公开(公告)号：WO2006056648A2

公开(公告)日：2006-06-01

申请号：PCT/FI2005/000506

申请日：2005-11-24

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/12

CPC classification number: H01L25/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/185 ,  H05K1/188 ,  H05K2201/10515 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/2804 ,  H01L2924/00

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating- material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6'), the contact terminals (7') of which face essentially towards the second surface of the insulating- material layer and which is connected electrically by its contact terminals (7') to the conductor structures contained in the electronic module, is attached to the first component (6), and the contact terminals (7, 7') are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7'). By means of the invention, it is possible to achieve a simple module construction comprising two component layers, which permits the manufacture of smaller electronic devices than previously.

Abstract translation: 该出版物公开了一种电子模块及其制造方法。 电子模块包括至少一个第一嵌入式部件（6），其接触端子（7）基本上朝向绝缘材料层（1）的第一表面，并且由其接触端子（7）电连接到 导体结构包含在电子模块中。 根据本发明，第二嵌入式部件（6'），其接触端子（7'）基本上朝向绝缘材料层的第二表面，并且其接触端子（7'）电连接到绝缘材料层 包含在电子模块中的导体结构附接到第一部件（6），并且接触端子（7,7'）借助导电材料连接到导体结构，导电材料布置在绝缘材料 在接触端子（7,7'）的位置处的孔（17）中的层。 通过本发明，可以实现包括两个组件层的简单的模块结构，这允许制造比以前更小的电子设备。

公开(公告)号：WO2005104636A1

公开(公告)日：2005-11-03

申请号：PCT/FI2005/000200

申请日：2005-04-27

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H05K1/18

CPC classification number: H01L23/5389 ,  H01L23/3677 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K1/0206 ,  H05K1/188 ,  H05K3/4046 ,  H05K3/4611 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  H01L2924/00

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7’), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.

Abstract translation: 该出版物公开了一种电子模块及其制造方法。 电子模块包括嵌入在绝缘材料层（1）中的至少一个部件（6），其具有第一接触表面，其中存在第一接触端子（7），部件（6）从该第一接触表面电连接 到电子模块中包含的导体结构。 另外，部件（6）具有与第一接触表面相对的第二接触表面，其中存在至少一个第二接触端子（7'），部件（6）从该接触端子电连接到包含的导体结构 在电子模块中。 借助于本发明，可以实现与现有技术相比节省空间的电子模块结构。

公开(公告)号：WO2009138560A1

公开(公告)日：2009-11-19

申请号：PCT/FI2009/050383

申请日：2009-05-11

Applicant: IMBERA ELECTRONICS OY ,  PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H01L21/60 ,  H01L23/538

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H05K1/182 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least a first layer (12) and a second layer (32), in such a way that at least the second layer (32) contains a second metal. The circuit module comprises contact elements between the contact areas (7) and the conductors (22) for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area (7), an intermediate layer (2), which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT1) , between the intermediate layer (2) and the contact area (7) is less that the surface area (APAD) of the contact area (7).

Abstract translation: 制造方法和电路模块包括绝缘体层（1）和绝缘体层（1）内部的至少一个部件（6），其包括接触区域（7），其材料包含第一金属。 在绝缘体层（1）的表面上是包括至少第一层（12）和第二层（32）的导体（22），至少第二层（32）包含第二层 金属。 电路模块包括接触区域（7）和用于形成电触点的导体（22）之间的接触元件。 接触元件在其接触区域（7）的材料的表面上包括含有第三金属的中间层（2），使得第一，第二和第三金属 是不同的金属，中间层（2）和接触区域（7）之间的接触表面积（ACONT1）小于接触区域（7）的表面积（APAD）。

公开(公告)号：WO2004089048A1

公开(公告)日：2004-10-14

申请号：PCT/FI2004/000195

申请日：2004-03-31

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K1/18

CPC classification number: H01L23/544 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611 ,  H01L2924/00

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract translation: 该出版物公开了一种用于制造电子模块的电子模块和方法，其中将组件（6）胶合（5）到导电层的表面，稍后形成导电层导电图案（14）。 在粘合组分（6）之后，在导电层的表面上形成或附着到导电层上的附着于导电层的组分（6）的绝缘材料层（1）。 在组件（6）的胶合之后，还制成馈通，通过该导通可以在导电层和部件的接触区域（7）之间形成电接触。 此后，导电图案（14）由导电层制成，其表面部件（6）被胶合。

公开(公告)号：WO2003065778A1

公开(公告)日：2003-08-07

申请号：PCT/FI2003/000064

申请日：2003-01-28

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto

Inventor： TUOMINEN, Risto

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

Abstract: This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base. Thus, the base structure is more or less manufactured around the semiconductor component. According to the invention, first of all at least one conductive pattern and through holes for the semiconductor components are made in the base, After this, the semiconductor components are placed in the holes in alignment with the conductive pattern. The semiconductor components are attached to the structure of the base and one or more conductive pattern layers are made in the base in such a way that at least one conductive pattern forms an electrical contact with the contact areas of the surface of the semiconductor component.

Abstract translation: 本公开公开了一种方法，其中形成电子电路的一部分的半导体部件或其至少一部分的半导体部件在基座的制造期间嵌入在诸如电路板的基座中。 因此，基本结构或多或少围绕半导体部件制造。 根据本发明，首先在基底中形成至少一个导电图案和用于半导体部件的通孔，之后，将半导体部件放置在与导电图案对准的孔中。 半导体部件附接到基底的结构，并且在基底中制造一个或多个导电图案层，使得至少一个导电图案与半导体部件的表面的接触区域形成电接触。

公开(公告)号：WO2006134217A1

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000208

申请日：2006-06-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

Abstract translation: 该出版物公开了一种制造电路板结构的方法。 根据该方法，制成导体图案（13），并且在其中形成用于组件（16）电触点的接触开口。 之后，组件（16）相对于导体图案（13）被附接，使得部件的接触区域或接触凸块靠近接触开口。 之后，将导电材料引入到接触开口中，以便在导体图案（13）和部件（16）之间形成电接触。

公开(公告)号：WO2004077902A1

公开(公告)日：2004-09-10

申请号：PCT/FI2004/000101

申请日：2004-02-25

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K1/18

CPC classification number: H05K1/188 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/4611 ,  H05K3/4691 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract translation: 一种电子模块和一种电子模块的制造方法，其中使用安装基座，其在绝缘材料层的表面上包括绝缘材料层（1）和导电层。 导电层还覆盖部件（6）的安装空腔。 将部件（6）设置在安装空腔中，使得接触区面向导电层，并且在部件（6）和导电层的接触区之间形成电接触。 之后，导电图案（14）由组件（6）所附着的导电层形成。

公开(公告)号：WO2003065779A1

公开(公告)日：2003-08-07

申请号：PCT/FI2003/000065

申请日：2003-01-28

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto

Inventor： TUOMINEN, Risto

IPC: H05K1/18

CPC classification number: H05K1/0218 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H05K1/185 ,  H05K1/188 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/09981 ,  H05K2201/10674 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

Abstract: This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. According to the invention, through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film. After this, the final hardening of the polymer film is carried out.

Abstract translation: 该出版物公开了一种方法，其中形成电子电路的一部分的半导体元件或其至少一部分的半导体元件在基座的制造期间嵌入在诸如电路板的基座中，当基部结构的一部分 就像它一样，在半导体元件周围制造。 根据本发明，用于半导体部件的通孔形成在基座中，使得孔在底座的第一和第二表面之间延伸。 在制作孔之后，将聚合物膜分散在基底结构的第二表面上，使得聚合物膜也从基底的第二表面的一侧覆盖由半导体部件制成的通孔 结构体。 在硬化之前或在聚合物膜部分硬化之后，将半导体部件从基底的第一表面的方向放置在基底中制成的孔中。 将半导体部件压在聚合物膜上，使得它们粘附到聚合物膜上。 之后，进行聚合物膜的最终硬化。

公开(公告)号：WO2006134220A1

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000211

申请日：2006-06-16

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/18 ,  H05K3/24

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/0206 ,  H05K1/111 ,  H05K1/187 ,  H05K3/205 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).

Abstract translation: 该出版物公开了一种用于制造电路板结构的方法。 该结构包括导体图案（3）和由绝缘材料层（10）围绕的至少一个部件（6），其通过接触凸块（5）附接到绝缘材料层。 根据本发明，在组件（6）通过接触凸块（5）附接到导体图案（3）之前，在导体图案（3）的表面上形成接触凸块（5）。 安装后，部件（6）被绝缘材料层（10）包围。

公开(公告)号：WO2005125298A3

公开(公告)日：2005-12-29

申请号：PCT/FI2005/000274

申请日：2005-06-13

Applicant: IMBERA ELECTRONICS OY ,  IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

Inventor： IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/538

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6) , which is connected electrically to a conductor-pattern layer (14) . In the method contact openings (17) are made in the conductor layer (4) , the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6) . After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17) , and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is provided that connects the component (6) to the conductor layer (4) . After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14) .