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公开(公告)号：US10217731B2
公开(公告)日：2019-02-26
申请号：US15529112
申请日：2015-11-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Thomas Schwarz , Stefan Grötsch
Abstract: A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying a logic chip, each having at least one integrated circuit, to the carrier units; C) applying emitter regions that generate radiation, which can be individually electrically controlled; D) covering the emitter regions and the logic chips with a protective material; E) overmolding the emitter regions and the logic chips so that a cast body is formed, which joins the carrier units, the logic chips and the emitter regions to one another; F) removing the protective material and applying electrical conductor paths to the upper sides of the logic chips and to a cast body upper side; and G) dividing the carrier assembly into the modules.
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公开(公告)号：US09591705B2
公开(公告)日：2017-03-07
申请号：US14653816
申请日：2014-01-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Norbert Häfner , Ulrich Frei , Stefan Grötsch , Rainer Huber
CPC classification number: H05B33/0815 , B60Q1/1407 , H05B33/083 , H05B33/0845 , H05B33/089 , Y02B20/341
Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.
Abstract translation: 设置一种方法来操作具有布置在电串联电路中的N个发射辐射半导体芯片的布置。 该装置包括多个开关元件，其中对于每个半导体芯片，开关元件中的一个并联电连接。 该装置包括用于相互独立地激活开关元件的控制器。 该装置包括用于使串联电路通电的恒流电路。 当关断时，与开关元件相关联的各个半导体芯片由开关元件电气桥接。 设置该配置的保护模块以减少或防止当半导体芯片中的一个或多个被切断时的电流峰值。
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公开(公告)号：US20150351176A1
公开(公告)日：2015-12-03
申请号：US14653816
申请日：2014-01-07
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Norbert Häfner , Ulrich Frei , Stefan Grötsch , Rainer Huber
CPC classification number: H05B33/0815 , B60Q1/1407 , H05B33/083 , H05B33/0845 , H05B33/089 , Y02B20/341
Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.
Abstract translation: 设置一种方法来操作具有布置在电串联电路中的N个发射辐射半导体芯片的布置。 该装置包括多个开关元件，其中对于每个半导体芯片，开关元件中的一个并联电连接。 该装置包括用于相互独立地激活开关元件的控制器。 该装置包括用于使串联电路通电的恒流电路。 当关断时，与开关元件相关联的各个半导体芯片由开关元件电气桥接。 设置该配置的保护模块以减少或防止当半导体芯片中的一个或多个被切断时的电流峰值。
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公开(公告)号：US20150319814A1
公开(公告)日：2015-11-05
申请号：US14443989
申请日：2013-11-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Stefan Grötsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
IPC: H05B33/08
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
Abstract translation: 光电子半导体部件包括具有用于产生辐射或用于接收辐射的活动区域的第一功能区域和适于有助于驱动第一功能区域的第二功能区域。 第一功能区域和第二功能区域集成在相同的载体基板上。
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公开(公告)号：US10582585B2
公开(公告)日：2020-03-03
申请号：US16256879
申请日：2019-01-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Stefan Grötsch , Stephan Pawlik , Michael Wittmann , Uli Hiller
Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.
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Patent Agency Ranking
公开(公告)号：US20200060004A1
公开(公告)日：2020-02-20
申请号：US16484612
申请日：2018-03-09
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thorsten Baumheinrich , Stefan Grötsch
IPC: H05B33/08
Abstract: A method of operating an optoelectronic component, including a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, and the temperature sensors thermally conductively connect to the picture elements, the method including acquiring temperature values supplied by the temperature sensors; and controlling the picture elements in dependence on the acquired temperature values.
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公开(公告)号：US20190230763A1
公开(公告)日：2019-07-25
申请号：US16256879
申请日：2019-01-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Stefan Grötsch , Stephan Pawlik , Michael Wittmann , Uli Hiller
Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.
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公开(公告)号：US20180151548A1
公开(公告)日：2018-05-31
申请号：US15578240
申请日：2016-05-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Alexander F. Pfeuffer , Norwin von Malm , Stefan Grötsch , Andreas Plößl
CPC classification number: H01L25/18 , H01L25/50 , H01L27/1214 , H01L27/156 , H01L33/0079 , H01L33/08 , H01L33/22 , H01L33/32 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2933/0066 , H01L2933/0075
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a semiconductor chip subdivided into a plurality of pixels, the pixels being arranged next to one another in a lateral direction and being configured to be activated individually and independently and a metallic connecting element having an upper side and an underside, the connecting element including a contiguous metallic connecting layer, which is completely passed through by a plurality of first metallic through-connections arranged next to one another in the lateral direction, wherein the first through-connections are electrically insulated and spaced from the connecting layer by insulating regions, wherein each first through-connection is unambiguously assigned to one pixel, is electrically-conductively connected to this pixel and forms a first electrical contact to this pixel, and wherein the semiconductor chip is connected by the connecting element to a carrier.
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公开(公告)号：US20180033931A1
公开(公告)日：2018-02-01
申请号：US15730214
申请日：2017-10-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Johann Ramchen , David Racz , Hans-Christoph Gallmeier , Stefan Grötsch , Simon Jerebic
IPC: H01L33/60 , H01L33/46 , H01L23/29 , H01L33/62 , H01L33/54 , H01L23/31 , H01L25/16 , H01L25/075 , H01L23/00 , H01L23/60 , H01L31/0232
CPC classification number: H01L33/60 , H01L23/295 , H01L23/3121 , H01L23/60 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0753 , H01L25/167 , H01L31/0232 , H01L33/46 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01023 , H01L2924/01079 , H01L2924/05032 , H01L2924/05432 , H01L2924/12036 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45099
Abstract: An optoelectronic semiconductor device includes a carrier having a carrier top side, at least one optoelectronic semiconductor chip arranged at the carrier top side and having a radiation main side remote from the carrier top side, at least one bonding wire, at least one covering body on the radiation main side, and at least one reflective potting compound surrounding the semiconductor chip in a lateral direction and extending from the carrier top side at least as far as the radiation main side, wherein the bonding wire is completely covered by the reflective potting compound or completely covered by the reflective potting compound and the covering body, the bonding wire is fixed to the semiconductor chip in an electrical connection region on the radiation main side, and the electrical connection region is free of the covering body and covered partly or completely by the reflective potting compound.
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公开(公告)号：US09871075B2
公开(公告)日：2018-01-16
申请号：US14443989
申请日：2013-11-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Grötsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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