公开(公告)号：US07597484B2

公开(公告)日：2009-10-06

申请号：US11961227

申请日：2007-12-20

申请人： Cyrus Ghahremani ,  Stefan Paulus ,  Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Siegfried Lehner

发明人： Cyrus Ghahremani ,  Stefan Paulus ,  Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Siegfried Lehner

IPC分类号： G02B6/36

CPC分类号： G02B6/4203 ,  G02B6/4228

摘要： An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

摘要翻译： 一种具有用于具有上表面，边缘面和下表面的光纤的插头式连接器的MID模块，包括用于容纳光纤的壁围成的容纳通道。 这里，容纳通道的直径基本上对应于光纤的直径。 MID模块还包括布置在容纳通道的前表面上的半导体芯片。 该半导体芯片包括光学活性区域，该光学活性区域可从住宿通道光学地接近。 在MID模块的壁中设置有用于容纳锁定元件的槽。 插入槽中的锁定元件将光纤锁定在容纳通道中。

公开(公告)号：US20080152285A1

公开(公告)日：2008-06-26

申请号：US11961227

申请日：2007-12-20

申请人： Cyrus Ghahremani ,  Stefan Paulus ,  Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Siegfried Lehner

发明人： Cyrus Ghahremani ,  Stefan Paulus ,  Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Siegfried Lehner

IPC分类号： G02B6/42

CPC分类号： G02B6/4203 ,  G02B6/4228

摘要： An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

摘要翻译： 一种具有用于具有上表面，边缘面和下表面的光纤的插头式连接器的MID模块，包括用于容纳光纤的壁围成的容纳通道。 这里，容纳通道的直径基本上对应于光纤的直径。 MID模块还包括布置在容纳通道的前表面上的半导体芯片。 该半导体芯片包括光学活性区域，该光学活性区域可从住宿通道光学地接近。 在MID模块的壁中设置有用于容纳锁定元件的槽。 插入槽中的锁定元件将光纤锁定在容纳通道中。

公开(公告)号：US07732333B2

公开(公告)日：2010-06-08

申请号：US10575798

申请日：2004-10-01

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Stefan Paulus

IPC分类号： H01L23/495 ,  H01L21/306

CPC分类号： H01L23/49582 ,  H01L21/4828 ,  H01L23/49503 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.

摘要翻译： 公开了一种具有引线框的半导体。 在一个实施例中，公开了一种引线框架，其装配有半导体芯片，并且将被塑料化合物封装，所述塑料化合物具有应用中间层的金属单片基体。 中间层具有包括具有基本均匀高度的剩余材料岛的基体的表面，在所述岛之间延伸空隙。

公开(公告)号：US20080258281A1

公开(公告)日：2008-10-23

申请号：US10575798

申请日：2004-10-01

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Stefan Paulus

IPC分类号： H01L23/495 ,  H01L21/306 ,  H01L21/3105

CPC分类号： H01L23/49582 ,  H01L21/4828 ,  H01L23/49503 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.

摘要翻译： 公开了一种具有引线框的半导体。 在一个实施例中，公开了一种引线框架，其装配有半导体芯片，并且将被塑料化合物封装，所述塑料化合物具有应用中间层的金属单片基体。 中间层具有包括具有基本均匀高度的剩余材料岛的基体的表面，在所述岛之间延伸空隙。

公开(公告)号：US07417198B2

公开(公告)日：2008-08-26

申请号：US10515236

申请日：2003-05-22

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

IPC分类号： H01L23/495 ,  H05K7/20

CPC分类号： H01L24/97 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2223/6644 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/2075

摘要： The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

摘要翻译： 本发明涉及一种具有由三个模块构成的空腔壳体的射频功率半导体模块，第一模块具有水平布置的扁平导体的向上和向下开放的壳体框架，第二模块具有芯片岛作为散热器 具有至少一个射频半导体部件，形成腔壳体底部的第二模块和具有壳体盖的第三模块。

公开(公告)号：US20060012016A1

公开(公告)日：2006-01-19

申请号：US10515236

申请日：2003-05-22

申请人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

发明人： Bernd Betz ,  Jochen Dangelmaier ,  Rudolf Lehner ,  Stefan Paulus

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2223/6644 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/2075

摘要： The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor components, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.

摘要翻译： 本发明涉及一种具有由三个模块构成的空腔壳体的射频功率半导体模块，第一模块具有水平布置的扁平导体的向上和向下开放的壳体框架，第二模块具有芯片岛作为散热器 具有至少一个射频半导体部件，形成空腔壳体的底部的第二模块和具有壳体盖的第三模块。

公开(公告)号：US20060091561A1

公开(公告)日：2006-05-04

申请号：US10515613

申请日：2003-05-23

申请人： Jochen Dangelmaier ,  Harry Hedler ,  Roland Irsigler ,  Stefan Paulus

发明人： Jochen Dangelmaier ,  Harry Hedler ,  Roland Irsigler ,  Stefan Paulus

IPC分类号： H01L23/48 ,  H01L21/48

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  H01L21/4846 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81001 ,  H01L2224/8181 ,  H01L2224/83385 ,  H01L2224/85424 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/207 ,  H01L2224/05599

摘要： The invention relates to an electronic device and a method for producing it having external area contacts and having a rewiring structure and also having a semiconductor chip, which has contact areas, the external area contacts being electrically connected to the contact areas at least by means of the rewiring structure, and the external area contacts and/or the rewiring structure having chemically or galvanically selectively deposited metal.

摘要翻译： 本发明涉及一种电子器件及其制造方法，该电子器件及其制造方法具有外部区域接触并且具有重新布线结构，并且还具有具有接触区域的半导体芯片，所述外部区域触点至少借助于 重新布线结构以及具有化学或电化学选择性沉积金属的外部区域接触和/或重新布线结构。

公开(公告)号：US20080160828A1

公开(公告)日：2008-07-03

申请号：US11622503

申请日：2007-01-12

申请人： Jochen Dangelmaier ,  Stefan Paulus ,  Cyrus Ghahremani ,  Uwe Schindler ,  Rudolf Siegfried Lehner

发明人： Jochen Dangelmaier ,  Stefan Paulus ,  Cyrus Ghahremani ,  Uwe Schindler ,  Rudolf Siegfried Lehner

IPC分类号： H01R33/945

CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4255 ,  H05K1/0284 ,  Y10T29/49117

摘要： Connector module and method of manufacturing same A connector module (31, 71) comprises a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72), a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73).

摘要翻译： 连接器模块及其制造方法A连接器模块（31,71）包括具有用于电接触光电模块（72）的第一触点（27）的基体（21），用于电子地接触板的第二触点（25） 和用于电连接基体（21）的表面上的第一（27）和第二（25）触点的导电迹线（23）和模制部分（33），模制部分（33）被浇铸到 穿过表面的第一部分的基体（21）和限定用于引入纤维（73）的通孔（13,19,37）的基体（21）和/或模制部分（33）。

公开(公告)号：US20070217734A1

公开(公告)日：2007-09-20

申请号：US11679601

申请日：2007-02-27

申请人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

发明人： Albert Auburger ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Thomas Lichtenegger ,  Stefan Paulus ,  Jean Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC分类号： G02B6/26

CPC分类号： G02B6/4202 ,  G02B6/423 ,  H01L31/0203 ,  H01L31/125 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。

公开(公告)号：US07221048B2

公开(公告)日：2007-05-22

申请号：US11046892

申请日：2005-02-01

申请人： Frank Daeche ,  Jochen Dangelmaier ,  Stefan Paulus ,  Bernd Stadler ,  Horst Theuss ,  Michael Weber

发明人： Frank Daeche ,  Jochen Dangelmaier ,  Stefan Paulus ,  Bernd Stadler ,  Horst Theuss ,  Michael Weber

IPC分类号： H01L23/12 ,  H01L23/48

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/055 ,  H01L23/3121 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49861 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/2072 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.

摘要翻译： 多层电路载体，电子器件和面板以及制造多层电路载体的方法包括至少一个半导体芯片，至少一个具有重新布线结构的重新布线层以及具有通道结构的至少一个绝缘层。