Abstract:
A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to incorporate a serpentine structure, which enables the length of the power line to be easily adjusted and results in the line being longer than a power line formed with a relatively straight structure. Accordingly, the length of the power line can be adjusted to take into account the respective impedances of the chip and the external source so as to suppress electromagnetic waves in the power line. This prevents the creation of noise, distortion of signals, damage to the semiconductor chip, and disconnection of the input interconnection thereof that are caused by the electromagnetic waves, so that product yields are thereby improved.
Abstract:
La présente invention est relative à un dispositif (20) d'interconnexion de faisceaux électriques qui comporte plusieurs cartes (34 à 38) embrochables de brassage et de connexion des faisceaux électriques ; le dispositif comporte en outre un circuit imprimé "principal" (28, 28b) équipé de connecteurs ou "slots" (29 à 33) conçus et agencés pour recevoir les cartes embrochables, ce circuit imprimé comportant plusieurs pistes (46) parallèles permettant chacune de mettre au même potentiel deux pistes (61 à 63, 68) ou ébauches (70 à 72) de pistes respectivement prévues sur deux cartes embrochables distinctes embrochées dans les connecteurs du circuit imprimé principal, chacune de ces pistes (46) parallèles étant en contact avec une broche (50, 150) respective de plusieurs connecteurs du circuit imprimé principal.
Abstract:
An object of the present invention is to prevent the damage of molding pins in an injection-molding die and to provide a secure deposit, thereby reducing circuit pitches to the limit. Pre-determined circuit patterns (3) of a conductive material are formed on both sides of a circuit board (2). A through hole (5) is formed on the circuit board (2) to carry electricity between the circuit patterns (3) on the both sides thereof. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns (3) and wide in a circuit extending direction.
Abstract:
A circuit board (200, 300, 400) design is disclosed that is useful in high speed differential signal applications uses either a via arrangement or a circuit trace exit structure. In the via arrangement, sets of differential signal pair vias (301, 303, 401, 402) and an associated ground (302) are arranged adjacent to each other in a repeating pattern. The differential signal vias (301, 303, 591) of each pair are spaced closer to their associated ground via (302a, 593a) than the spacing between the adjacent differential signal pair associated ground (302b, 593b) so that differential signal vias exhibit a preference for electrically coupling to their associated ground vias. The circuit trace exit structure involves the exit portions of the circuit traces (420, 550) of the differential signal vias (401, 402, 591) to follow a path where the traces then meet with and join to the transmission line portions (552) of the conductive traces.
Abstract:
A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a first slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. By virtue of their dimensions, spacing and dielectric filler, the conductive surfaces constitute a transmission line. A second slot, also with opposing surfaces, each of which also carry a conductive surface but which are spaced differently than the opposing surfaces of the first slot, provide a second transmission line but with a different impedance. The impedances between the two transmission lines are transformed by an impedance transition section of transmission line that is slot section the dimensions of which are tapered to meet the different slot dimensions of the two different transmission line segments.
Abstract:
The invention relates to a method for high-frequency tuning a high-frequency plug connector (1), comprising a printed circuit board (3) that has both contact points (21-28) for high-frequency contacts as well as contact points (31-38) for insulation displacement contacts. Each contact point (21-28) for the high-frequency contacts is connected to one respective contact point (31-38) for the insulation displacement contacts. Capacitive couplings, which cause a near-end crosstalk, occur between the high-frequency contacts. At least one first conductor path (46), which is connected on only one side to a contact point (26) of an electrical contact, is situated on the printed circuit board (3) that, together with at least one second conductor path (44), which is situated on and/or in the printed circuit board (3), forms a capacitor (C46). At least one frequency-dependent parameter of the device is measured, and this frequency-dependent parameter is compared to a set parameter and, according to on a difference between the two, the conductor path (46) that is contacted on one side is partially removed or completely separated.
Abstract:
Techniques for improved contact mapping in circuit devices are disclosed. In one particular exemplary embodiment, a technique may be realized as a circuit device comprising a circuit chip having a plurality of electrical contacts positioned at a surface of the circuit chip so as to form one or more channels at the surface, the one or more channels being substantially devoid of electrical contacts such that one or more corresponding channels are formed in a chip carrier for routing electrically conductive traces from one or more of the plurality of electrical contacts on a routing layer of the chip carrier.
Abstract:
An electrical connector for transferring a plurality of differential signals between electrical components (14, 16). The connector is made of modules (18) that have a plurality of pairs (104) of signal conductors (102) with a first signal path and a second signal path. Each signal path has a pair of contact sections (116) extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.
Abstract:
The invention relates to a method for suppressing disturbances during transmission on symmetrically operated high-frequency lines and to dispositions having such functionality. For suppressing such disturbances, the invention proposes to provide a field hindering or affecting source or material (100) within an area, which is influenced mainly by the magnetic and/or electric field caused by the even mode, for the selective attenuation of the even mode.