公开(公告)号：US20090086461A1

公开(公告)日：2009-04-02

申请号：US12282317

申请日：2006-12-14

Applicant: Ki Min Lee

Inventor： Ki Min Lee

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K5/064 ,  H05K9/0049 ,  H05K2201/10287 ,  H05K2201/10303 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A shielding apparatus is provided. The shielding apparatus comprises a substrate on which an electronic device is mounted, a molding layer on the substrate, a conductor layer on a surface of the molding layer, and a ground member electrically connecting a ground terminal of the substrate with the conductor layer.

Abstract translation: 提供一种屏蔽装置。 屏蔽装置包括其上安装电子装置的基板，基板上的成型层，成型层的表面上的导体层，以及将基板的接地端子与导体层电连接的接地部件。

公开(公告)号：US20080258314A1

公开(公告)日：2008-10-23

申请号：US12037203

申请日：2008-02-26

Applicant: Hoi-Jun Yoo ,  Yongsang KIM ,  Hyejung KIM

Inventor： Hoi-Jun Yoo ,  Yongsang KIM ,  Hyejung KIM

IPC: H01L23/49 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L23/14 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/038 ,  H05K3/143 ,  H05K3/326 ,  H05K2201/029 ,  H05K2201/10287 ,  H05K2203/0221 ,  H01L2224/83851 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved.

Abstract translation: 提供了一种织物类型的半导体器件封装。 该织物类型的半导体器件封装包括织物类型的印刷电路板，其包括织物和通过在织物上图形化导电材料形成的引线单元，半导体器件包括结合到织物型印刷电路板的引线单元的电极单元， 以及用于密封织物型印刷电路板和半导体器件的模制单元。 在根据本发明的织物类型的半导体器件封装中，使用由织物形成的织物型印刷电路板，以使外来物质的感觉最小化。 可以容易地安装织物类型的半导体器件封装。 可以提高织物型半导体器件封装的生产率。

公开(公告)号：US20080211091A1

公开(公告)日：2008-09-04

申请号：US12052863

申请日：2008-03-21

Applicant: Alfred Kemper ,  Guido Strotmann

Inventor： Alfred Kemper ,  Guido Strotmann

IPC: H01L23/48 ,  B23K20/10

CPC classification number: H05K3/328 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48458 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

Abstract translation: 一种用于生产功率半导体模块的方法，包括通过超声波焊接形成作为超声波焊接接点的接触区域和接触元件之间的接触。 超声波焊接操作也用于将接触区域与接触端部接合，并且因此用于接合触头和脚部区域。

公开(公告)号：US20080204196A1

公开(公告)日：2008-08-28

申请号：US12035858

申请日：2008-02-22

Applicant: Shunji BABA

Inventor： Shunji BABA

IPC: H04Q5/22

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0212 ,  H05K2201/10287 ,  H05K2201/2009 ,  H05K2203/1311

Abstract: According to an aspect of an embodiment, a radio frequency tag comprising: a base; a radio frequency antenna disposed on the base; a circuit chip mounted on the base and electrically connected to the radio frequency antenna, the circuit chip performing radio communication via the radio frequency antenna; and a protection sheet disposed on the radio frequency antenna, the protection sheet comprising a flexible material and rigid bodies dispersed in the flexible material so as to prevent the protection sheet from being collapsed when the radio frequency tag is bent and compressed.

Abstract translation: 根据实施例的一个方面，一种射频标签，包括：基座; 设置在基座上的射频天线; 电路芯片，其安装在所述基座上并电连接到所述射频天线，所述电路芯片经由所述射频天线执行无线电通信; 以及设置在射频天线上的保护片，保护片包括柔性材料和分散在柔性材料中的刚体，以防止当射频标签弯曲和压缩时保护片被折叠。

公开(公告)号：US20080170386A1

公开(公告)日：2008-07-17

申请号：US11654044

申请日：2007-01-17

Applicant: Stefan Albrecht Dag

Inventor： Stefan Albrecht Dag

IPC: F21S8/00

CPC classification number: F21V23/00 ,  H05K3/103 ,  H05K3/281 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/063

Abstract: Take three sheets of any material. Sheets can be cut into any shape, utilizing any shape. In middle sheet cut out channels/slots/plenum to accommodate electrical wiring. In top sheet cut out holes through which wiring will be threaded from one electrical connection to another. Holes allow access to wiring and allowing wires to be connected to the electrical support for each light/light bulb. Sandwich all three sheets together to create a rigid platform. Dependent on material selected, grounding of circuitry may be required through alternate means. Cut out holes in lower sheet to accommodate optional [amended 6/29/2007] downward facing light on a separate circuit.

Abstract translation: 拿三张任何材料。 片材可以切成任何形状，使用任何形状。 在中间板切割通道/槽/集气室以适应电气接线。 在顶部切割孔中，布线将从一个电气连接到另一个电气连接。 孔允许进入接线，并允许电线连接到每个灯/灯泡的电气支架。 将所有三张纸夹在一起，创造一个刚性平台。 根据所选择的材料，电路的接地可能需要通过替代手段。 在下表中切出孔，以便在单独的电路上选择[修改6/29/2007]向下的光。

公开(公告)号：US20080150116A1

公开(公告)日：2008-06-26

申请号：US11959557

申请日：2007-12-19

Applicant: Kyung-Lae JANG ,  Kwon-Young ROH

Inventor： Kyung-Lae JANG ,  Kwon-Young ROH

IPC: H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85365 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/325 ,  H05K2201/10287 ,  H05K2201/209 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package on package includes a tower package, an upper package stacked over the lower package, a plug wire combined to any one of an upper portion of the tower package and a lower portion of the upper package, and a socket wire combined to any one of the upper portion of the lower package and the lower portion of the upper package. The plug wire is plugged into the socket wire to electrically connect the upper and lower packages.

Abstract translation: 封装的半导体封装包括塔式封装，堆叠在下封装上的上封装，组合到塔式封装的上部中的任一个和上封装的下部的插头线，以及组合到任何 下部封装的上部中的一个和上部封装的下部。 插头线插入插座线，以电连接上下包装。

公开(公告)号：US20080128158A1

公开(公告)日：2008-06-05

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of this type, the invention provides for at least one of the conductors to have a rectangular or square cross-section.

Abstract translation: 本发明涉及一种线印刷电路板或卡，其包括在连接点之间在电路板或卡上延伸和/或运行的导体。 为了改进这种类型的电路板，本发明提供至少一个导体具有矩形或正方形的横截面。

公开(公告)号：US20080105670A1

公开(公告)日：2008-05-08

申请号：US11814393

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05B3/18 ,  H05K1/02

CPC classification number: H05B3/26 ,  H05B3/28 ,  H05B2203/003 ,  H05B2203/014 ,  H05B2203/017 ,  H05K1/0212 ,  H05K2201/10287 ,  H05K2203/1115

Abstract: The invention relates to a printed circuit board or card comprising an electric circuit. In order to improve printed circuit boards of this type, the invention calls for at least one electrically conductive heating wire that can be connected to a voltage source to be provided on or in the printed circuit board or card.

Abstract translation: 本发明涉及一种包括电路的印刷电路板或卡。 为了改进这种印刷电路板，本发明要求至少一种导电加热丝，其可连接到要设置在印刷电路板或卡上或印刷电路板或卡上的电压源。

公开(公告)号：US07351096B2

公开(公告)日：2008-04-01

申请号：US11478691

申请日：2006-07-03

Applicant: Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

Inventor： Takahiro Kondou ,  Kiyoshi Sato ,  Mitsuru Kobayashi ,  Satoshi Moriyama

IPC: H01R12/24

CPC classification number: H01R24/44 ,  H01R9/0515 ,  H01R13/6658 ,  H01R2103/00 ,  H05K3/3405 ,  H05K3/3484 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/043 ,  H05K2203/0545

Abstract: A cable connector includes a contact assembly including an electrical insulating block part which is configured to incorporate plural signal contacts; and a relay wiring substrate mounted to a back of the contact assembly. The relay wiring substrate includes, on a surface, a contact connecting pad electrically connected to one of the signal contacts, a wiring connecting pad, and a wiring pattern connecting the contact connecting pad and the wiring connecting pad. The relay wiring substrate further includes a ground layer inside the relay wiring substrate. The cable connector further includes a cable connected to the relay wiring substrate by electrically connecting an end of a wiring with the wiring connecting pad. The relay wiring substrate further includes a ground pattern for matching impedance inside the relay wiring substrate.

Abstract translation: 电缆连接器包括接触组件，其包括电绝缘块部分，其被配置成结合多个信号触头; 以及安装到所述接触组件的背面的中继布线基板。 所述中继布线基板在表面上包括电连接到所述信号触点之一的接触连接焊盘，布线连接焊盘和连接所述接触连接焊盘和所述布线连接焊盘的布线图案。 继电器配线基板还包括在中继布线基板内的接地层。 电缆连接器还包括通过将布线的端部与布线连接垫电连接而连接到中继布线基板的电缆。 继电器布线基板还包括用于匹配中继布线基板内的阻抗的接地图案。

公开(公告)号：US07275953B2

公开(公告)日：2007-10-02

申请号：US11497317

申请日：2006-08-02

Applicant: Steven F. Brown ,  Robert V. Seifert, Jr. ,  Philip M. Kirshtein

Inventor： Steven F. Brown ,  Robert V. Seifert, Jr. ,  Philip M. Kirshtein

IPC: H01R12/24

CPC classification number: H01R43/0263 ,  H01R43/0256 ,  H01R43/24 ,  H05K1/026 ,  H05K1/117 ,  H05K3/301 ,  H05K2201/10287 ,  H05K2201/10424 ,  Y10S439/942

Abstract: A wire comb for mounting individual wires from multi-wire cables onto circuit boards that is mounted adjacent one or more ends of a circuit board to permit the individual wires to be spaced apart yet held in place during an over molding process; and to permit connecting the wires to the appropriate connections on the circuit board.

Abstract translation: 一种用于将单根电线从多线电缆安装到电路板上的电线梳，该电路板邻近电路板的一个或多个端部安装，以允许各个电线在过模制过程中间隔开并保持就位; 并允许将电线连接到电路板上的适当连接。