公开(公告)号：EP2387068A3

公开(公告)日：2014-04-23

申请号：EP11177078.0

申请日：2007-03-22

Applicant: CeramTec GmbH

Inventor： Kluge, Dr. Claus Peter

IPC: H01L23/15 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L25/16 ,  H05K1/02 ,  H01L23/552 ,  F21K99/00 ,  F21Y105/00 ,  F21Y101/02 ,  H05K1/03 ,  H01L33/64 ,  F21V29/00 ,  F21S8/10 ,  H01L23/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21V29/71 ,  F21V29/713 ,  F21V29/75 ,  F21V29/763 ,  F21V29/86 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F2215/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L33/642 ,  H01L33/648 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/09045 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: Die Erfindung betrifft einen Trägerkörper (1, 2) für elektrische oder elektronische Bauelemente (6a, 6b, 6c, 6d) oder Schaltungen, wobei der Trägerkörper (1, 2) elektrisch nicht oder nahezu nicht leitend ist, der Trägerkörper (1, 2) einstückig mit Wärme ab- oder zuführenden Kühlelementen (7) versehen ist, der Trägerkörper (1, 2) eine Platine ist und auf der Oberfläche des Trägerkörpers (1, 2) versinterte Metallisierungsbereiche (41) aufgebracht sind.
Erfindungsgemäß wird vorgeschlagen, dass der Trägerkörper (1, 2) und/oder das Kühlelement (7) aus einem Kompositmaterial besteht und das Kompositmaterial elektrisch nicht oder nahezu nicht leitende Matrixmaterialien mit Wärme leitenden Zuschlagstoffen enthält.

Abstract translation: 本发明涉及一种承载体（1,2），用于电气或电子元件（6A，6B，6C，6D）或电路，其中，所述承载体（1，2）被电不或基本上不导电的，所述支撑体（1，2） 与散热或馈送冷却元件（7）整体地设置，载体主体（1,2）是电路板并且在载体主体（1,2）的表面上施加烧结金属化区域（41）。 根据本发明，提出的是，承载体（1，2）和/或冷却元件（7）由复合材料和非导电性的或基本上不包含基体材料的热传导性添加剂的复合材料制成。

公开(公告)号：EP1926358B1

公开(公告)日：2011-11-02

申请号：EP06810048.6

申请日：2006-09-08

Applicant: SANKYO KASEI CO., LTD.

Inventor： YOSHIZAWA, Norio ,  WATANABE, Hiroaki

IPC: H05K3/18 ,  B29C69/00 ,  H05K3/00

CPC classification number: H05K3/184 ,  H05K1/0256 ,  H05K2201/0761 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0565 ,  Y10T428/24479

Abstract: The range of selection of the material for a primary substrate and the material for a resin mask in a secondary substrate can be broadened, and short circuiting of a circuit can be reliably prevented. The shape of a primary substrate (1) is such that a circuit forming face (11) is in a convex form and a circuit non-forming face (12) is in a concave form, the difference in level between the circuit forming face (11) and the circuit non-forming face (12) is 0.05 mm, and the angle of side walls (13, 14) connecting the circuit forming face to the circuit non-forming face is 90º. In order to apply a catalyst, a palladium catalyst solution was immersed in a bath having a water depth of 500 mm at a liquid temperature of 40ºC for 5 min. Thereafter, a resin mask (3) is dissolved and removed, followed by electroless plating. As a result, the catalyst solution penetrates up to a part in which the creeping distance could have been increased, that is, up to both side walls (13, 14). That is, the catalyst penetration can be prevented, and short circuiting between conductive layers (50), that is, between circuits, can be prevented.

公开(公告)号：EP2320457A2

公开(公告)日：2011-05-11

申请号：EP11154345.0

申请日：2007-03-22

Applicant: CeramTec GmbH

Inventor： Kluge, Dr. Claus Peter

IPC: H01L23/373 ,  H01L23/367

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21V29/71 ,  F21V29/713 ,  F21V29/75 ,  F21V29/763 ,  F21V29/86 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F2215/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L33/642 ,  H01L33/648 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/09045 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: Die Erfindung betrifft einen Trägerkörper (1, 2) für elektrische oder elektronische Bauelemente (6a, 6b, 6c, 6d) oder Schaltungen, wobei der Trägerkörper (1, 2) elektrisch nicht oder nahezu nicht leitend ist und der Trägerkörper (1, 2) einstückig mit Wärme ab- oder zuführenden Kühlelementen (7) versehen ist.
Zur Vereinfachung des Trägerkörpers (1) bei gleichzeitiger extrem verbesserter Wärmeableitung wird erfindungsgemäß vorgeschlagen, dass der Trägerkörper (1, 2) eine Platine ist, der Trägerkörper (1, 2) und das Kühlelement (7) aus einer Keramik oder aus einem Kompositmaterial besteht und das Kompositmaterial elektrisch nicht oder nahezu nicht leitende Matrixmaterialien mit Wärme leitenden Zuschlagstoffen enthält und auf der Oberfläche des Trägerkörpers (1, 2) versinterte Metallisierungsbereiche (41) aufgebracht sind.

Abstract translation: 本发明涉及一种承载体（1,2），用于电气或电子元件（6A，6B，6C，6D）或电路，其中，所述承载体（1，2）是非电或基本上不导电的和承载体（1，2） 一体地设置关闭或与冷却元件（7）供给热量。 对于在同一时间极为改善的散热承载体（1）的简化，本发明提出的是，承载体（1，2）是一种电路板，所述支撑体（1，2）和所述冷却元件（7）由陶瓷或组成的复合材料制成，并且 该复合材料是不导电或几乎不导电的基体材料与导热聚集体和包含在承载体的表面上的（1，2）烧结的金属化区域（41）被应用。

公开(公告)号：EP2064710A4

公开(公告)日：2011-05-04

申请号：EP07841968

申请日：2007-09-06

Applicant: UNIV ILLINOIS

Inventor： ROGERS JOHN A ,  MEITL MATTHEW ,  SUN YUGANG ,  KO HEUNG CHO ,  CARLSON ANDREW ,  CHOI WON MOOK ,  STOYKOVICH MARK ,  JIANG HANQING ,  HUANG YONGGANG ,  NUZZO RALPH G ,  KANG SEONG JUN ,  LEE KEON JAE ,  ZHU ZHENGTAO ,  MENARD ETIENNE ,  KIM HOON-SIK ,  KHANG DAHL-YOUNG ,  AHN JONG-HYUN

IPC: H01B7/06 ,  H01R35/00

CPC classification number: H01L27/0688 ,  B81B3/0078 ,  B82Y10/00 ,  H01L21/6835 ,  H01L21/8221 ,  H01L21/8258 ,  H01L27/0605 ,  H01L27/1292 ,  H01L27/1446 ,  H01L27/281 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/20 ,  H01L29/7781 ,  H01L29/7842 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0203 ,  H01L51/0097 ,  H01L2924/00011 ,  H01L2924/0002 ,  H01L2924/13091 ,  H01L2924/30105 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00012

公开(公告)号：EP2193551A1

公开(公告)日：2010-06-09

申请号：EP08801317.2

申请日：2008-09-09

Applicant: Osram Opto Semiconductors Gmbh

Inventor： EISSLER, Dieter

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L24/73 ,  H01L25/0756 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/12041 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/10106 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an arrangement comprising an optoelectronic component (1) having two contacts (3a, 3b) and at least one other element (2), a connecting piece being arranged between the optoelectronic component (1) and the other element (2). According to the embodiment, the connecting piece (6) is used either to fix the position during the assembly process, for centring during the assembly process, to improve the heat dissipation or to prevent a short-circuit.

公开(公告)号：EP2191702A1

公开(公告)日：2010-06-02

申请号：EP08774864.6

申请日：2008-07-08

Applicant: Robert Bosch GmbH

Inventor： EHRENPFORDT, Ricardo ,  MAY, Johanna

IPC: H05K3/04

CPC classification number: H05K3/041 ,  H05K1/0272 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108

Abstract: The invention relates to a method for the hot embossing of at least one conductor track onto a substrate (1) wherein a film (3) having at least one electrically conductive layer (4) is pressed against the substrate (1) in an embossing direction (11) by means of an embossing die (7) having a structured die surface (8). According to the invention, it is provided that the film (3) remains on the substrate (1) after the end of the embossing process in at least two structure planes (12, 13) which are spaced apart in the embossing direction (11). The invention furthermore relates to a substrate (1) comprising at least one first conductor track embossed thereon.

公开(公告)号：EP1737282A4

公开(公告)日：2010-05-05

申请号：EP05727833

申请日：2005-03-29

Applicant: MITSUBISHI CABLE IND LTD

Inventor： AMBO T ,  FUJIWARA S ,  HASEGAWA Y ,  NAKAGAWA C ,  ONO T ,  URUSHIDANI A ,  KASHIOKA T ,  SHIMAZAWA K

IPC: H05K1/02 ,  H01R9/24 ,  H01R12/58 ,  H02G3/08 ,  H02G3/16 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K13/00

CPC classification number: H05K3/202 ,  H01R9/2466 ,  H01R12/523 ,  H05K3/041 ,  H05K3/222 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/4046 ,  H05K3/4611 ,  H05K13/0061 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/167 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T428/24917

公开(公告)号：EP2142489A1

公开(公告)日：2010-01-13

申请号：EP08736299.2

申请日：2008-04-17

Applicant: CeramTec AG

Inventor： KLUGE, Claus Peter

IPC: C04B37/02 ,  H01L23/40 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38

CPC classification number: C04B37/026 ,  C04B37/021 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/09045 ,  Y10T428/24174 ,  Y10T428/24182 ,  Y10T428/26 ,  Y10T428/31678 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: It is difficult to dissipate the heat produced during the operation of components having flat metalized ceramic bases, especially if the ceramic bases are metalized on both surfaces. The component (1) according to the invention has a ceramic base (2) the surface (3, 4) of which is covered in at least one area by a metalized coating (5, 6), the ceramic base (2) being spatially structured (7).

公开(公告)号：EP2142488A1

公开(公告)日：2010-01-13

申请号：EP08736298.4

申请日：2008-04-17

Applicant: CeramTec AG

Inventor： KLUGE, Claus Peter

IPC: C04B37/02 ,  H01L23/40 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38

CPC classification number: C04B37/02 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/49822 ,  H01L23/49883 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/0254 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/245 ,  H05K2201/0175 ,  H05K2201/09045 ,  Y10T428/12389 ,  Y10T428/12479 ,  Y10T428/12576 ,  Y10T428/12618 ,  Y10T428/24355 ,  Y10T428/249953 ,  Y10T428/26 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: With the advance of power electronics into increasing voltage ranges the need for high insulation voltages and high partial discharge resistance gets stronger every day. The invention therefore relates to a component (1) having a ceramic base (2) the surface (3, 4) of which is covered in at least one area by a metalized coating (5, 6; 11), the ceramic base (2) being spatially structured (7) and the partial discharge resistance between at least two layers of a metalized structure (5, 6) produced from the same or different materials and between the layer (5; 11) of a metalized structure and the ceramic being

公开(公告)号：EP2076099A1

公开(公告)日：2009-07-01

申请号：EP07150452.6

申请日：2007-12-27

Applicant: Nederlandse Organisatie voor Toegepast- Natuurwetenschappelijk Onderzoek TNO

Inventor： Meinders, Erwin Rinaldo ,  Gelinck, Gerwin Hermanus

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4638 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/4635 ,  H05K2201/051 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1039

Abstract: The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet, distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.

Abstract translation: 本发明涉及一种对准具有一般第一箔片长度方向的柔性箔片的方法，以在具有卷轴直径的卷轴上形成叠层的箔片层。 该方法包括在箔片中设置多个对准标记，与纸片长度方向横切的标记长度方向间隔适应卷轴直径，在箔片的相对面上形成凸起和对应的凹槽; 在箔片的第一箔片长度方向上将箔片卷绕在卷轴上; 并且使对准标记共同对准具有与另一标记的凹部匹配的一个标记的突起，以阻止层叠的箔片层在第一箔片长度方向上的相对移动。 优选地，箔片层具有器件功能以形成层叠的箔片层叠器件。