公开(公告)号：EP2194590A2

公开(公告)日：2010-06-09

申请号：EP10158437.3

申请日：1997-07-29

申请人： Nichia Corporation

发明人： SHIMIZU, Yoshinori ,  SAKANO, Kensho ,  NOGUCHI, Yasunobu ,  MORIGUCHI, Toshio

IPC分类号： H01L33/50 ,  C09K11/77 ,  H05B33/14 ,  G02B6/00

CPC分类号： H01L33/50 ,  C09K11/7767 ,  C09K11/7774 ,  G02B6/0023 ,  G02B6/0025 ,  G02B6/0051 ,  G02B6/0073 ,  H01J29/20 ,  H01L24/45 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/56 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2933/0091 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00012

摘要： A light emitting device is disclosed, comprising a mount, a plurality of light emitting components which emit visible light and mounted on said mount, a transparent material covering said light emitting components, and a phosphor contained in said transparent material and absorbing a part of light emitted by said light emitting components and emitting light having a longer main emission wavelength than the main emission peak of said light emitting components, wherein the main emission peak of said light emitting components is within the range from 400nm to 530nm, and wherein said mount comprises a material which is one of iron, copper, iron-containing copper, tin-containing copper and metalized ceramic.

摘要翻译： 公开了一种发光器件，其包括：安装件，发射可见光并且安装在所述安装件上的多个发光部件，覆盖所述发光部件的透明材料以及包含在所述透明材料中并且吸收一部分光的荧光体 由所述发光组件发射并发射具有比所述发光组件的主发射峰值更长的主发射波长的光，其中所述发光组件的主发射峰值在400nm至530nm的范围内，并且其中所述支架包括 铁，铜，含铁铜，含锡铜和金属化陶瓷中的一种的材料。

公开(公告)号：EP2143140A2

公开(公告)日：2010-01-13

申请号：EP08748729.4

申请日：2008-04-02

申请人： Danfoss Silicon Power GmbH

发明人： ULRICH, Holger ,  SENYILIZ, Teoman ,  EISELE, Ronald

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L21/48

CPC分类号： H01L21/565 ,  H01L23/4006 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a method for producing a rigid power module, comprising the following steps: a monolithic lead frame is produced; said lead frame is equipped with semiconductor components and optional passive components, and corresponding connections are bonded; the equipped lead frame is introduced into a pressing tool such that the uncovered lead frame is accessible; the lead frame is fastened within the tool by means of a mounting die; and a duroplastic compression molding material is pressed into the tool so as to envelop the equipped lead frame. Cavities are left in predetermined positions in the envelope of the power module during the enveloping process, and webs of the monolithic lead frame are cut out by means of punches that are introduced into the cavities such that electrically insulated islands of materials of the previously monolithic lead frame are created.

摘要翻译： 该方法涉及生产一体化的冲压网格。 冲孔格栅与半导体部件组装，可能的被动组装部件和粘合相应的连接。 预定位置处的凹槽在包封过程中保持在功率模块的包络中。 随后，通过插入凹槽中的安装模具，通过产生整体冲压网格的冲压网格材料的电绝缘岛，进行整体打孔格栅的切割。

公开(公告)号：EP2133828A2

公开(公告)日：2009-12-16

申请号：EP09007623.3

申请日：2009-06-09

申请人： Giesecke & Devrient GmbH

发明人： Barak, Renée-Lucia ,  Tarantino, Thomas ,  Drescher, Georg ,  Schröder, Sönke ,  Ojster, Albert ,  Griesmeier, Robert ,  Schürch, Uwe

IPC分类号： G06K19/077

CPC分类号： G06K19/077 ,  G06K19/07718 ,  H01L2224/48091 ,  H01L2924/01068 ,  H01L2924/00014

摘要： Die Erfindung betrifft Verfahren zum Einbauen eines Chipmoduls (3) in einen Chipkartenkörper (1). Gemäß einem ersten Aspekt der Erfindung wird das Chipmodul (3) aus einem Modulband (8) herausgetrennt, insbesondere mittels eines Stanzwerkzeugs ausgestanzt, in die Kavität (2) eines Chipkartenkörpers (1) eingesetzt und dort dauerhaft fixiert. Hierbei erfolgt das dauerhafte Fixieren des Chipmoduls (3) durch einen Zweikomponentenkleber. Eine Komponente (11) des Klebers wird in die Kavität (2) des Chipkartenkörpers (1) aufgetragen und die andere Komponente (10) auf das Modulband (8). Die beiden Komponenten kommen erst beim Einsetzen des herausgetrennten Chipmoduls (3) in die Kavität (2) in Kontakt und beginnen zu reagieren und auszuhärten. Es wird keine zusätzliche Hitze benötigt und somit erfolgt keine thermische Verformung des Chipkartenkörpers (1) und dadurch keine Beeinträchtigung der optischen Qualität der Kartenrückseite (4).

摘要翻译： 该方法包括将芯片模块（3）从模块化条带（8）分离。 分离的芯片模块插入智能卡主体（1）的空腔（2）中，其中空腔由塑料构成的销组成。 使用由两个粘合剂组分（10,11）组成的双组分粘合剂将插入的芯片模块耐久地固定在空腔中。 芯片模块在空腔中的耐用调整是通过机械接合进行的，其中智能卡主体在将芯片模块连接在空腔中时弯曲。 还包括用于包括智能卡主体的智能卡的独立权利要求。

公开(公告)号：EP1749315B1

公开(公告)日：2009-12-09

申请号：EP05786351.6

申请日：2005-05-04

申请人： S-Bond Technologies LLC

发明人： SMITH, Ronald, W. ,  REDD, Randall

IPC分类号： H01L23/485 ,  B23K1/06 ,  B23K1/20

CPC分类号： H01L24/10 ,  B23K35/262 ,  B23K35/264 ,  B23K35/266 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01064 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, or tantalum; between about 0.1 and 5% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); between about 0.01 and 1% by weight of gallium up to about 10% by weight of silver; up to about 2% by weight of magnesium; and a remainder consisting of tin, bismuth, indium, cadmium, or a mixture of two or more of these elements. The alloy enables low-temperature (less than about 180° C.) soldering within relatively narrow melting ranges (less than about 10° C.).

公开(公告)号：EP1758163B1

公开(公告)日：2009-09-30

申请号：EP06017528.8

申请日：2006-08-23

申请人： Henkel AG & Co. KGaA

发明人： Musa, Osama M. ,  Liu, Zhen

IPC分类号： H01L23/00

CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/73203 ,  H01L2224/81011 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

公开(公告)号：EP2102902A1

公开(公告)日：2009-09-23

申请号：EP07847737.9

申请日：2007-12-04

申请人： Robert Bosch GmbH

发明人： STOPPEL, Klaus

IPC分类号： H01L21/683 ,  H01L21/00 ,  H01L21/687

CPC分类号： H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2224/75304 ,  H01L2924/01068 ,  Y10T29/53191

摘要： The invention relates to a handling tool (1) for components (2), in particular electronic components (2), having a holding opening (18), to which reduced pressure (PU) can be applied and at which components to be handled can be held by reduced pressure (PU). It is provided that at least one counter-holding device (8) which projects outwards beyond the opening plane (20) in an operating position is arranged in the holding opening (18). The invention furthermore relates to a method for handling components, in particular electronic components, comprising the following steps: - sucking up a component by reduced pressure and holding the component by the reduced pressure; - supporting the component held by reduced pressure in the region of its area to which reduced pressure is applied, in such a way that said area, in particular the component, flexes concavely as seen from the reduced pressure side.

公开(公告)号：EP2100327A1

公开(公告)日：2009-09-16

申请号：EP06829212.7

申请日：2006-11-24

申请人： Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V.

发明人： MARENCO, Norman

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L21/56 ,  H01L23/49855 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K3/12 ,  H05K3/326 ,  H05K3/386 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention relates to an electronic, in particular microelectronic, functional group and to a method for its production. The method according to the invention includes the following steps: a) coating of a mount (5a) with a non-conductive adhesive (4a); b) application of a conductor structure (3) to a subarea of the adhesive layer (4a); c) arrangement of an electronic component (1) with at least one external electrical connecting contact (2) on the adhesive layer (4a) and on the conductor structure (3), with the at least one connecting contact (2) of the electronic component (1) being brought directly into contact with the conductor structure (3), and with a part of the outer casing of the component (1) being brought directly into contact with the adhesive layer (4a). The method according to the invention allows electronic, in particular microelectronic, functional groups to be produced with care, quickly and in particular at low cost.

公开(公告)号：EP2097725A2

公开(公告)日：2009-09-09

申请号：EP07863227.0

申请日：2007-12-21

申请人： Analog Devices, Inc.

发明人： KIERSE, Oliver ,  HYNES, Eamon

IPC分类号： G01J5/00

CPC分类号： G01J1/4228 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0462 ,  H01L24/45 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/16235 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A control aperture for an IR sensor includes a die; an IR sensor disposed on the die and an IR opaque aperture layer on the die having an IR transmissive aperture aligned with the IR sensor for controlling the field of view and focus of the IR sensor.

摘要翻译： 用于IR传感器的控制孔包括管芯; 布置在管芯上的IR传感器和管芯上的IR不透明孔径层，IR孔径层具有与IR传感器对准的IR透射孔，用于控制IR传感器的视场和焦点。

公开(公告)号：EP2092806A2

公开(公告)日：2009-08-26

申请号：EP07846547.3

申请日：2007-11-09

申请人： Häusermann GmbH

发明人： OBERENDER, Lothar ,  JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC分类号： H05K1/02 ,  H05K3/10 ,  B23K20/10 ,  H05K3/32

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/78313 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0209 ,  H05K1/0263 ,  H05K3/103 ,  H05K3/222 ,  H05K3/328 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2224/48 ,  H01L2924/00

摘要： The invention relates to a circuit board (1) comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element (3), in particular in the form of an elongate copper element or element containing copper, that is brought into contact with copper film elements by ultrasound on at least one part on the surface on the copper film elements (4) and is integrated into the circuit board by means of a lamination process. The at least one elongate wiring element has a cross-section that is deformed by means of a specifically formed sonotrode in a contact area that is flat in parts, such that the contact surfaces are at least 20%, in particular more than 30% and more particularly more than 50% greater in a non-deformed contact surface. The wiring element is further deformed in the cross-section in an approximately triangular like manner or in a trapezoidal manner thus increasing the contact surface. Also, the elongate wiring element in brought into contact at defined intervals in a flat manner on a conductive film element that is arranged therebelow.

公开(公告)号：EP1709575B1

公开(公告)日：2009-08-19

申请号：EP05706715.9

申请日：2005-01-28

申请人： Smartrac IP B.V.

发明人： RIETZLER, Manfred

IPC分类号： G06K19/077 ,  G06K19/18

CPC分类号： B42D25/45 ,  B29C70/82 ,  B32B37/185 ,  B32B2305/347 ,  B32B2425/00 ,  B32B2519/02 ,  B42D25/00 ,  B42D25/24 ,  B42D2033/46 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/78301 ,  H01L2924/01068 ,  H01L2924/00014

摘要： Disclosed is a method for producing a security layer structure and a security layer structure for an identification document (61), particularly for identifying a person, comprising a transponder layer (20) and at least one coating (38, 39). The transponder layer is sealingly covered by means of the at least one coating when the conducting wire is located therebetween. At least one visible face (62) of the at least one coating or transponder layer is provided with a security print (63).