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公开(公告)号：JPWO2013129253A1
公开(公告)日：2015-07-30
申请号：JP2014502176
申请日：2013-02-22
申请人： 日鉄住金マイクロメタル株式会社 , 学校法人早稲田大学
CPC分类号： H01L24/05 , H01L24/03 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/03444 , H01L2224/0345 , H01L2224/0346 , H01L2224/04042 , H01L2224/05007 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05172 , H01L2224/05184 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/05684 , H01L2224/32245 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/43848 , H01L2224/43986 , H01L2224/45005 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45611 , H01L2224/45618 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45672 , H01L2224/45684 , H01L2224/45686 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48472 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/48872 , H01L2224/48884 , H01L2224/73265 , H01L2224/78313 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/10253 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/20103 , H01L2924/351 , H01L2924/00015 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012 , H01L2924/00 , H01L2924/01079 , H01L2924/01046 , H01L2924/013 , H01L2924/00013 , H01L2924/01202 , H01L2924/20107 , H01L2924/20106 , H01L2224/29099 , H01L2924/01023 , H01L2924/01074 , H01L2924/01049
摘要： パワー半導体装置の電流容量の大容量化、高温環境での使用に際し、熱応力が発生しても問題なく使用でき、ワイヤ自身の発熱を低減でき、高温環境でも接合部の信頼性を確保することができるパワー半導体装置及びその製造方法並びにボンディングワイヤを提供することを課題とする。パワー半導体素子2上の金属電極(素子電極3)ともう一方の金属電極(接続電極4)とを金属ワイヤ5によって双方ともウェッジ接続したパワー半導体装置1において、金属ワイヤ5は直径50μm超2mm以下のAg又はAg合金ワイヤであり、素子電極3は表面に50Å厚以上のNi、Cr、Cu、Pd、V、Ti、Pt、Zn、Ag、Au、W、Alの金属層又はこれらの合金層を1層以上有する。これにより、Agワイヤを用いるにもかかわらず電極との接合部信頼性を確保でき、大電流での使用時に金属ワイヤ自身の発熱を低減でき、高温での耐熱性を改善することができる。
摘要翻译： 功率半导体器件的电流容量的容量，在高温环境下使用时，可以在不产生热应力的问题使用时，可以减少导线本身的发热，以确保即使在高温环境下的接合部分的可靠性 并提供一种功率半导体器件及其制造方法，和接合线即可。 在通过金属线5，金属线5或更小的直径为50μm的超2毫米半导体元件2托莫一个金属电极（连接电极4）上的功率半导体装置1楔二者连接电源的金属电极（器件电极3） 的Ag或Ag合金线，器件电极3是50埃的表面厚度以上的Ni，铬，铜，钯，钒，钛，铂，锌，银，金，钨，金属层或Al的它们的合金 在具有多于一个的层。 这可以使用Ag线，在使用以大电流可以减小金属线的发热本身确保之间的接合的可靠性，尽管电极，所以可以提高在高温下的耐热性。
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公开(公告)号：JP5481769B2
公开(公告)日：2014-04-23
申请号：JP2006315090
申请日：2006-11-22
申请人： 日亜化学工業株式会社
CPC分类号： H01L24/85 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05616 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48095 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/4846 , H01L2224/48465 , H01L2224/48477 , H01L2224/48616 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48684 , H01L2224/48716 , H01L2224/48724 , H01L2224/48747 , H01L2224/48784 , H01L2224/48816 , H01L2224/48844 , H01L2224/48847 , H01L2224/48884 , H01L2224/4911 , H01L2224/49112 , H01L2224/49425 , H01L2224/49429 , H01L2224/85051 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10161 , H01L2924/10162 , H01L2924/12035 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/30105 , H01L2924/3025 , H01L2924/20752 , H01L2924/00 , H01L2224/78 , H01L2224/48824 , H01L2224/48744
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公开(公告)号：JP2014518455A
公开(公告)日：2014-07-28
申请号：JP2014518548
申请日：2012-07-03
申请人： イオプレックス リミテッド
发明人： ログレン、フィリップ、イー．
CPC分类号： H01L21/4828 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49582 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/32245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48669 , H01L2224/48684 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48869 , H01L2224/48884 , H01L2224/73265 , H01L2224/85207 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/85464 , H01L2224/85469 , H01L2224/85484 , H01L2224/92247 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： 【解決手段】 リードキャリアは、製造中、半導体装置の支持を提供する。 前記リードキャリアは、複数のパッケージサイトを伴う一時支持部材を含む。 各パッケージサイトは、複数の端子パッドに囲まれたダイ取り付けパッドを含む。 前記パッドは、下部において可融性固定材料で形成される。 前記ダイ取り付けパッド上にはチップが実装され、ワイヤーボンドが前記チップから前記端子パッドへ延長する。 前記パッド、チップ、およびワイヤーボンドは、すべてモールド化合物内に封入される。 前記一時支持部材は、前記可融性固定材料の融点を超えて加熱し剥離することができ、次いで前記個々のパッケージサイトを互いから単離して、電子機器システム基板内に実装するための複数の表面実装接合部を含む完成されたパッケージを提供することができる。
【選択図】 なし-
公开(公告)号：JP5539077B2
公开(公告)日：2014-07-02
申请号：JP2010156372
申请日：2010-07-09
申请人： ローム株式会社
发明人： 弘守 奥村
IPC分类号： H01L23/12 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/522
CPC分类号： H01L23/3128 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5226 , H01L23/525 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/45 , H01L24/48 , H01L2224/02313 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0346 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05541 , H01L2224/05555 , H01L2224/05569 , H01L2224/05571 , H01L2224/05582 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/11849 , H01L2224/13023 , H01L2224/131 , H01L2224/1403 , H01L2224/1411 , H01L2224/1412 , H01L2224/16225 , H01L2224/16227 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/48847 , H01L2224/48855 , H01L2224/48866 , H01L2224/48884 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/384 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
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公开(公告)号：JP2008130863A
公开(公告)日：2008-06-05
申请号：JP2006315090
申请日：2006-11-22
申请人： Nichia Chem Ind Ltd , 日亜化学工業株式会社
发明人： HAYASHI TADAO , NAGAE YOSHIHARU
CPC分类号： H01L24/85 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05616 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/4554 , H01L2224/45669 , H01L2224/48091 , H01L2224/48095 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/4846 , H01L2224/48465 , H01L2224/48477 , H01L2224/48616 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48684 , H01L2224/48716 , H01L2224/48724 , H01L2224/48747 , H01L2224/48784 , H01L2224/48816 , H01L2224/48844 , H01L2224/48847 , H01L2224/48884 , H01L2224/4911 , H01L2224/49112 , H01L2224/49425 , H01L2224/49429 , H01L2224/85051 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10161 , H01L2924/10162 , H01L2924/12035 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/30105 , H01L2924/3025 , H01L2924/20752 , H01L2924/00 , H01L2224/78 , H01L2224/48824 , H01L2224/48744
摘要： PROBLEM TO BE SOLVED: To decrease the number of wires and lengths of the wires to achieve bonding reliability.
SOLUTION: The semiconductor device has a first wire loop in which one free-standing end is ball-bonded to a first bonding point and the other free-standing end is ball-bonded to a second bonding point, wherein the top surface of the first wire loop's ball part is in a crushed state at its top including part of the wire, and it has a second wire loop that provides a bridge between the ball part's top surface and a third bonding point.
COPYRIGHT: (C)2008,JPO&INPIT摘要翻译： 要解决的问题：减少电线的数量和电线的长度以实现接合可靠性。 解决方案：半导体器件具有第一线环，其中一个自立端与第一接合点滚珠焊接，另一个独立端与第二接合点球接，其中顶表面 第一线环的球部分在其顶部处于破碎状态，包括线的一部分，并且其具有在球部的顶表面和第三接合点之间提供桥的第二线环。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP5728126B2
公开(公告)日：2015-06-03
申请号：JP2014502176
申请日：2013-02-22
申请人： 日鉄住金マイクロメタル株式会社 , 学校法人早稲田大学
CPC分类号： H01L24/05 , H01L24/03 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/03444 , H01L2224/0345 , H01L2224/0346 , H01L2224/04042 , H01L2224/05007 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05172 , H01L2224/05184 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/05684 , H01L2224/32245 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/43848 , H01L2224/43986 , H01L2224/45005 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45611 , H01L2224/45618 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45672 , H01L2224/45684 , H01L2224/45686 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48472 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/48872 , H01L2224/48884 , H01L2224/73265 , H01L2224/78313 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/10253 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/20103 , H01L2924/351
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公开(公告)号：JP2012019121A
公开(公告)日：2012-01-26
申请号：JP2010156372
申请日：2010-07-09
申请人： Rohm Co Ltd , ローム株式会社
发明人： OKUMURA HIROMORI
IPC分类号： H01L23/12 , H01L21/3205 , H01L21/60 , H01L23/52
CPC分类号： H01L23/3128 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5226 , H01L23/525 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/45 , H01L24/48 , H01L2224/02313 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0346 , H01L2224/0384 , H01L2224/0391 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05541 , H01L2224/05555 , H01L2224/05569 , H01L2224/05571 , H01L2224/05582 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/11849 , H01L2224/13023 , H01L2224/131 , H01L2224/1403 , H01L2224/1411 , H01L2224/1412 , H01L2224/16225 , H01L2224/16227 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/48847 , H01L2224/48855 , H01L2224/48866 , H01L2224/48884 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/384 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for suppression of malfunction.SOLUTION: The semiconductor device comprises a semiconductor chip 1; a first electrode pad 21 stacked on the semiconductor chip 1; a rectangular interlayer 4 defined by a first edge 49a extending in a direction x and a second edge extending in a direction y; and a plurality of bumps 5 arranged so as to interleave the interlayer 4 with the semiconductor chip 1. One of the plurality of bumps 5 is a first bump 51 arranged at one edge in the direction X and in the direction Y among the plurality of bumps 5 and connected to the first electrode pad 21, and another one of the plurality of bumps 5 is a second bump 52 connected to the first electrode pad 21.
摘要翻译： 要解决的问题：提供适合于抑制故障的半导体器件。 解决方案：半导体器件包括半导体芯片1; 堆叠在半导体芯片1上的第一电极焊盘21; 由沿x方向延伸的第一边缘49a和沿y方向延伸的第二边缘限定的矩形中间层4; 以及多个凸块5，其布置成将中间层4与半导体芯片1交错。多个凸块5中的一个是沿着X方向的一个边缘和多个凸块中的Y方向上布置的第一凸块51 5并连接到第一电极焊盘21，并且多个凸起5中的另一个是与第一电极焊盘21连接的第二凸起52.版权所有（C）2012，JPO＆INPIT
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