method of deposition of a thermal interface material onto a circuit assembly and an integrated circuit formed therefrom is provided. The method includes depositing a thermal interface material at a first layer thickness between a first layer of a circuit assembly and a second layer of the circuit assembly. The thermal interface material includes an emulsion of liquid metal droplets and polymer. The first layer thickness is at least 1.1 times a D90 of the liquid metal droplets prior to compressing the circuit assembly. The method includes compressing the circuit assembly to decrease the first layer thickness to a second layer thickness, thereby deforming the liquid metal droplets. The second layer thickness is no greater than a D90 of the liquid metal droplets in thermal interface material prior to compressing the circuit assembly.

公开(公告)号：US20160151864A1

公开(公告)日：2016-06-02

申请号：US15017755

申请日：2016-02-08

申请人： Henkel IP & Holding GmbH

发明人： Louis P. Rector ,  Harry Richard Kuder ,  Juliet Grace Sanchez ,  Albert P. Perez ,  Kathryn Bearden

IPC分类号： B23K35/30 ,  B23K35/362 ,  B23K35/26 ,  C22C38/52 ,  C22C9/00 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  C22C13/00 ,  C22C5/06 ,  B23K35/02 ,  C22C38/06

CPC分类号： B23K35/3006 ,  B22F1/0025 ,  B22F1/0059 ,  B22F3/10 ,  B22F3/1003 ,  B22F3/1035 ,  B22F3/23 ,  B22F7/08 ,  B23K35/0233 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/362 ,  B82Y30/00 ,  C22C1/0491 ,  C22C5/06 ,  C22C9/00 ,  C22C13/00 ,  C22C26/00 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/52 ,  C22C49/12 ,  C22C2026/002 ,  C23C24/106 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2711 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29372 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29413 ,  H01L2224/29418 ,  H01L2224/2942 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29471 ,  H01L2224/29472 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83825 ,  H01L2224/8384

摘要： A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.

摘要翻译： 任选使用固体或半固体有机粘合剂制备包含一种或多种金属，一种或多种金属合金或一种或多种金属和一种或多种金属合金的共混物的烧结膜。 有机粘合剂可具有助熔功能; 有机粘合剂可以是在组合物中金属或金属合金烧结时部分或完全分解的有机粘合剂。 在一个实施例中，烧结膜设置在诸如硅晶片或晶片的终端使用基板或金属电路板或箔上，或者烧结膜设置在诸如金属网的载体上。 通过将金属或金属合金分散在具有或不具有粘合剂的合适溶剂中并将组合物暴露于高温以蒸发掉溶剂并部分烧结金属或金属合金来实现制备。