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公开(公告)号：US20130277850A1
公开(公告)日：2013-10-24
申请号：US13859175
申请日：2013-04-09
申请人： NAPRA CO., LTD.
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01B1/22 , H01L21/4867 , H01L21/563 , H01L23/498 , H01L23/49838 , H01L23/49866 , H01L23/49883 , H01L23/49894 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/0332 , H01L2224/0341 , H01L2224/03848 , H01L2224/0401 , H01L2224/05023 , H01L2224/05205 , H01L2224/05209 , H01L2224/05211 , H01L2224/05213 , H01L2224/05318 , H01L2224/05324 , H01L2224/05338 , H01L2224/05339 , H01L2224/05344 , H01L2224/05347 , H01L2224/05355 , H01L2224/0536 , H01L2224/05366 , H01L2224/05369 , H01L2224/05562 , H01L2224/0569 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17181 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/81375 , H01L2224/81395 , H01L2224/81505 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81618 , H01L2224/81624 , H01L2224/81638 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/8166 , H01L2224/81666 , H01L2224/81669 , H01L2224/831 , H01L2225/06513 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/00014 , H01L2924/01327 , H01L2924/12041 , H01L2924/15747 , H01L2933/0016 , H01L2933/0066 , Y02E10/547 , H01L2924/01014 , H01L2924/00 , H01L2224/05552
摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallization trace. The metallization trace has a metallization layer and a synthetic resin layer. The metallization layer has a high-melting-point metallic component and a low-melting-point metallic component. The high-melting-point metallic component and the low-melting-point metallic component are diffusion bonded together and adhered to a surface of the substrate. The synthetic resin layer is formed simultaneously with the metallization layer to cover a surface of the metallization layer with a thickness in the range of 5 nm to 1000 nm. The electronic component is electrically connected to the metallization layer.
摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和合成树脂层。 金属化层具有高熔点金属成分和低熔点金属成分。 高熔点金属成分和低熔点金属成分被扩散接合在一起并附着在基板的表面。 合成树脂层与金属化层同时形成，以覆盖金属化层的表面，厚度在5nm至1000nm的范围内。 电子部件电连接到金属化层。
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公开(公告)号：US08217403B1
公开(公告)日：2012-07-10
申请号：US13179073
申请日：2011-07-08
申请人： Shigenobu Sekine , Yurina Sekine
发明人： Shigenobu Sekine , Yurina Sekine
IPC分类号： H01L27/15
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： An electronic device includes a substrate and an electronic component. The substrate has a metallized trace. The metallized trace has a metallized layer and an insulation layer. The metallized layer has a high melting point metal component and a low melting point metal component, the high melting point metal component and the low melting point metal component being diffusion bonded together. The insulation layer is formed simultaneously with the metallized layer to cover an outer surface of the metallized layer. The electronic component is electrically connected to the metallized layer.
摘要翻译： 电子设备包括基板和电子部件。 衬底具有金属化迹线。 金属化迹线具有金属化层和绝缘层。 金属化层具有高熔点金属成分和低熔点金属成分，高熔点金属成分和低熔点金属成分被扩散接合在一起。 绝缘层与金属化层同时形成以覆盖金属化层的外表面。 电子部件电连接到金属化层。
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公开(公告)号：US20110278351A1
公开(公告)日：2011-11-17
申请号：US12777476
申请日：2010-05-11
CPC分类号： B23K1/0016 , B23K1/20 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/81007 , H01L2224/81191 , H01L2224/81193 , H01L2224/8122 , H01L2224/81222 , H01L2224/81355 , H01L2224/81375 , H01L2224/81395 , H01L2224/81411 , H01L2224/81416 , H01L2224/81594 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81686 , H01L2224/81711 , H01L2224/81799 , H01L2224/83222 , H01L2924/00011 , H01L2924/01029 , H01L2924/01322 , H01L2924/14 , H05K3/3494 , H05K2203/101 , H01L2924/01082 , H01L2924/00014 , H01L2924/0105 , H01L2924/00012 , H01L2924/01083 , H01L2924/01047 , H01L2924/01026 , H01L2924/053 , H01L2924/00 , H01L2224/81805
摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages.
摘要翻译： 本公开涉及制造微电子封装的领域，其中包含分布在载体材料内的磁性颗粒的磁性颗粒附着材料可用于实现微电子部件之间的附着。 磁性颗粒附着材料可能暴露于磁场，通过磁性颗粒附着材料内的磁性颗粒的振动，可以将焊料材料加热到回流温度，以附着微电子封装的微电子部件。
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公开(公告)号：US09516749B2
公开(公告)日：2016-12-06
申请号：US14412395
申请日：2013-02-21
发明人： Yoshiyuki Wada , Tadahiko Sakai , Koji Motomura
IPC分类号： H05K7/00 , H05K1/09 , H01L23/14 , H01L23/498 , H05K3/32 , H01L23/00 , G06K19/077 , H01L21/48 , H01L25/065 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/12 , G02F1/13
CPC分类号： H05K1/097 , G02F1/1303 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/12 , H05K3/321 , H05K2201/0108 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012 , H01L2924/01048 , H01L2224/81 , H01L2224/11 , H01L2924/00
摘要： Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.
摘要翻译： 公开了一种电子部件安装结构，包括：基板，形成在基板的表面上的导电布线图案和具有外部端子的电子部件，并且在包括端子接头的安装位置处放置在基板的表面上 导电布线图案的位置。 外部端子在端子接合位置处连接到导电布线图案，使得外部端子嵌入导电布线图案中。 因此，与仅将导电布线图案的表面上的电子部件的外部端子与导体布线图案接合而得到的外部端子与导电布线图案的接合部可以具有高的强度。
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公开(公告)号：US20150163903A1
公开(公告)日：2015-06-11
申请号：US14412395
申请日：2013-02-21
发明人： Yoshiyuki Wada , Tadahiko Sakai , Koji Motomura
CPC分类号： H05K1/097 , G02F1/1303 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/12 , H05K3/321 , H05K2201/0108 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012 , H01L2924/01048 , H01L2224/81 , H01L2224/11 , H01L2924/00
摘要： Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.
摘要翻译： 公开了一种电子部件安装结构，包括：基板，形成在基板的表面上的导电布线图案和具有外部端子的电子部件，并且在包括端子接头的安装位置处放置在基板的表面上 导电布线图案的位置。 外部端子在端子接合位置处连接到导电布线图案，使得外部端子嵌入导电布线图案中。 因此，与仅将导电布线图案的表面上的电子部件的外部端子与导体布线图案接合而得到的外部端子与导电布线图案的接合部可以具有高的强度。
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