公开(公告)号：US20230337359A1

公开(公告)日：2023-10-19

申请号：US18338439

申请日：2023-06-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takashi KITAHARA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/093

Abstract: A circuit board includes a grounding land conductor that is provided on a first main surface of a base material, and overlaps with a region in which an electronic component of a bump connection type is mounted, when viewed in a direction perpendicular to the first main surface. The grounding land conductor includes a mounting pad portion on which a bump of the electronic component is mounted, a common portion that overlaps with the electronic component, when viewed in the direction perpendicular to the main surface, and a connecting portion that connects the mounting pad portion and the common portion and is smaller in width than the mounting pad portion.

公开(公告)号：US11768404B1

公开(公告)日：2023-09-26

申请号：US18076018

申请日：2022-12-06

Applicant: Xiamen Tianma Microelectronics Co., Ltd.

Inventor： Liu Wang ,  Jian Liu ,  Zhijie Wang ,  Shumao Wu ,  Guochang Lai

IPC: G02F1/00 ,  G02F1/1335 ,  G02F1/13357 ,  H05K1/11

CPC classification number: G02F1/133612 ,  G02F1/133603 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10106

Abstract: Provided are a driving substrate, a backlight, and a display device. The driving substrate includes a plurality of backlight partitions arranged in an array. Each of the plurality of backlight partitions is provided with a first pad set column and a second pad set column, where the first pad set column and the second pad set column comprise arranged along a first direction and each include a plurality of pad sets arranged along a second direction, where the first direction intersects with the second direction. A boundary on one side of the first pad set column facing away from the second pad set column is denoted as a first boundary, and a boundary on one side of the second pad set column facing away from the first pad set column is denoted as a second boundary.

公开(公告)号：US11751326B2

公开(公告)日：2023-09-05

申请号：US17324784

申请日：2021-05-19

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Mitsuaki Morimoto

IPC: H05K1/02 ,  H05K1/11 ,  G01R1/073 ,  G01R1/067 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/0268 ,  G01R1/06794 ,  G01R1/07314 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/0346 ,  H05K1/189 ,  H05K2201/094 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09909 ,  H05K2201/10136

Abstract: An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together; and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.

公开(公告)号：US20230209713A1

公开(公告)日：2023-06-29

申请号：US17672330

申请日：2022-02-15

Applicant: KINPO ELECTRONICS, INC.

Inventor： Chuan-Wang CHANG ,  Yu-Ta LIN ,  Chen-Jung CHEN

IPC: H05K1/11 ,  H01L23/49 ,  H01L23/00

CPC classification number: H05K1/119 ,  H01L23/49 ,  H01L24/49 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2224/49173 ,  H05K2201/09027 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/0939 ,  H05K2201/094

Abstract: A pad arranging method and a pad arrangement structure for a wire bonding of a chip is provided. The method includes following steps. A soldered component and a circuit board are provided. A plurality of pads is arranged on the circuit board. a number of the pads is corresponding to a number of a plurality pins of the soldered component. The pads are disposed in a plurality of rows toward or away from the soldered component according to a predetermined arranging position, and the number of the pads on one of the rows at outer side is equal to that on one of the rows at inner side, or greater than that on one of the rows at inner side by one or more than one

公开(公告)号：US20230187855A1

公开(公告)日：2023-06-15

申请号：US17970829

申请日：2022-10-21

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Kentaro TODA

IPC: H01R12/62 ,  H05K1/11 ,  H01R12/71 ,  H05K1/02

CPC classification number: H01R12/62 ,  H01R12/714 ,  H05K1/117 ,  H05K1/0216 ,  H05K2201/094 ,  H05K2201/09045 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09672 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A connection body comprises a body having upper and lower surfaces, a first path and a second path. The first path has a first wired portion configured to be connected to a first core wire of a cable structure and a first terminal portion coupled to the first wired portion by a first coupling portion. The first wired portion, the first terminal portion and the first coupling portion are formed on the upper surface of the body. The second path has a second wired portion configured to be connected to a second core wire of the cable structure and a second terminal portion coupled to the second wired portion by a second coupling portion. The second wired portion is formed on the upper surface of the body. The second terminal portion is formed on the lower surface of the body.

公开(公告)号：US20190199025A1

公开(公告)日：2019-06-27

申请号：US16222745

申请日：2018-12-17

Applicant: LG Display Co., Ltd.

Inventor： Geunyoung KIM

IPC: H01R12/79 ,  H01R12/70 ,  H01B7/08 ,  H05K1/14 ,  H05K1/11 ,  H01B7/04

CPC classification number: H01R12/79 ,  H01B7/04 ,  H01B7/08 ,  H01R12/7011 ,  H01R12/7076 ,  H01R12/88 ,  H01R13/6461 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/118 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10356

Abstract: In at least one embodiment, the present disclosure provides a device that includes a cable. The cable includes a film. A first cable pin and a second cable pin are spaced apart from one another in a first pin region on a first face of the film. A third cable pin and a fourth cable pin are spaced apart from one another in a second pin region on a second face of the film that is opposite the first face. A first cable signal line on the first face of the film is connected to the first cable pin, and a second cable signal line on the first face of the film is connected to the second cable pin. A third cable signal line on the second face of the film is connected to the third cable pin, and a fourth cable signal line on the second face of the film is connected to the fourth cable pin.

公开(公告)号：US20180336926A1

公开(公告)日：2018-11-22

申请号：US15924541

申请日：2018-03-19

Applicant: Nidec Corporation

Inventor： Shingo Suginobu

IPC: G11B19/20 ,  H02K3/50 ,  H05K1/11 ,  H05K1/02

CPC classification number: G11B19/2045 ,  H02K1/2786 ,  H02K3/50 ,  H02K5/1677 ,  H02K5/1737 ,  H02K11/33 ,  H02K2203/03 ,  H02K2203/06 ,  H05K1/028 ,  H05K1/111 ,  H05K2201/09072 ,  H05K2201/09409 ,  H05K2201/1009 ,  H05K2201/10159 ,  H05K2201/10287

Abstract: This motor includes a base and a circuit board arranged on a lower surface of the base. The base includes a first annular portion and a second annular portion. The first annular portion is arranged under a stator. The second annular portion is arranged under a flange portion of a hub. A conducting wire drawn out from the stator is arranged to pass through a through hole defined in the first annular portion, and is soldered to a land portion of the circuit board. The second annular portion is arranged to have an axial thickness smaller than that of the first annular portion. The land portion is arranged radially inward of the through hole. The above arrangement makes it easier to achieve a reduced axial dimension of the motor while ensuring a sufficient axial dimension of the hub, which is arranged axially above the second annular portion.

公开(公告)号：US20180146551A1

公开(公告)日：2018-05-24

申请号：US15805480

申请日：2017-11-07

Applicant: Hitoshi Kida

Inventor： Hitoshi Kida

IPC: H05K1/11 ,  H05K1/14 ,  B41J2/14

CPC classification number: H05K1/11 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L27/20 ,  H01L41/042 ,  H01L41/0475 ,  H01L41/0973 ,  H05K1/028 ,  H05K1/118 ,  H05K1/14 ,  H05K3/361 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: A wiring substrate includes a plurality of wiring patterns, a protective layer to cover the plurality of wiring patterns and regions between the plurality of wiring patterns, and a plurality of terminals communicating with the plurality of wiring patterns, respectively, the plurality of terminals not covered by the protective layer. Pitch between the plurality of terminals adjacent to each other includes a first pitch and a second pitch wider than the first pitch. At least one of the plurality of wiring patterns, the terminals of which are adjacent to each other at the second pitch, includes a portion of expanded width having a width wider than a width of the plurality of terminals. The portion of expanded width is covered with the protective layer.

公开(公告)号：US20180146549A1

公开(公告)日：2018-05-24

申请号：US15804079

申请日：2017-11-06

Applicant: G-SMATT CO., LTD.

Inventor： Sung Soo KIM ,  Young Woo LEE ,  Ho Joon LEE

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K1/0393 ,  G09F13/08 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/147 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/0285

Abstract: A durable flexible circuit board for a transparent display board is connected between a driver board provided with at least one of a power supply and a controller and a transparent plate provided with a plurality of light emitting elements. The flexible circuit board includes an electrode bonding portion provided with a plurality of signal connection terminals for transferring control signals, at least one power connection terminal for transferring electric power, and at least one dummy terminal disposed outside the signal connection terminal or the power connection terminal disposed at the outermost side. The dummy terminal resists vibration and pressure applied to the signal connection terminal or the power connection terminal disposed at the outermost side. The signal connection terminal and the power connection terminal are integrated in the flexible circuit board.

公开(公告)号：US20180103541A1

公开(公告)日：2018-04-12

申请号：US15826424

申请日：2017-11-29

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Alfredo Moncayo

IPC: H05K1/02 ,  H01L23/495 ,  H01L23/66 ,  H01L23/00 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

CPC classification number: H05K1/0246 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/30111 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/09409

Abstract: A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.