公开(公告)号：EP0549619B1

公开(公告)日：1994-12-28

申请号：EP91915510.1

申请日：1991-09-06

Applicant: ROBERT BOSCH GMBH

Inventor： ZIMMERMANN, Herbert ,  STEINLE, Klaus ,  SPITZENBERGER, Kurt ,  STECHER, Guenther

IPC: H05K3/36 ,  H01L23/538

CPC classification number: H01L23/5385 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/321 ,  H05K3/4053 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09481 ,  H05K2201/09909 ,  H01L2924/00

Abstract: A process is disclosed for producing a circuit having a first circuit plane made of a ceramic substrate (1) provided for example with thick film structures and corresponding strip conductors with contact surface (4). The process allows the ceramic substrate to be bonded to a second circuit plane made of a greentape substrate (3). Vias (7) are formed in the greentape substrate and filled with conducting contact material (6), forming complementary contact surfaces (5) to the contact surfaces (4) on the ceramic substrate (1). The contact surfaces (4, 5) are printed with a bonding layer (8) (for example silver or copper paste). The ceramic substrate (1) and/or a lower side of the greentape-substrate is printed with glass ridges (10).

公开(公告)号：EP0624053A2

公开(公告)日：1994-11-09

申请号：EP94105413.2

申请日：1994-04-07

Applicant: SONY CORPORATION

Inventor： Goodman,Thomas W. c/o Sony Corporation ,  Fujita, Hiroyuki, c/o Sony Corporation ,  Murakami, Yoshikazu, c/o Sony Corporation ,  Murphy, Arthur T.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/044 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method of mounting an electronic part (10) having a terminal portion (12) on a board (20) on which a circuit including a connection portion (22) is formed. It includes a process of forming a conductive layer (14) on the surface of the terminal portion (12); a process of forming, on the surface of the connection portion (22), a conductive layer (24) having a melting point different from that of the conductive layer (14) formed on the surface of the terminal portion (12); and a process of melting the conductive layer (24) having a low melting point in such a state that the conductive layer (14) of the terminal portion (12) is contacted with the conductive layer (24) of the connection portion (22), thereby fusing the conductive layer (24) having a low melting point onto the conductive layer (14) having a high melting point. Moreover, the method includes a process of forming a projecting portion (16) made of a heat-resisting material on the surface of the electronic part (10) around the terminal portion (12), and forming a conductive layer (14,24) on at least one surface of the connection portion (22) or the terminal portion (12); and a process of electrically connecting the connection portion (22) with the terminal portion (12) and allowing the projecting portion (16) to be contacted with the surface of the board (20).

Abstract translation: 安装在电子部件（10），其具有在其上的电路包括一个连接部分（22）形成在板（20）的终端部分（12）的方法。 它包括形成终端部分的表面上的导电层（14）（12）的过程; 形成，所述连接部分（22），导电层（24）的表面上具有从导电层的事实不同的熔点的过程（14）形成在所述端子部（12）的表面上; 和熔化具有寻求状态DASS低熔点导电层（24）的处理模具的终端部分（12）的导电层（14）与所述连接部分的导电层（24）接触（22） ，从而熔化具有高熔点的导电层（24），其具有低的熔点至导电层（14）。 更上方，该方法包括形成围绕所述端子部的电子部件（10）的表面上制成的耐热材料的一个突出部分（16）（12），并形成导电层的工序（14,24） 连接部（22）或所述端子部的至少一个表面上（12）; 和电的连接过程与终端部分（12）的连接部（22）并允许所述突出部（16）与所述板（20）的表面接触。

公开(公告)号：EP0575806A2

公开(公告)日：1993-12-29

申请号：EP93109124.3

申请日：1993-06-07

Applicant: International Business Machines Corporation

Inventor： Cipolla, Thomas Mario ,  Coteus, Paul William ,  Damianakis, Ioannis ,  Johnson, Glen Walden ,  Matthew, Linda Carolyn ,  Mok, Lawrence Shungwei ,  Ledermann, Peter Gerard

IPC: H01L25/065

CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H01L2924/00

Abstract: This invention relates to three dimensional packaging of integrated circuit chips (306) into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate (300) having a plurality of conductors (316) one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures (318) can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate (302) surface or the pin-like structures can be adapted for insertion into apertures (320) in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.

Abstract translation: 本发明涉及集成电路芯片三维封装成堆叠以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在该侧面延伸的至少一个侧面上具有电导体的第一基板的突起形成。 或者，销状结构可以由导体形成，该导体从第一衬底的边缘的两侧悬臂相对，两侧的导体对准并间隔开第一衬底厚度。 这些空间包含焊料并形成焊料加载的针状结构。 针状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些立方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与立方体的相对侧紧密接触。

公开(公告)号：EP0521982A1

公开(公告)日：1993-01-13

申请号：EP91906887.0

申请日：1991-03-21

Applicant: FERGUSON LIMITED

Inventor： ROWE, John Michael

IPC: H05K3 ,  H05K1

CPC classification number: H05K1/116 ,  H05K3/0094 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2203/044

Abstract: Afin d'empêcher que les trous (3) non équipés d'éléments de circuit et qui le seront ultérieurement soient obstrués par la soudure (5), une petite bande (6) résistant à la soudure est imprimée sur le conducteur (2) de façon à ce qu'elle traverse diamétralement le trou (3).

公开(公告)号：EP0295914A3

公开(公告)日：1990-09-26

申请号：EP88305507.1

申请日：1988-06-16

Applicant: Hewlett-Packard Company

Inventor： Karnezos, Marcos

IPC: H01R23/72 ,  H05K1/11 ,  H01L23/48 ,  H05K3/40 ,  H01R13/22

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01R12/714 ,  H01R13/2464 ,  H05K1/113 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10719 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An interconnect structure for electrically coupling conductive paths (14′,28′) on two adjacent, rigid substrates, such as PC boards or IC chips, comprises a number of buttons (16) formed on a first substrate (12), and a number of contacts (28) formed on a second substrate (26). The buttons are elastically deformable, and include a resilient core (18) made from an organic material such as polyimide, and a metallic coating (20) formed over the core. The two substrates are compressed (F) between mounting plates such that the buttons (16) are pressed against the contacts (28) to make electrical contact.

公开(公告)号：EP0248566A3

公开(公告)日：1990-01-31

申请号：EP87304510.8

申请日：1987-05-21

Applicant: AT&T Corp.

Inventor： LoVasco, Francis ,  Oien, Michael Ackman

IPC: H01L21/58 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/81024 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/0379 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate (31, 32). The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other (34, 35). The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint (36, 37). The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.

公开(公告)号：EP0341629A2

公开(公告)日：1989-11-15

申请号：EP89108245.5

申请日：1989-05-08

Applicant: HITACHI, LTD.

Inventor： Maeno, Yutaka ,  Hashiguchi, Seiji ,  Hasegawa, Keiichi ,  Hachiya, Masaaki ,  Ueyama, Shingo

IPC: H05K13/04 ,  H05K13/08

CPC classification number: H05K1/111 ,  H05K1/0268 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3452 ,  H05K13/04 ,  H05K13/0465 ,  H05K13/08 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A printed circuit board is provided on its surface with position detecting patterns (5) at specific positions with respect to conductor patterns (4) for connecting leads of an integrated circuit (1). The position of the lead connecting conductor patterns (4) is obtained in indirect manner through the calculation from positional information on the position detecting patterns (5).

Abstract translation: 一种印刷电路板，用于连接集成电路（1）的引线设置在其表面上具有在特定位置上的位置检测图案（5）相对于导体图案（4）。 所述引线连接导体图案（4）的位置是通过从计算的位置信息获得的间接方式在位置检测图案（5）。

公开(公告)号：EP0122619A3

公开(公告)日：1985-07-10

申请号：EP84104174

申请日：1984-04-13

Applicant: Polyonics Corporation

Inventor： Hoover, Merwin F. ,  Salamone, Ann B. ,  Vandebult, Jan

IPC: H01L27/01 ,  H05K03/12 ,  H05K03/46 ,  H05K03/38

CPC classification number: H05K3/182 ,  H01L21/702 ,  H05K1/162 ,  H05K1/165 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/09909

Abstract: A multilayered composite product including a base (12), a patterned cured resin (24) bonded to the base and an applied metal layer (26) selectively bonded to the patterned cured resin. The product is useful as an electrical circuit (10).

公开(公告)号：EP2134147B1

公开(公告)日：2018-08-08

申请号：EP09161821.5

申请日：2009-06-03

Applicant: Valeo Equipements Electriques Moteur

Inventor： Mandion, Thierry ,  Chemin, Michaël

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/3421 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10166 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP3291654A1

公开(公告)日：2018-03-07

申请号：EP17170345.7

申请日：2017-05-10

Applicant: Robert Bosch GmbH

Inventor： Zweigle, Peter

IPC: H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K3/32 ,  H01R12/71

CPC classification number: H05K1/0256 ,  H01R12/712 ,  H05K1/111 ,  H05K3/325 ,  H05K5/0082 ,  H05K2201/0761 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09718 ,  H05K2201/09909 ,  H05K2201/09972

Abstract: Ein Steuermodul (10) für ein Fahrzeug umfasst eine Leiterplatte (12), die elektronische Komponenten (14) zum Steuern wenigstens eines Aktuators (32) trägt, einen auf die Leiterplatte (12) aufgetragenen Damm (24), der die elektronischen Komponenten (14) umgibt; eine Vergussmasse (26), in die die elektronischen Komponenten (14) eingebettet sind und die innerhalb des Damms (24) vergossen ist; und elektrische Kontaktflächen (28) für den wenigstens einen Aktuator (32). Zwischen die elektrischen Kontaktflächen (28) ist eine Trennwand (30) auf die Leiterplatte (12) aufgetragen.

Abstract translation: 一种用于车辆的控制模块（10）包括用于控制至少一个致动器（32）的印刷电路板（12），所述电子元件（14），施加一个在印刷电路板（12）的挡板（24）（电子部件14 ）包围; 其中嵌入有电子部件（14）并且封装在所述坝（24）内的灌注混合物（26）; 和用于所述至少一个致动器（32）的电接触表面（28）。 在电接触表面（28）之间，分隔壁（30）被施加到电路板（12）。