公开(公告)号：EP0903062A1

公开(公告)日：1999-03-24

申请号：EP97927883.0

申请日：1997-05-29

Applicant: THE WHITAKER CORPORATION

Inventor： WELLS, Graham, J., H. ,  CARON, Christopher, L. ,  SCHWAB, Paul, J.

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/243 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K3/0094 ,  H05K3/242 ,  H05K3/3405 ,  H05K3/3473 ,  H05K3/429 ,  H05K2201/09481 ,  H05K2201/09627 ,  H05K2203/049 ,  H05K2203/1394

Abstract: A leaded printed wiring board for a chip on board device eliminates an intermetallic abutment (19) conventionally between the lead attach finger (16) and conductive traces on the outer layers of the printed wiring board (1). All of the lead attach fingers (16) are electrically connected to conductive traces (2) through vias (21, 22). The vias (21, 22) have an interconnecting trace (23) on an intermediate layer of the printed wiring board (1).

公开(公告)号：EP0860101A1

公开(公告)日：1998-08-26

申请号：EP96938583.0

申请日：1996-11-06

Applicant: Strandberg, Reinhold

Inventor： Strandberg, Reinhold

IPC: G01R1 ,  H05K3

CPC classification number: H05K3/4007 ,  G01R1/07378 ,  H05K3/06 ,  H05K3/22 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/098 ,  H05K2203/0346

Abstract: A method for producing contact pads on pattern boards (8) comprises a plating treatment in order to apply electrically conductive material on the board in correspondence to the desired contact pads (31). The electrically conducting material on the contact pads is subjected to a treatment with an agent capable of etching the material in order to provide chamfering or rounding of peripherical edges (34) of the contact pads.

公开(公告)号：EP0823732A1

公开(公告)日：1998-02-11

申请号：EP96112701.6

申请日：1996-08-07

Applicant: NITTO DENKO CORPORATION

Inventor： Takayama, Yoshinari, c/o Nitto Denko Corp. ,  Ouchi, Kazuo, c/o Nitto Denko Corp. ,  Hino, Atsushi, c/o Nitto Denko Corp.

IPC: H01L23/498

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A film carrier comprising a conductive circuit formed on one side or inside of an insulating substrate, wherein;

when the conductive circuit is formed on one side of the insulating substrate, an opening is formed on the other side of said insulating substrate at a position where a conductive path is to be formed, and
when the conductive circuit is formed inside the insulating substrate, an opening is formed on one side or both sides of said insulating substrate at a position where a conductive path is to be formed,
said opening comprising a through-hole extending from the surface of the insulating substrate to the surface of the conductive circuit, and a concave formed on the face of the conductive circuit about the opening at the lower end of said through-hole, in a diameter equally extended all around said opening, and said opening being filled with a conductive material to form a conductive path. The film carrier of the present invention can cope with a fine-pitched and high dense mounting, while prohibiting pulling out of the conductive path by an external force. Accordingly, the film carrier is devoid of fallout of the conductive path, which in turn increases electrical connection reliability.

Abstract translation: 1.一种薄膜载体，包括在绝缘基板的一侧或内侧形成的导电电路， 当在绝缘基板的一侧上形成导电电路时，在要形成导电路径的位置处，在绝缘基板的另一侧上形成开口，并且当绝缘基板内部形成导电电路时， 在要形成导电路径的位置处，在所述绝缘基板的一侧或两侧形成开口，所述开口包括从所述绝缘基板的表面延伸到所述导电电路的表面的通孔，以及 导电电路的表面周围形成在所述通孔的下端处的开口周围的整个所述开口周围均匀延伸的直径，并且所述开口填充有导电材料以形成导电路径。 本发明的薄膜载体能够通过外力阻止导电路径的拉出，从而能够应对细小的高密度的安装。 因此，胶片载体没有导电路径的落下，这继而增加了电连接的可靠性。

公开(公告)号：EP0685905A3

公开(公告)日：1997-11-19

申请号：EP95202155.8

申请日：1992-07-06

Applicant: MOD-TAP W. CORP.

Inventor： White, Rowland Spencer

IPC: H01R9/24

CPC classification number: H01R4/2429 ,  H01R12/721 ,  H01R24/62 ,  H01R31/06 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954 ,  Y10S439/922 ,  Y10S439/951

Abstract: An electrical connection system, for example a drop-side patch panel, comprises a mounting rail (12) which receives first connectors (14) arranged with their contacts facing away from the rail (12). Cable introduced between the rail and the connectors is separated into individual conductors which are terminated at contacts (34, 36) via slots (30) in the rail walls. A second connector 16 carries standard data or voice sockets communications (19) which are connected to the first connector via edge contact carrying PCBs (38) which engage in slots (40) in the first connectors. The PCB edge connectors have a discontinuity on one surface, and one half of the contact is connected to the contact on the other side to enable direct connection between upper (34) and lower (36) rows of contacts of the first connectors in a first position of the second connectors, and contact between the upper rows of contacts and the standard sockets (19) in a second position.

公开(公告)号：EP0549619A1

公开(公告)日：1993-07-07

申请号：EP91915510.0

申请日：1991-09-06

Applicant: ROBERT BOSCH GMBH

Inventor： ZIMMERMANN, Herbert ,  STEINLE, Klaus ,  SPITZENBERGER, Kurt ,  STECHER, Guenther

IPC: H01L23 ,  H05K3 ,  H05K1

CPC classification number: H01L23/5385 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/321 ,  H05K3/4053 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09481 ,  H05K2201/09909 ,  H01L2924/00

Abstract: Selon un procédé de fabrication d'un circuit ayant un premier niveau constitué d'un substrat en céramique (1) équipé de structures à couche épaisse, par exemple, sur lequel sont imprimées des pistes conductives correspondantes ayant des surfaces de contact (4), le substrat en céramique est relié à une deuxième couche de circuits formée d'un substrat (3) constitué d'une bande comprimée crue. Des traversées (7) sont formées dans la bande comprimée crue et remplies d'un matériau conducteur de contact (6) qui forme des surfaces complémentaires de contact (5) avec les surfaces de contact (4) sur le substrat en céramique. Une couche de liaison (8) (par exemple une pâte d'argent ou de cuivre) est imprimée sur les surfaces de contact (4, 5). Des barrettes (10) en verre sont imprimées sur le substrat en céramique (1) et/ou sur une face inférieure du substrat constitué d'une bande comprimée crue.

公开(公告)号：EP0421343A2

公开(公告)日：1991-04-10

申请号：EP90118860.7

申请日：1990-10-02

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Makino, Yutaka ,  Ishimoto, Kazumi ,  Izumi, Yasuo ,  Kitayama, Yoshifumi ,  Kumagai, Koichi

IPC: H01L23/552 ,  H01L23/498

CPC classification number: H05K1/181 ,  H01L23/49534 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10681 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor element package (P) and a semiconductor element package mounting distributing circuit basic plate, wherein the shield metallic layer (60) is provided on the flexible insulating basic plate for constituting the package, so that the semiconductor element (30) mounted on the flexible insulating basic plate (10) may be kept electromagnetically shielded positively with the shield metallic layer, whereby troublesome operation such as mounting the bulk high box shaped electromagnetic shield member on the outside of the semiconductor element package mounted on the distributing circuit basic plate as in the conventional one is not required, and, also, since the shield metallic layer is provided on the face, which is not formed with the lead patterns, of the flexible insulating basic plate, no influences are applied at all upon the construction of the land pattern and the mounting construction of the semiconductor element.

Abstract translation: 一种半导体元件封装和半导体元件封装件安装分配电路基本板，worin屏蔽金属层为构成封装设置在挠性绝缘基本板，所以没有安装在柔性绝缘基底板的半导体元件可以电磁保持屏蔽 正与屏蔽金属层，由此麻烦术：如散装高盒状的电磁波屏蔽部件安装在半导体元件封装的外侧安装在所述分配电路基本板作为在不需要传统的一个，并且，因此，由于 设置在面对所述屏蔽金属层，所有这些不与引线图案而形成，所述柔性绝缘基底板的，没有影响在所有在所述焊盘图案的结构和半导体元件的安装结构的应用。

公开(公告)号：EP0191434B1

公开(公告)日：1991-01-16

申请号：EP86101606.1

申请日：1986-02-07

Applicant: International Business Machines Corporation

Inventor： Blakeslee, Marybelle C. ,  Chance, Dudley Augustus ,  Eastman, Dean Eric ,  Gniewek, John J. ,  Ho, Chung Wen ,  Levine, Ernest N. ,  Ordonez, Jose E. ,  Reiley, Timothy Clark ,  Skarvinko, Eugene R.

IPC: H01L21/60

CPC classification number: H01L24/16 ,  H01L23/49822 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4053 ,  H05K2201/09472 ,  H05K2201/09481 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP2765656B1

公开(公告)日：2018-11-14

申请号：EP14151014.9

申请日：2014-01-13

Applicant: CommScope, Inc. of North Carolina

Inventor： Schumacher, Richard A. ,  Hashim, Amid I. ,  Fitzpatrick, Brian J. ,  Moffitt, Bryan S. ,  Larsen, Wayne D. ,  Michaelis, Scott L.

IPC: H01R13/6466 ,  H01R24/64 ,  H01R13/6463 ,  H01R24/28

CPC classification number: H01R13/6466 ,  H01R13/6463 ,  H01R24/28 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: A patch cord (100) is provided that includes a communications cable (109) that has at least first through fourth conductors (101, 102, 104, 105) and a plug (116) that is attached to the cable (109). The plug (116) includes a housing (120) that receives the cable (109), a printed circuit board (150), first through fourth plug contacts (141, 142, 144, 145), and first through fourth conductive paths (161, 162, 164, 165) that connect the first through fourth conductors (101, 102, 104, 105) to the respective first through fourth plug contacts (141, 142, 144, 145). The first and second conductors (101, 102), conductive paths (161, 162), and plug contacts (141, 142) form a first differential transmission line, and the third and fourth conductors (104, 105), conductive paths (164, 165), and plug contacts (144, 145) form a second differential transmission line. Each of the first through fourth plug contacts (141, 142, 144, 145) has a first segment that extends longitudinally along a first surface of the printed circuit board (150), and the signal current injection point into the first segment of at least some of the first through fourth plug contacts (141, 142, 144, 145) is into middle portions of their respective first segments.

公开(公告)号：EP3100283A4

公开(公告)日：2017-11-29

申请号：EP15740141

申请日：2015-01-27

Applicant: ANGIOMETRIX CORP

Inventor： PATIL NITIN

IPC: H01B7/08 ,  H01B7/00 ,  H01B7/02

CPC classification number: H05K1/0268 ,  A61B5/6851 ,  A61B2562/12 ,  A61M25/09 ,  A61M2025/09108 ,  H05K1/0296 ,  H05K1/118 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2201/09709

Abstract: Assembly methods and apparatus for electrically stable connectors are described herein where a conductive wire assembly generally comprises an insulative substrate having a length, one or more conductive elements formed along a first direction upon the substrate, an insulative coverlay formed upon the one or more conductive elements, and at least one opening or window defined through the insulative coverlay exposing a portion of the one or more conductive elements. A conductive coating is formed upon the insulative coverlay such that the conductive coating is in contact with the portion of the one or more conductive elements through the at least one opening or window and the conductive coating may have at least one region removed along a second direction in proximity to the at least one opening or window such that one or more conductive pads are formed and are electrically isolated from a remainder of the conductive coating.

公开(公告)号：EP2687068B1

公开(公告)日：2016-09-28

申请号：EP12710641.7

申请日：2012-03-16

Applicant: GKN AEROSPACE SERVICES STRUCTURES, CORP.

Inventor： FEENEY, Christopher, John

IPC: H05K1/02 ,  B64D15/12 ,  H05B3/36

CPC classification number: H01R43/20 ,  B64D15/12 ,  H01R12/592 ,  H05B3/06 ,  H05B3/34 ,  H05B2203/013 ,  H05K1/0284 ,  H05K1/118 ,  H05K1/147 ,  H05K1/167 ,  H05K2201/09481 ,  H05K2201/0999 ,  H05K2201/10295 ,  Y10T156/10

Abstract: In a composite component having a laminate body, a conductive layer and a connector can be joined to one another using an intermediate flexible circuit. Among other things, this flexible circuit places the conductive layer and the connector in electrical communication with one another. Furthermore, during the forming process and because of its thinness, the flexible circuit integrates well with the layers of the laminate body and can accommodates some spatial displacement of the connector and conductive material relative to one another.