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公开(公告)号：US09147628B2
公开(公告)日：2015-09-29
申请号：US13535052
申请日：2012-06-27
IPC分类号： H01L23/495 , H01L21/60 , H01L23/31 , H01L23/538 , H01L21/56 , H01L23/00
CPC分类号： H01L23/3135 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/5389 , H01L24/05 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L24/85 , H01L24/96 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/05184 , H01L2224/05187 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05638 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05684 , H01L2224/211 , H01L2224/24011 , H01L2224/24137 , H01L2224/245 , H01L2224/2518 , H01L2224/27318 , H01L2224/291 , H01L2224/29116 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32225 , H01L2224/40095 , H01L2224/40105 , H01L2224/40227 , H01L2224/40247 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45499 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48476 , H01L2224/48499 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48638 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48684 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48738 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48784 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48838 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48884 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83815 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85815 , H01L2224/92136 , H01L2224/92137 , H01L2224/92247 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/01022 , H01L2924/01073 , H01L2924/01044 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/0498 , H01L2924/0496 , H01L2924/0474 , H01L2924/0475 , H01L2924/0478 , H01L2924/0476 , H01L2924/0454 , H01L2924/0455 , H01L2924/0458 , H01L2924/0456 , H01L2924/00012 , H01L2924/01013 , H01L2924/01047 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01028 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/0509 , H01L2924/01006 , H01L2924/01014 , H01L2924/0103 , H01L2924/01078 , H01L2924/0665 , H01L2924/01082 , H01L2924/01049 , H01L2924/01083 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2224/83205
摘要： In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a semiconductor module attached to the die paddle of the leadframe. The semiconductor module includes a first semiconductor chip disposed in a first encapsulant. The semiconductor module has a plurality of contact pads coupled to the first semiconductor chip. The semiconductor device further includes a plurality of interconnects coupling the plurality of contact pads with the plurality of leads, and a second encapsulant disposed at the semiconductor module and the leadframe.
摘要翻译： 根据本发明的实施例，半导体器件包括具有多个引线和管芯焊盘的引线框架和连接到引线框架的管芯焊盘的半导体模块。 半导体模块包括设置在第一密封剂中的第一半导体芯片。 半导体模块具有耦合到第一半导体芯片的多个接触焊盘。 半导体器件还包括将多个接触焊盘与多个引线耦合的多个互连以及设置在半导体模块和引线框架处的第二密封剂。
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公开(公告)号：US20140001615A1
公开(公告)日：2014-01-02
申请号：US13535052
申请日：2012-06-27
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/3135 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/5389 , H01L24/05 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L24/85 , H01L24/96 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/05184 , H01L2224/05187 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05638 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05684 , H01L2224/211 , H01L2224/24011 , H01L2224/24137 , H01L2224/245 , H01L2224/2518 , H01L2224/27318 , H01L2224/291 , H01L2224/29116 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32225 , H01L2224/40095 , H01L2224/40105 , H01L2224/40227 , H01L2224/40247 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45499 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48476 , H01L2224/48499 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48638 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48684 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48738 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48784 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48838 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48884 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83815 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85815 , H01L2224/92136 , H01L2224/92137 , H01L2224/92247 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/01022 , H01L2924/01073 , H01L2924/01044 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/0498 , H01L2924/0496 , H01L2924/0474 , H01L2924/0475 , H01L2924/0478 , H01L2924/0476 , H01L2924/0454 , H01L2924/0455 , H01L2924/0458 , H01L2924/0456 , H01L2924/00012 , H01L2924/01013 , H01L2924/01047 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01028 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/0509 , H01L2924/01006 , H01L2924/01014 , H01L2924/0103 , H01L2924/01078 , H01L2924/0665 , H01L2924/01082 , H01L2924/01049 , H01L2924/01083 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2224/83205
摘要： In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a semiconductor module attached to the die paddle of the leadframe. The semiconductor module includes a first semiconductor chip disposed in a first encapsulant. The semiconductor module has a plurality of contact pads coupled to the first semiconductor chip. The semiconductor device further includes a plurality of interconnects coupling the plurality of contact pads with the plurality of leads, and a second encapsulant disposed at the semiconductor module and the leadframe.
摘要翻译： 根据本发明的实施例，半导体器件包括具有多个引线和管芯焊盘的引线框架和连接到引线框架的管芯焊盘的半导体模块。 半导体模块包括设置在第一密封剂中的第一半导体芯片。 半导体模块具有耦合到第一半导体芯片的多个接触焊盘。 半导体器件还包括将多个接触焊盘与多个引线耦合的多个互连以及设置在半导体模块和引线框架处的第二密封剂。
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