摘要:
A composition which can provide a foamed product (non-crosslinked or crosslinked foamed product) having low specific gravity and low compression set (CS), excelling in the tensile strength properties and the tear strength properties, as well as in impact resilience, and exhibiting a less decrease in hardness at high temperatures; a foamed product produced therefrom; and a laminate produced using the foamed product are provided. A resin composition for a foamed product comprising 5 to 95 pars by weight of an ethylene/α-olefin copolymer (A1), 5 to 95 parts by weight of a styrene block copolymer (B), and based on 100 parts by weight of the total of components (A1) and (B), 0 to 1900 parts by weight of an ethylene/polar monomer copolymer (A2).
摘要:
A guided vehicle transportation system is described in the application. The system includes guard wheels and a guard rail positioned along a center line of a guide track. The guard rail has a groove in which the guard wheels are received with a predetermined clearance between the periphery of the guard wheels and side walls of the groove. The guard rail has a flange extending toward the groove at the top of each side wall. The vehicle has first arms extending in longitudinal direction and being attached rotatably at a central part of an axle provided for suspending each pair of front wheels and rear wheels, and the guard wheels are attached rotatably and directly to the both end parts of the first arms or attached rotatably to both end parts of second arms each of which is attached to a corresponding end part of the first arms.
摘要:
A semiconductor device includes a wiring board, a first semiconductor chip disposed over the wiring board, a stack of second semiconductor chips disposed over the first semiconductor chip; and a first connection structure connecting the first semiconductor chip and the stack of second semiconductor chips. The first connection structure includes first and second connection electrodes disposed on the first semiconductor chip and a closest second semiconductor chip of the stack, respectively. The closest second semiconductor chip is closest to the first semiconductor chip. A bonding material bonds the first and second connection electrodes.
摘要:
Provided is a railway type feeder-lineless traffic system in which the weight of a vehicle is reduced while the structure of the vehicle is simplified, and it is possible to carry out a quick charge during a brief stopping time at a station or the like. A charging method in a feeder-lineless traffic system in which a vehicle mounted thereon with an electric storage unit runs on a predetermined pathway with the use of a power, and the electric storage unit in the vehicle is charged from a charger set up on the pathway, wherein a contact charging way in which a power feeder 24 connected to the charger 21 set up on the ground is made into contact with a power receiver 6 mounted on a vehicle 1 is carried out when the vehicle 1 comes to a stop, and a commercial electric power is converted by the charger and a charge control unit of the charger into a DC power which is chargeable direct into the electric storage unit 1, and the DC power is quickly charged into the electric storage unit through the intermediary of the power feeder and the power receiver while a current value of the DC power is controlled.
摘要:
A semiconductor device includes a plurality of semiconductor packages each with a semiconductor element and a flexible board. The flexible board is wider than the semiconductor element and is electrically connected to the semiconductor element. The plurality of semiconductor packages are stacked on one surface of a mother board. The semiconductor element is positioned between the flexible boards of the semiconductor packages in adjacent layers. The flexible boards in the adjacent layers are joined together at junction portions positioned at a part of the flexible boards which sticks out from an area in which the semiconductor elements and the flexible boards overlap. A reinforcing resin is provided in at least a part of the area between the flexible boards in the adjacent layers and between the junction portion of the flexible boards and the corresponding semiconductor element. The reinforcing resin contacts at least a part of the adjacent flexible board.
摘要:
A guided vehicle transportation system is provided with which toppling down of the vehicle is prevented even when strong lateral external force exerts on the vehicle. The fail-safe mechanism of the system is composed such that a guard rail 31 having a flange 34 extending horizontally at the upper part of each of its vertical guide surfaces for guiding guard wheels 22, 23 provided to the vehicle is laid down on a guide track 3 (depression 10) along the center lone thereof, the vehicle is provided with automatic steering mechanisms 09 and actuators 06 for steering front and rear traveling wheels, and said guard wheels are provided to the vehicle rotatable in a lateral plane and received in the groove of the guard rail 31. A subsidiary guard wheel 33, which is smaller in diameter than that of the guard wheel 22(23), is provided thereon to be rotatable together with the guard wheel 22(23). When the vehicle is moved laterally by strong lateral external force due to a gust of cross wind, the subsidiary guard wheel 33 comes under the flange 34 of the guard rail 31 and heeling over and toppling down of the vehicle can be prevented.
摘要:
A container for an optical fiber coil and an optical fiber module including the container is provided, wherein an excess length portion of a pigtail fiber is accommodated in the container and the remaining portion can be drawn out from the container. The container includes a first part for accommodating a coil having a functional optical fiber, and a second part disposed on an outer periphery side of the first part and windingly accommodating a pigtail fiber that is optically connected to the functional optical fiber. The second part has a gap that extends over the entirety of the outer periphery, and communicates with the exterior. The optical fiber module includes the container, the coil having the functional optical fiber accommodated in the first part of the container, and the pigtail fiber that is optically connected to the functional fiber and that has a portion windingly accommodated in the second part.
摘要:
An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL0 from the data transferring element to a first branch point S1 where a branch line is branched at a shortest distance from the data transferring element is configured to become equal to or greater than a wiring length TL1 from the first branch point S1 to a second branch point S2 where a second branch line is branched. A wiring length TL3 from the second branch point S2 to a third branch point S3 where a third branch line is branched is configured to become greater than the wiring lengths TL0 and TL1.
摘要:
A semiconductor device is provided with a film substrate that has through-vias that are formed by filling a conductive material in through-holes that pass through the front and rear of a film-shaped substrate body and wiring or terminals that connect to the through-vias, with a semiconductor element being mounted on the film-shaped substrate body by terminal members thereof being electrically connected to the wiring or terminals of the film substrate.
摘要:
A switch to be used mainly for controlling a variety of electronic devices in automobiles, and a method of manufacturing the same switch are disclosed for providing a switch free from positional deviation in its display section and easy to manufacture. Operating units having no display sections are mounted to a housing, then the shapes of each one of the operating units are recognized by a control circuit. An upper jig and a lower jig are moved for a laser beam device to remove a non-translucent section and expose parts of a translucent section, thereby forming the display sections. This structure allows eliminating positional deviation of the display sections and also requiring no visual checks done for confirming the display sections in manufacturing.