公开(公告)号：US08017438B2

公开(公告)日：2011-09-13

申请号：US11612758

申请日：2006-12-19

申请人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

发明人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC分类号： H01L21/00

CPC分类号： H01L23/5385 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 制造半导体模块的方法包括将引线框架的第一外导体附接到第一基板，其中第一基板包括在附接第一外导体之前或之后附接到第一基板的第一半导体器件。 提供了包括信号处理电路的第二基板，并且第二基板紧固到引线框架的第二外导体。

公开(公告)号：US08013441B2

公开(公告)日：2011-09-06

申请号：US11581678

申请日：2006-10-16

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/48 ,  H01L23/58 ,  H01L23/62 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One aspect of the invention relates to a power semiconductor device in lead frame technology and a method for producing the same. The power semiconductor device has a vertical current path through a power semiconductor chip. The power semiconductor chip has at least one large-area electrode on its top side and a large-area electrode on its rear side. The rear side electrode is surface-mounted on a lead frame chip island of a lead frame and the top side electrode is electrically connected to an internal lead of the lead frame via a connecting element. The connecting element has an electrically conductive film on a surface facing the top side electrode, the electrically conductive film extending from the top side electrode to the internal lead.

摘要翻译： 本发明的一个方面涉及引线框技术中的功率半导体器件及其制造方法。 功率半导体器件具有穿过功率半导体芯片的垂直电流路径。 功率半导体芯片在其顶侧具有至少一个大面积电极，在其后侧具有大面积电极。 背面电极被表面安装在引线框架的引线框架芯片岛上，并且顶侧电极经由连接元件电连接到引线框架的内部引线。 连接元件在面向顶侧电极的表面上具有导电膜，导电膜从顶侧电极延伸到内部引线。

公开(公告)号：US20110126497A1

公开(公告)日：2011-06-02

申请号：US12301910

申请日：2007-05-15

申请人： Michael Bauer ,  Karl Mauser ,  Roland Kelm ,  Kurt Stark

发明人： Michael Bauer ,  Karl Mauser ,  Roland Kelm ,  Kurt Stark

IPC分类号： B65B11/00 ,  B29C47/00 ,  B29C47/06 ,  B32B37/12 ,  B29C51/00 ,  B32B27/36 ,  B32B27/06 ,  C08L29/04

CPC分类号： C08J3/22 ,  B32B27/08 ,  B32B27/306 ,  B32B27/36 ,  B32B2250/24 ,  B32B2307/7163 ,  B32B2307/7244 ,  B32B2553/00 ,  C08J5/18 ,  C08J2329/04 ,  C08J2367/04 ,  C08L23/0861 ,  C08L29/04 ,  C08L51/003 ,  C08L67/04 ,  C08L2205/03 ,  Y10T428/31786 ,  C08L2666/18 ,  C08L2666/02 ,  C08L67/00 ,  C08L2666/14 ,  C08L2666/04 ,  C08L29/00

摘要： A method for producing a biodegradable plastic film or a composite film, and the film obtained by such method. The film has barrier properties and is made at least of a biodegradable basic plastic material and a second plastic material having barrier properties. The film is useful in particular for packaging sensitive goods.

摘要翻译： 生物降解塑料薄膜或复合薄膜的制造方法以及通过该方法得到的薄膜。 该膜具有阻隔性，并且至少具有可生物降解的基础塑料材料和具有阻隔性能的第二塑料材料。 这部电影特别适用于包装敏感商品。

公开(公告)号：US20100207277A1

公开(公告)日：2010-08-19

申请号：US10598143

申请日：2005-02-09

申请人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Thomas Engling ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/538 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

摘要翻译： 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。

公开(公告)号：US07774986B2

公开(公告)日：2010-08-17

申请号：US11230939

申请日：2005-09-20

申请人： Klaus Unterreiner ,  Michael Bauer

发明人： Klaus Unterreiner ,  Michael Bauer

IPC分类号： B60J5/04

CPC分类号： B60J5/0406 ,  B60J5/0404 ,  B60J5/0416 ,  B60J5/0463 ,  E05F11/382 ,  E05F11/488 ,  E05Y2600/56 ,  E05Y2800/742 ,  E05Y2900/55

摘要： A pre-assembly unit for a motor vehicle and for connection of such with a door frame of the motor vehicle, comprising a window frame, a side window guided at least within the window frame, a window lifting mechanism, which is joined to the side window in order to raise or lower it, and an equipment carrier connected to but disconnectable from the window frame with a wet side (N) and a dry side (T) for dividing the door frame into a wet and a dry area is provided. At least one fixing means, which joins the window lifting mechanism to the equipment carrier and can be undone from the dry side of the equipment carrier is also provided. At least one assembly preparation is provided on or in the window lifting mechanism, and is accessible from the dry side of the equipment carrier for connecting the window lifting mechanism to the door frame. A corresponding motor vehicle door as well as an assembly and disassembly method is also provided.

摘要翻译： 一种用于机动车辆并用于与机动车辆的门框架连接的预组装单元，包括窗框，至少在窗框内引导的侧窗，窗升降机构，其连接到侧面 窗口，以便升高或降低它，并且提供了连接到窗框的设备托架，其具有用于将门框分成湿和干燥区域的湿侧（N）和干燥侧（T）。 还提供了至少一个固定装置，其将窗升降机构连接到设备载体并且可以从设备载体的干燥侧撤消。 至少一个组装准备设置在窗户提升机构上或其中，并且可从设备托架的干燥侧面接近，以将窗户提升机构连接到门框。 还提供了相应的机动车门以及组装和拆卸方法。

公开(公告)号：US07768107B2

公开(公告)日：2010-08-03

申请号：US11598203

申请日：2006-11-13

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/42 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component includes at least one semiconductor chip arranged on a mounting substrate and connected thereto via bonding wires. For effective dissipation of heat, a solderable interlayer is arranged on the active upper side of the semiconductor chip and a heat sink is soldered onto the solderable interlayer. A method is also described for producing a semiconductor component with a solderable interlayer disposed on an active upper side of a semiconductor chip and with a heat sink soldered to the solderable interlayer.

摘要翻译： 半导体部件包括布置在安装基板上并通过接合线与其连接的至少一个半导体芯片。 为了有效散热，在半导体芯片的有源上侧设置可焊接中间层，将散热器焊接到可焊接中间层上。 还描述了一种用于制造具有可焊接中间层的半导体部件的方法，其设置在半导体芯片的有源上侧上并且将散热器焊接到可焊接中间层。

公开(公告)号：US07709936B2

公开(公告)日：2010-05-04

申请号：US11613897

申请日：2006-12-20

申请人： Michael Bauer ,  Stephan Stoeckl

发明人： Michael Bauer ,  Stephan Stoeckl

IPC分类号： H01L21/00

CPC分类号： H01L23/60 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。

公开(公告)号：US07612457B2

公开(公告)日：2009-11-03

申请号：US11766404

申请日：2007-06-21

申请人： Joachim Mahler ,  Alfred Haimerl ,  Angela Wieneke Kessler ,  Michael Bauer

发明人： Joachim Mahler ,  Alfred Haimerl ,  Angela Wieneke Kessler ,  Michael Bauer

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/85 ,  H01L23/29 ,  H01L23/3171 ,  H01L24/02 ,  H01L24/11 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2224/45099

摘要： An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad.

摘要翻译： 集成电路包括被配置为安装到载体的第一表面，与第一表面间隔开的集成电路的有效区域，设置在有源区域上并与有源区域电连通的接合焊盘以及设置在陶瓷无机应力缓冲层 在活动区域​​和键合垫之间。

公开(公告)号：US07602614B2

公开(公告)日：2009-10-13

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

IPC分类号： H05K7/00

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

摘要翻译： 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。

公开(公告)号：US20090039484A1

公开(公告)日：2009-02-12

申请号：US11834262

申请日：2007-08-06

申请人： Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

发明人： Joachim Mahler ,  Alfred Haimerl ,  Angela Kessler ,  Michael Bauer ,  Wolfgang Schober

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/50 ,  H01L24/83 ,  H01L24/84 ,  H01L24/86 ,  H01L2224/06181 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/37647 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/48 ,  H01L2924/00012

摘要： A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.

摘要翻译： 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人