公开(公告)号：EP1386356A2

公开(公告)日：2004-02-04

申请号：EP02713638.1

申请日：2002-02-21

Applicant: Intel Corporation

Inventor： KUBOTA, Jiro ,  TAKAHASHI, Kenji

IPC: H01L23/485 ,  H01L21/60 ,  H01L21/603

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/1607 ,  H01L2224/75252 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/24 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A flip chip method of joining a chip and a substrate is described. A thermocompression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps (305) on the substrate against metal bumps (320) on the chip. The chip is rapidly heated from its non-native side by a pulse heater (415) in the head (410) of the bonder until the re-flow temperature of the solder bumps (305) is reached. Proximate with reaching the re-flow temperature at the solder bumps (305), the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions (320) and joining. Metal caps (330) comprised of a noble metal such as palladium is applied to the surface of the metal bumps (320) to prevent the metal bumps (320) (which generally comprise a highly-conductive and highly-reactive metal such as copper) from oxidizing in the elevated temperatures just prior to and during the re-flow operation.

公开(公告)号：EP1035580A3

公开(公告)日：2003-12-03

申请号：EP00301805.8

申请日：2000-03-06

Applicant: Altera Corporation

Inventor： Anderson, Sidney Larry ,  Long, Jon ,  Fritz, Donald S.

IPC: H01L23/498 ,  H01L21/58 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L21/4853 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/16237 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/112 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/0401 ,  H01L2924/00012

Abstract: An integrated circuit package is constructed to potential reduce stress and damage to an integrated circuit die. A rigid transition medium (42) is attached using adhesive layers (38,40) and interfaces between a tape carrier (20) and the integrated circuit die (18). The integrated circuit package prevents damage such as die cracks and also enhances the service life of the packaged integrated circuit part.

公开(公告)号：EP1256144B1

公开(公告)日：2003-10-01

申请号：EP01911408.1

申请日：2001-01-31

Applicant: ROBERT BOSCH GMBH

Inventor： PREISSL, Reinhold

IPC: H01R12/04

CPC classification number: H01R12/57 ,  B60K2350/305 ,  H01R12/52 ,  H05K3/0014 ,  H05K3/182 ,  H05K3/308 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09118 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/1476

Abstract: Disclosed is a method which is used to simplify the contacting of printed circuit boards to a support which is preferably embodied as a cockpit module in a motor vehicle. According to the inventive method, the printed circuit board is initially connected to the conductors which are disposed on the support, whereby (preferably) various conductors arranged inside said vehicle are electroconductively connected to each other.

公开(公告)号：EP1005086B1

公开(公告)日：2003-09-03

申请号：EP99309372.3

申请日：1999-11-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Muramatsu, Shigetsugu, Shinko Elect. Ind. Co. Ltd. ,  Ogawa, Yoshihiko, Shinko Elect. Ind. Co. Ltd. ,  Kojima, Norio

IPC: H01L23/495 ,  H01L23/498

CPC classification number: H05K3/4007 ,  H01L23/3114 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49861 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/28 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/10977 ,  H05K2203/1572 ,  H01L2224/05099

公开(公告)号：EP0818946B1

公开(公告)日：2003-06-25

申请号：EP97305014.9

申请日：1997-07-08

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsuno, Yukio

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K1/095 ,  H05K3/0094 ,  H05K3/181 ,  H05K3/247 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4685 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/0959 ,  H05K2203/072

公开(公告)号：EP1256144A1

公开(公告)日：2002-11-13

申请号：EP01911408.1

申请日：2001-01-31

Applicant: ROBERT BOSCH GMBH

Inventor： PREISSL, Reinhold

IPC: H01R12/04

CPC classification number: H01R12/57 ,  B60K2350/305 ,  H01R12/52 ,  H05K3/0014 ,  H05K3/182 ,  H05K3/308 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0187 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09118 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/1476

Abstract: Disclosed is a method which is used to simplify the contacting of printed circuit boards to a support which is preferably embodied as a cockpit module in a motor vehicle. According to the inventive method, the printed circuit board is initially connected to the conductors which are disposed on the support, whereby (preferably) various conductors arranged inside said vehicle are electroconductively connected to each other.

公开(公告)号：EP1204307A3

公开(公告)日：2002-10-30

申请号：EP01125896.9

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R. ,  Krautheim, Thomas B.

IPC: H05K3/36

CPC classification number: H05K3/4007 ,  H05K3/062 ,  H05K3/363 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/209 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/1184 ,  Y10S439/943 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: In conventional ETM (Etched Tri-Metal) circuit structures a pin connector in which the pin (30) is etched from the ETM substrate (16) and the mating cavity (32) is etched from the ETM substrate (18) to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin (30) serves as an anchor with the metallurgical bonds with solder (34) in the cavity (32) that forms on the copper surfaces (24,26) of the ETM circuit structures (16,18) to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.

公开(公告)号：EP1204302A1

公开(公告)日：2002-05-08

申请号：EP01410148.9

申请日：2001-11-05

Applicant: Cray Inc.

Inventor： Yatskov, Alexander I. ,  Hellriegel, Stephen V.R.

IPC: H05K1/11 ,  H05K3/36 ,  H01R12/12

CPC classification number: H01R12/62 ,  H05K1/11 ,  H05K3/243 ,  H05K3/28 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0949

Abstract: The flexible connector for high density circuit applications comprises a multi-layer flexible substrate (10) upon which are formed a plurality of contact pads (12), in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads (38) of similar size and configuration are formed on the surface of another device, i.e., circuit board (40), and provision made to align the contact pads (12) of the connector with those (38) of the circuit board (40). Micro-pads (20) are formed on the surface of the contact pads (12) on the connector such, that when the connector is brought into contact with the circuit board (40), and sufficient pressure is applied, the micro-pads (20) make actual electrical contact with the pads (38) of the circuit board (40). Since the total surface area in contact, namely the sum of the surface areas of the micro-pads (20), is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.

Abstract translation: 用于高密度电路应用的柔性连接器包括多层柔性基板（10），其上形成有特定应用所需的密度的多个接触焊盘（12）。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和结构的接触垫（38）形成在另一装置（即，电路板（40））的表面上，并且使连接器的接触焊盘（12）与电路板（38）的对准 （40）。 在连接器上的接触焊盘（12）的表面上形成微焊盘（20），当连接器与电路板（40）接触并施加足够的压力时，微焊盘 20）与电路板（40）的焊盘（38）实际电接触。 由于接触的总表面积，即微焊盘（20）的表面积的总和是连接器总面积的一小部分，所以即使在低接触面处也提供了大的压力 作为整体提供给连接器。

公开(公告)号：EP1197130A1

公开(公告)日：2002-04-17

申请号：EP00948103.7

申请日：2000-07-13

Applicant: International Business Machines Corporation ,  IBM United Kingdom Limited

Inventor： LAUFFER, John ,  RUSSELL, David

IPC: H05K1/16 ,  H05K3/46 ,  H01F41/04

CPC classification number: H01F41/041 ,  H01F17/0033 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/086 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1453 ,  H05K2203/1461 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975

Abstract: Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated into electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material (20). The dielectric (20) is photoimaged and etched to provide one or more recesses or openings (26) for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric (20) is described as well as the method of manufacturing the same.

公开(公告)号：EP0657932B1

公开(公告)日：2001-09-05

申请号：EP94119486.2

申请日：1994-12-09

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Tomura, Yoshihiro ,  Bessho, Yoshihiro ,  Hakotani, Yasuhiko

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/181 ,  H05K3/243 ,  H05K3/321 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0577 ,  H05K2203/167 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00