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公开(公告)号：EP1981317A2
公开(公告)日：2008-10-15
申请号：EP08011580.1
申请日：1996-12-19
Applicant: IBIDEN CO., LTD.
Inventor： Mori, Yoji , Kawamura, Yoichiro
CPC classification number: H05K1/0201 , H05K1/0224 , H05K1/0253 , H05K1/115 , H05K1/116 , H05K3/4602 , H05K2201/062 , H05K2201/093 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09681 , H05K2201/09727 , H05K2201/0979 , H05K2201/09881
Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
Abstract translation: 本发明提供一种印刷线路板，该印刷线路板中，在作为光电晶体管的焊盘周围存在的开口以不与焊盘重叠的方式配置，焊盘周围的开口部的面积与其他开口的面积相等， 其填充在每个开口中或者在整个印刷线路板中均匀化，并且提供从每个开口溢出的树脂量，或者当树脂被填充在每个开口中或者被均匀化时。 根据这样的印刷布线板，当在印刷布线板上形成的层间绝缘板上提供的电路图案和导体焊盘通过布置开口而连接时，可以实现可靠的印刷布线板，其中可靠地连接而不会导致断开 存在于导体焊盘周围，使得其不与导体焊盘重叠并且实质上均衡填充在导体焊盘周围的开口中的树脂量和填充在另一个开口中的树脂量。
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公开(公告)号：EP1931183A2
公开(公告)日：2008-06-11
申请号：EP07023165.9
申请日：2007-11-29
Applicant: Hitachi, Ltd.
Inventor： Yokozuka, Takehide , Ikeda, Ukyo , Harada, Masahide , Yoshinari, Hideto
CPC classification number: H05K1/144 , H01L2924/0002 , H05K1/056 , H05K3/328 , H05K3/3447 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/0979 , H05K2201/1028 , H05K2201/10303 , H05K2201/10318 , H05K2201/10856 , H05K2201/10924 , H05K2203/0285 , H01L2924/00
Abstract: An electronic device of the present invention has a pair of joint pieces 2a, 2b formed on one end of its body and extending to both sides of the body. Both of these joint pieces 2a, 2b are connected to one substrates 5, 7 to improve the joining strength between a lead frame connector 1 and the substrate and ensure the reliability of electrical connection between the lead frame connector 1 and the substrate 5,7.
Abstract translation: 本发明的电子装置具有形成在其主体一端并延伸到主体两侧的一对接合片2a，2b。 这两个接合片2a，2b都连接到一个基板5,7，以提高引线框连接器1和基板之间的接合强度并确保引线框连接器1和基板5,7之间的电连接的可靠性。
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13.发明公开CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权赫尔辛基（KERAMISCHE ELEKTRONISCHE KOMPONENTE UND VERFAHREN ZUR IHRER HERSTELLUNG）
公开(公告)号：EP1921904A1
公开(公告)日：2008-05-14
申请号：EP06766615.6
申请日：2006-06-13
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： MATSUBARA, Daigo , CHIKAGAWA, Osamu
CPC classification number: H05K3/4007 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L2221/68345 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K1/0306 , H05K1/113 , H05K1/115 , H05K1/141 , H05K3/3436 , H05K3/4611 , H05K3/4629 , H05K2201/0367 , H05K2201/0979 , H05K2203/308 , Y10T29/49163 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A ceramic electronic component is provided which can realize a sufficient drop resistance strength even when terminal electrodes are formed at a higher density.
A ceramic electronic component 10 of the present invention has a ceramic laminate 11 composed of ceramic laminates 11A which are laminated to each other, first terminal electrodes 13 disposed in a peripheral portion of a bottom surface of the ceramic laminate 11, catch pad electrodes 15A provided in the ceramic laminate 11 to face the respective first terminal electrodes 13, and sets each including at least two first via hole conductors 16A and 16B, which electrically connect the first terminal electrodes 13 and the respective catch pad electrodes 15A.Abstract translation: 提供一种陶瓷电子部件，即使在以更高的密度形成端子电极时也能够实现足够的防滴落强度。 本发明的陶瓷电子部件10具有由彼此层叠的陶瓷层叠体11A构成的陶瓷层叠体11，设置在陶瓷层叠体11的底面的周边部的第一端子电极13，设置有保持垫电极15A 在陶瓷层叠体11中，面对各个第一端子电极13，并且每个包括至少两个电连接第一端子电极13和相应的焊盘电极15A的第一通孔导体16A和16B。
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公开(公告)号：EP1150551B1
公开(公告)日：2007-06-13
申请号：EP99973449.4
申请日：1999-11-17
Applicant: IBIDEN CO., LTD.
Inventor： HIROSE, Naohiro Ogaki-kita-kojou Ibiden K.K. , ITO, Hitoshi Ogaki-kita-kojou Ibiden K.K. , IWATA, Yoshiyuki Ogaki-kita-kojou Ibiden K.K. , KAWADE, Masanori Ogaki-kita-kojou Ibiden K.K. , YAZU, Hajime Ogaki-kojou Ibiden Kabushiki Kaisha
IPC: H05K1/11 , H01L23/498
CPC classification number: H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
Abstract: On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.
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公开(公告)号：EP1060646B1
公开(公告)日：2007-05-09
申请号：EP99909448.5
申请日：1999-03-05
Applicant: Obducat AB
Inventor： WIKSTRÖM, Bo
IPC: H05K1/16
CPC classification number: H05K1/167 , H01C17/006 , H01C17/2416 , H05K3/06 , H05K2201/0969 , H05K2201/09727 , H05K2201/0979 , H05K2203/105
Abstract: A method for manufacturing a resistor function in an electric conductor on the surface of a carrier, preferably a conductor on printed circuit boards, substrates and chips. By etching using an anisotropic etching technique, the conductor is provided with at least one portion which has a smaller cross-sectional area than the conductor surrounding the portion, the length and width of the portion being such that a predetermined resistance is obtained in the conductor. A resistor according to the invention is on both sides connected to a conductor on a carrier, such as a printed circuit board, a substrate or a chip. The resistor comprises a conductor portion positioned on the carrier and having a significantly smaller cross-sectional area than the conductor on both sides of the resistor.
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Patent Agency Ranking16.发明公开
公开(公告)号：EP1677582A2
公开(公告)日：2006-07-05
申请号：EP05027867.0
申请日：1996-12-19
Applicant: IBIDEN CO., LTD.
CPC classification number: H05K1/116 , H05K1/0201 , H05K1/0224 , H05K1/0253 , H05K1/115 , H05K3/4602 , H05K2201/062 , H05K2201/093 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09681 , H05K2201/09727 , H05K2201/0979 , H05K2201/09881 , Y10T29/49126 , Y10T428/24917
Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
Abstract translation: 印刷电路板，其中存在于作为光电二极管的焊盘周围的开口布置成使其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且设置从每个开口溢出的树脂量或当树脂在每个开口中填充或均匀时。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现其中安全连接不会导致断开的可靠的印刷线路板 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。
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17.发明公开Electronic package with strengthened conductive pad 审中-公开ElektronischesGehäusemitverstärktenleitendenKontaktflächen
公开(公告)号：EP1473977A2
公开(公告)日：2004-11-03
申请号：EP04250754.1
申请日：2004-02-12
Applicant: Endicott Interconnect Technologies, Inc.
Inventor： Alcoe, David
IPC: H05K1/11 , H01L23/498 , H01L23/485
CPC classification number: H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/15312 , H05K1/113 , H05K1/114 , H05K1/115 , H05K1/116 , H05K3/3426 , H05K3/4602 , H05K2201/09454 , H05K2201/09472 , H05K2201/09509 , H05K2201/0979 , H05K2201/10318
Abstract: An electronic package and information handling system utilizing same wherein the package substrate (11') includes an internally conductive layer (15') coupled to an external pad (13') and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.
Abstract translation: 一种利用其的电子封装和信息处理系统，其中封装衬底（11'）包括耦合到外部焊盘（13'）的内部导电层（15'），其尺寸足够大以基本上防止开裂，分离等 当垫受到约1.4克/平方密度或更大的拉伸压力时，
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公开(公告)号：EP1150551A4
公开(公告)日：2004-03-10
申请号：EP99973449
申请日：1999-11-17
Applicant: IBIDEN CO LTD
Inventor： HIROSE NAOHIRO , ITO HITOSHI , IWATA YOSHIYUKI , KAWADE MASANORI , YAZU HAJIME
CPC classification number: H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
Abstract: On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.
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公开(公告)号：EP0768813B1
公开(公告)日：2004-01-02
申请号：EP96402167.9
申请日：1996-10-11
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Tsuji, Hitoshi , Nishi, Koji
IPC: H05K1/02
CPC classification number: H05K1/0265 , H05K1/0206 , H05K1/115 , H05K3/42 , H05K2201/09572 , H05K2201/09672 , H05K2201/09781 , H05K2201/0979 , Y10S428/901 , Y10T428/24917
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20.发明公开
公开(公告)号：EP1219149A1
公开(公告)日：2002-07-03
申请号：EP00951739.2
申请日：2000-08-10
Applicant: Ford Motor Company
Inventor： ACHARI, Achyuta , LI, Delin , BAKER, Jay, Deavis , NATION, Brenda, Joyce , TRUBLOWSKI, John
CPC classification number: H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
Abstract: An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article (10) includes: a flexible dielectric substrate (12) having first and second edges 14/16, and a plurality of conductive circuit traces (18) arranged on or within the substrate, wherein each of the traces extends from proximate the first edge (14) to proximate the second edge (16). Each of the circuit traces (18) includes: a first connection feature (20) disposed proximate the first edge (14); a second connection feature (22) disposed proximate the second edge (16); and at least one third connection feature (24) disposed between the first and second edges (14/16). Each of the first, second, and third connection features (20/22/24) is a plated through hole, a plated blind via, or a mounting pad. This article (10) may be used to connect together the first and second circuits (50/60) using the first and second connection features (20/22), such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article (10) may be cut so as to present a set of third connection features (24) to which a new replacement circuit may be connected.
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