公开(公告)号：WO2009138560A1

公开(公告)日：2009-11-19

申请号：PCT/FI2009/050383

申请日：2009-05-11

Applicant: IMBERA ELECTRONICS OY ,  PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H01L21/60 ,  H01L23/538

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H05K1/182 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least a first layer (12) and a second layer (32), in such a way that at least the second layer (32) contains a second metal. The circuit module comprises contact elements between the contact areas (7) and the conductors (22) for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area (7), an intermediate layer (2), which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT1) , between the intermediate layer (2) and the contact area (7) is less that the surface area (APAD) of the contact area (7).

Abstract translation: 制造方法和电路模块包括绝缘体层（1）和绝缘体层（1）内部的至少一个部件（6），其包括接触区域（7），其材料包含第一金属。 在绝缘体层（1）的表面上是包括至少第一层（12）和第二层（32）的导体（22），至少第二层（32）包含第二层 金属。 电路模块包括接触区域（7）和用于形成电触点的导体（22）之间的接触元件。 接触元件在其接触区域（7）的材料的表面上包括含有第三金属的中间层（2），使得第一，第二和第三金属 是不同的金属，中间层（2）和接触区域（7）之间的接触表面积（ACONT1）小于接触区域（7）的表面积（APAD）。

公开(公告)号：WO2004089048A1

公开(公告)日：2004-10-14

申请号：PCT/FI2004/000195

申请日：2004-03-31

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K1/18

CPC classification number: H01L23/544 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611 ,  H01L2924/00

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract translation: 该出版物公开了一种用于制造电子模块的电子模块和方法，其中将组件（6）胶合（5）到导电层的表面，稍后形成导电层导电图案（14）。 在粘合组分（6）之后，在导电层的表面上形成或附着到导电层上的附着于导电层的组分（6）的绝缘材料层（1）。 在组件（6）的胶合之后，还制成馈通，通过该导通可以在导电层和部件的接触区域（7）之间形成电接触。 此后，导电图案（14）由导电层制成，其表面部件（6）被胶合。

公开(公告)号：WO2006134217A1

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000208

申请日：2006-06-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

Abstract translation: 该出版物公开了一种制造电路板结构的方法。 根据该方法，制成导体图案（13），并且在其中形成用于组件（16）电触点的接触开口。 之后，组件（16）相对于导体图案（13）被附接，使得部件的接触区域或接触凸块靠近接触开口。 之后，将导电材料引入到接触开口中，以便在导体图案（13）和部件（16）之间形成电接触。

公开(公告)号：WO2004077902A1

公开(公告)日：2004-09-10

申请号：PCT/FI2004/000101

申请日：2004-02-25

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K1/18

CPC classification number: H05K1/188 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/4611 ,  H05K3/4691 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract translation: 一种电子模块和一种电子模块的制造方法，其中使用安装基座，其在绝缘材料层的表面上包括绝缘材料层（1）和导电层。 导电层还覆盖部件（6）的安装空腔。 将部件（6）设置在安装空腔中，使得接触区面向导电层，并且在部件（6）和导电层的接触区之间形成电接触。 之后，导电图案（14）由组件（6）所附着的导电层形成。

公开(公告)号：WO2007107630A1

公开(公告)日：2007-09-27

申请号：PCT/FI2007/050141

申请日：2007-03-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri ,  IIHOLA, Antti

Inventor： TUOMINEN, Risto ,  PALM, Petteri ,  IIHOLA, Antti

IPC: H05K1/18

CPC classification number: H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M55/025 ,  F02M69/465 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/02 ,  H05K1/185 ,  H05K3/108 ,  H05K3/181 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.

Abstract translation: 用于制造包含部件的电路板的方法和包含部件的电路板。 本发明基于第一制造（101-102或101-103）中间产品，该中间产品包含设置在绝缘体层内部的电路板和部件的绝缘体层，使得接触 部件的元件面向中间产品的表面。 之后，将中间产品转移到电路板生产线上，在该电路板生产线上，在中间产品的一侧或两侧上制造合适数量的导电图案层，如果需要，制造绝缘体层（104） 当制造第一导电图案层时，导体材料与部件的接触元件形成电接触。 或者，阶段（101-105）也可以在单个生产线上执行。

公开(公告)号：WO2006134216A2

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000207

申请日：2006-06-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H05K20060101 ,  H05K1/18 ,  H05K3/20 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil. A component (9) is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern (6).

Abstract translation: 本公开公开了一种制造电路板结构的方法。 在该方法中，制造导体层，其在导体箔的表面上包括导体箔（2）和导体图案（6）。 将部件（9）附接到导体层并且导体层变薄，使得导体层的导体材料从导体图案（6）的外部移除。

公开(公告)号：WO2006013230A3

公开(公告)日：2006-02-09

申请号：PCT/FI2005/000352

申请日：2005-08-04

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H01L25/065 ,  H01L23/538

Abstract: A method for manufacturing a circuit-board layer on a base surface (2), which base surface (2) includes conductor patterns (19). The circuit-board layer being manufactured comprises a conductor-pattern layer (14), an insulating layer (1), and at least one component (6) inside the insulating-material layer (1). According to the invention, the component (6) is attached to the conductor layer (4), the conductor layer (4) is aligned relative to the base surface (2) attached with the aid of an insulating material (1) to the base surface (2). An insulating-material layer (1) is thus formed between the conductor layer (4) and the base surface (2), on which the said at least one component (6) is located. Electrical contacts are formed between the contact areas (7) of the component (6) and the conductor layer (4), in such a way that contact openings (17) are opened at the positions of the contact areas (7) of the component (6) and conductive material is made in the contact openings (17). The conductor layer (4) is patterned to form a conductor-pattern layer (14), and at least one via (20) is made between the conductor- pattern layer (14) and the conductor patterns (19) of the base surface (2).

公开(公告)号：WO2005125298A2

公开(公告)日：2005-12-29

申请号：PCT/FI2005/000274

申请日：2005-06-13

Applicant: IMBERA ELECTRONICS OY ,  IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

Inventor： IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

IPC: H05K13/00

CPC classification number: H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83385 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12044 ,  H05K1/188 ,  H05K3/025 ,  H05K2203/1469 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Abstract translation: 电子模块的制造方法，该电子模块包括与导体图案层（14）电连接的部件（6）。 在该方法中，接触开口（17）制成在导体层（4）中，其相互位置对应于部件（6）的接触区域（7）的相互位置。 之后，组件（6）和导体层（4）相对于彼此对齐，使得部件（6）的接触区域（7）到达接触开口（17）的位置， ，并且元件（6）被固定。 此后，至少在部件（6）的接触开口（17）和接触区域（7）中，制造将部件（6）连接到导体层（4）的导体材料。 在制作接触之后，将导体层（4）图案化以形成导体图案层（14）。

公开(公告)号：WO2006134220A1

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000211

申请日：2006-06-16

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/18 ,  H05K3/24

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/0206 ,  H05K1/111 ,  H05K1/187 ,  H05K3/205 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/81 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2224/0401

Abstract: This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).

Abstract translation: 该出版物公开了一种用于制造电路板结构的方法。 该结构包括导体图案（3）和由绝缘材料层（10）围绕的至少一个部件（6），其通过接触凸块（5）附接到绝缘材料层。 根据本发明，在组件（6）通过接触凸块（5）附接到导体图案（3）之前，在导体图案（3）的表面上形成接触凸块（5）。 安装后，部件（6）被绝缘材料层（10）包围。

公开(公告)号：WO2005125298A3

公开(公告)日：2005-12-29

申请号：PCT/FI2005/000274

申请日：2005-06-13

Applicant: IMBERA ELECTRONICS OY ,  IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

Inventor： IIHOLA, Antti ,  JOKELA, Timo ,  PALM, Petteri ,  TUOMINEN, Risto

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/538

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6) , which is connected electrically to a conductor-pattern layer (14) . In the method contact openings (17) are made in the conductor layer (4) , the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6) . After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17) , and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is provided that connects the component (6) to the conductor layer (4) . After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14) .