公开(公告)号：US07378326B2

公开(公告)日：2008-05-27

申请号：US11365219

申请日：2006-02-28

申请人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Ho Sik Jeon

发明人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk Hyeon Cho ,  Ho Sik Jeon

IPC分类号： H01L21/20 ,  H05K3/30

CPC分类号： H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

摘要翻译： 具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。 还公开了印刷电路板的制造方法。

公开(公告)号：US07328504B2

公开(公告)日：2008-02-12

申请号：US11453790

申请日：2006-06-15

申请人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

发明人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

IPC分类号： H05K3/30 ,  H05K3/34 ,  H01K3/10

CPC分类号： H05K1/188 ,  H05K1/185 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

摘要翻译： 公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120）， 步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。 步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。

公开(公告)号：US20070187810A1

公开(公告)日：2007-08-16

申请号：US11706223

申请日：2007-02-15

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Dong-Jin Park

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Dong-Jin Park

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/48237 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper substrate; (b) mounting an upper semiconductor chip on the other side of the upper substrate; (c) forming a lower substrate cavity in one side of a lower substrate; (d) mounting a lower semiconductor chip in the lower substrate cavity formed in the lower substrate; and (e) stacking the upper substrate above the lower substrate such that the first upper substrate cavity accommodates a part of the lower semiconductor chip. The package on package and a manufacturing method thereof can reduce the overall thickness of the package by forming cavities in both upper and lower substrates to accommodate a semiconductor chip mounted in the lower substrate.

摘要翻译： 本发明的一个方面的特征在于具有空腔的封装的封装的制造方法。 该方法可以包括（a）在上基板的一侧中形成第一上基板空腔; （b）将上半导体芯片安装在上基板的另一侧上; （c）在下基板的一侧中形成下基板空腔; （d）将下半导体芯片安装在形成在下基板中的下基板空腔中; 和（e）将上基板堆叠在下基板上方，使得第一上基板空腔容纳下半导体芯片的一部分。 封装上的封装及其制造方法可以通过在上基板和下基板中形成空腔来容纳安装在下基板中的半导体芯片来减小封装的整体厚度。

公开(公告)号：US20070059917A1

公开(公告)日：2007-03-15

申请号：US11520729

申请日：2006-09-14

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

摘要： A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

摘要翻译： 公开了一种具有精细图案的印刷电路板的制造方法，包括：提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

公开(公告)号：US08410373B2

公开(公告)日：2013-04-02

申请号：US12801724

申请日：2010-06-22

申请人： Hyung Wook Park ,  Young Chang Joo ,  Hong Seok Min ,  Young Gwan Ko ,  Chang Sup Ryu ,  Ho Young Lee ,  Shin Bok Lee ,  Min Suk Jung

发明人： Hyung Wook Park ,  Young Chang Joo ,  Hong Seok Min ,  Young Gwan Ko ,  Chang Sup Ryu ,  Ho Young Lee ,  Shin Bok Lee ,  Min Suk Jung

IPC分类号： H05K1/03 ,  H05K3/36

CPC分类号： H05K3/244 ,  H05K2201/0338 ,  H05K2201/0769 ,  Y10T29/49126 ,  Y10T29/49155

摘要： Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same.

摘要翻译： 这里公开了印刷电路基板及其制造方法。 印刷电路基板包括绝缘层和电路层，该电路层包括布置在绝缘层上的电路图案和阻挡层，该阻挡层设置成覆盖电路图案的至少一个表面并抑制电路从电路图案的电化学迁移，由此 使得可以实现高密度和可靠性的可靠性及其制造方法。

公开(公告)号：US08310840B2

公开(公告)日：2012-11-13

申请号：US12222057

申请日：2008-07-31

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K7/00

CPC分类号： H05K9/0039 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.

摘要翻译： 公开了一种电磁带隙结构和包括该电阻带隙结构的印刷电路板。 根据本发明的实施例，印刷电路板可以包括介电层，多个导电板和缝合通孔，其被配置为将导电板彼此电连接。 缝合通孔可以穿过介电层，并且缝合通孔的一部分可以放置在与放置导电板的平坦表面不同的平面表面中。 利用本发明，电磁带隙结构可以防止预定频带的信号被传送。

公开(公告)号：US20120199388A1

公开(公告)日：2012-08-09

申请号：US13449847

申请日：2012-04-18

申请人： Joon-Sung KIM ,  Je-Gwang YOO ,  Chang-Sup RYU

发明人： Joon-Sung KIM ,  Je-Gwang YOO ,  Chang-Sup RYU

IPC分类号： H05K1/11 ,  H05K1/00

CPC分类号： H05K3/007 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09736 ,  H05K2203/0156 ,  H05K2203/1394 ,  H05K2203/1476 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board including: an insulation layer; a first circuit pattern formed over one surface of the insulation layer, the first circuit pattern having a side thereof slanted with respect to the insulation layer; and a second circuit pattern formed over the other surface of the insulation layer, the second circuit pattern having a side thereof slanted with respect to the insulation layer, wherein the side of the second circuit pattern is less slanted than the side of the first circuit pattern.

摘要翻译： 一种印刷电路板，包括：绝缘层; 在所述绝缘层的一个表面上形成的第一电路图案，所述第一电路图案具有相对于所述绝缘层倾斜的一侧; 以及形成在所述绝缘层的另一个表面上的第二电路图案，所述第二电路图案具有相对于所述绝缘层倾斜的一侧，其中所述第二电路图案的一侧比所述第一电路图案的侧面倾斜 。

公开(公告)号：US20120168220A1

公开(公告)日：2012-07-05

申请号：US13281264

申请日：2011-10-25

申请人： Han Ul Lee ,  Byung Bae SEO ,  Chang Sup RYU ,  Yong Sam LEE

发明人： Han Ul Lee ,  Byung Bae SEO ,  Chang Sup RYU ,  Yong Sam LEE

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K3/429 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/107 ,  H05K2203/1572 ,  Y10T29/49165

摘要： Disclosed herein are a multi-layer printed circuit board and a method of manufacturing the same. In the multi-layer printed circuit board and the method of manufacturing the same, circuit layers formed in a plurality of insulating layers are electrically interconnected through vias formed in a lump, thereby making it possible to secure bonding reliability of an interlayer circuit layer and more stably secure performance of the printed circuit board. In addition, since a stacked type via structure may be implemented by performing a via hole drilling process, a desmear process, and a copper plating process only one time after an insulating layer and an circuit layer are stacked, a manufacturing process, a manufacturing time, and manufacturing costs of the stacked type via structure may be reduced.

摘要翻译： 这里公开了多层印刷电路板及其制造方法。 在多层印刷电路板及其制造方法中，形成在多个绝缘层中的电路层通过一体形成的通孔电连接，从而可以确保层间电路层的结合可靠性和更多 稳定地确保印刷电路板的性能。 此外，由于堆叠型通孔结构可以通过在绝缘层和电路层堆叠后一次进行通孔钻孔工艺，去污工艺和镀铜处理来实现，制造工艺，制造时间 ，并且可以减小层叠型通孔结构的制造成本。

公开(公告)号：US20120138336A1

公开(公告)日：2012-06-07

申请号：US13091074

申请日：2011-04-20

申请人： Ryoichi WATANABE ,  Going Sik KIM ,  Chang Sup RYU

发明人： Ryoichi WATANABE ,  Going Sik KIM ,  Chang Sup RYU

IPC分类号： H05K1/02 ,  B05D5/12

CPC分类号： H05K3/107 ,  H01L2224/05557 ,  H05K3/108 ,  H05K3/381

摘要： Disclosed herein is a printed circuit board and a method of manufacturing the same, in which a circuit pattern one end of which is embedded in a trench and the other end of which protrudes from an insulating layer is formed, so that the circuit pattern is not easily separated from the insulating layer and the separation problems of the circuit pattern due to undercutting are solved. Also, the adhesion between the insulating layer and the circuit pattern is enhanced, more stably forming a fine circuit pattern. Even when a plating resist is formed thin, it is possible to form the circuit pattern, resulting in a high-solution circuit pattern.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，其中形成其一端嵌入沟槽中的电路图案，其另一端从绝缘层突出，使得电路图案不是 容易地与绝缘层分离，并且解决了由于底切引起的电路图案的分离问题。 此外，增强了绝缘层和电路图案之间的粘合性，更稳定地形成精细电路图案。 即使电镀抗蚀剂形成得较薄，也可形成电路图案，形成高溶液电路图形。

公开(公告)号：US08169790B2

公开(公告)日：2012-05-01

申请号：US12010561

申请日：2008-01-25

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K7/00

CPC分类号： H01P1/2005 ,  H01L2224/16225 ,  H01Q15/006 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.

摘要翻译： 公开了一种具有电磁带隙的电磁带隙结构和印刷电路板，该电磁带隙拦截了频带范围内的信号的传送。 电磁带隙结构包括金属层; 介电层，堆叠在金属层上; 至少两个金属板，堆叠在介电层的相同平面上; 和缝合通孔，连接相邻的金属板。 缝合通孔穿过电介质层，并且缝合通孔的一部分被放置在金属层的同一平面上。 利用本发明，电磁带隙可以通过具有紧凑的尺寸和低的带隙频率来降低​​特定频率的噪声。