公开(公告)号：US5357674A

公开(公告)日：1994-10-25

申请号：US101637

申请日：1993-08-04

Applicant: Marvin Lumbard

Inventor： Marvin Lumbard

IPC: H01L23/12 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4092 ,  H01L23/49534 ,  H01L23/49568 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19106 ,  H05K2201/09754 ,  H05K3/4611 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

Abstract translation: 制造用于互连集成电路器件的印刷电路板（PCB）的方法包括夹在两个多层衬底之间的引线框架。 集成电路器件安装在上基板的顶部和下基板的底部，以提供增加的封装密度。 因此，根据本发明，可以提供便于设计电路的简单构造的电子部件安装PCB，并且提供优异的连接可靠性，其可以容易地形成散热结构，并且其中与 电子元器件非常优秀。

公开(公告)号：US5311407A

公开(公告)日：1994-05-10

申请号：US876640

申请日：1992-04-30

Applicant: Marvin Lumbard

Inventor： Marvin Lumbard

IPC: H01L23/12 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/16 ,  H05K3/40 ,  H05K3/46 ,  H01L23/02

CPC classification number: H05K3/4092 ,  H01L23/49534 ,  H01L23/49568 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19106 ,  H05K2201/09754 ,  H05K3/4611 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: An improved printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

Abstract translation: 用于互连集成电路器件的改进的印刷电路板（PCB）包括夹在两个多层衬底之间的引线框架。 集成电路器件安装在上基板的顶部和下基板的底部，以提供增加的封装密度。 因此，根据本发明，可以提供便于设计电路的简单构造的电子部件安装PCB，并且提供优异的连接可靠性，其可以容易地形成散热结构，并且其中与 电子元器件非常优秀。

公开(公告)号：US5296651A

公开(公告)日：1994-03-22

申请号：US014973

申请日：1993-02-09

Applicant: Francis E. Gurrie ,  Wojtek Sudol

Inventor： Francis E. Gurrie ,  Wojtek Sudol

IPC: H01B7/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H05K1/00

CPC classification number: H05K1/0218 ,  H05K1/118 ,  H05K1/0215 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4614 ,  Y10S428/901

Abstract: A flexible circuit suitable for high density applications and having a long flexural life is disclosed. A thin film metallic ground plane deposited on a dielectric substrate electrically shields the conductor traces in the flexible circuit and eliminates cross-talk between conductor traces without reducing the flexibility or the flexural life of the flexible circuit.

Abstract translation: 公开了一种适用于高密度应用并具有长弯曲寿命的柔性电路。 沉积在电介质基板上的薄膜金属接地面电屏蔽柔性电路中的导体迹线，并消除导体迹线之间的串扰，而不会降低柔性电路的灵活性或弯曲寿命。

公开(公告)号：US5285010A

公开(公告)日：1994-02-08

申请号：US976444

申请日：1992-11-13

Applicant: Elmar Huber

Inventor： Elmar Huber

IPC: H01R12/04 ,  H01R13/03 ,  H05K3/40 ,  H05K5/00 ,  H05K1/14

CPC classification number: H05K5/0069 ,  H05K3/4092 ,  H01R13/035 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  Y10S439/931

Abstract: In a control device (11), the strip conductors (29) are applied to the interior wall (28) of the housing (15), consisting of plastic, with integrated plugs (16) with the aid of novel deposition processes. In this case the laser-assisted deposition process or the Ivonding.RTM. process can be used in a particularly advantageous manner. It is possible by means of these types of manufacture to dispose the plug connectors (24) in a simple manner in a through-bore (23) in the housing (15) and to connect them directly with the strip conductors (29) on the interior wall (28). Bonded connections (31) for connecting hybrid circuits (13), for example, can be attached in a simple manner at the other end of the strip conductors (29). Because of this, it is possible to automate the manufacturing process to a large degree and to make it inexpensive.

Abstract translation: 在控制装置（11）中，带状导体（29）借助于新颖的沉积工艺被施加到由塑料构成的壳体（15）的内壁（28）上，并具有集成塞子（16）。 在这种情况下，可以以特别有利的方式使用激光辅助沉积工艺或Ivonding（商标）工艺。 通过这些类型的制造可以将插头连接器（24）以简单的方式设置在壳体（15）中的通孔（23）中并将它们直接连接到壳体（15）中的带状导体（29）上 内墙（28）。 用于连接混合电路（13）的接合连接（31）例如可以以简单的方式附接在带状导体（29）的另一端。 因此，可以在很大程度上使制造过程自动化并使其便宜。

公开(公告)号：US4908933A

公开(公告)日：1990-03-20

申请号：US344608

申请日：1989-04-28

Applicant: Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

Inventor： Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/498 ,  H01L23/50 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: H01L21/67144 ,  H01L23/49861 ,  H05K3/4092 ,  H05K3/445 ,  H05K3/4641 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  H05K3/202 ,  H05K3/427 ,  H05K3/429 ,  Y10T29/49121

Abstract: A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.

Abstract translation: 根据本发明的用于安装电子部件的基板的制造方法包括以下步骤：在引线框架的外部电连接的部分上形成掩模，通过预浸料在引线框架的两个侧表面上形成树脂层 等等，除去掩模上的树脂层和除去掩模，并且在用于安装根据该方法制造的电子部件的基板中，基板与引线框架一体地形成，并且基板的电连接 通过通孔电镀而不使用精细的金属布线来进行引线框。

公开(公告)号：US4439815A

公开(公告)日：1984-03-27

申请号：US344426

申请日：1982-02-01

Applicant: Anthony D. Close ,  Walter A. Menn

Inventor： Anthony D. Close ,  Walter A. Menn

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/20 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H05K3/0064 ,  H05K3/306 ,  H05K1/0393 ,  H05K1/144 ,  H05K2201/0352 ,  H05K2201/09118 ,  H05K2201/096 ,  H05K2201/09754 ,  H05K2201/10272 ,  H05K2201/2036 ,  H05K2203/1327 ,  H05K3/202 ,  H05K3/3447

Abstract: A printed circuit assembly for a card file packaging system is disclosed that includes a flat flexible dielectric member having printed conductors disposed thereon patterned to form a printed circuit and a single piece rigid molded dielectric member to which the flexible member is secured for support with the molded member having molded therein at least holes to support leads of the electrical components and, hence, the components themselves of the printed circuit and to enable connection of the leads of the electrical components to the printed conductors on the flexible member, slides for tracks of the card file system and electrical connectors to connect the printed circuit assembly to the card file system.

Abstract translation: 公开了一种用于卡片文件包装系统的印刷电路组件，其包括平面柔性电介质构件，其上布置有印刷导体，图案化以形成印刷电路，以及单件刚性模制电介质构件，柔性构件被固定到该模制电介质构件上， 其中至少模制了孔，以支撑电气部件的引线，并因此支撑印刷电路的部件本身，并且能够将电气部件的引线连接到柔性部件上的印刷导体， 卡片文件系统和电连接器将印刷电路组件连接到卡片文件系统。

公开(公告)号：US3808680A

公开(公告)日：1974-05-07

申请号：US26776172

申请日：1972-06-30

Applicant: IBM

Inventor： LAFRATE P ,  RELYEA V

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K3/20 ,  H05K3/12

CPC classification number: H05K3/4092 ,  H05K1/0306 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/061 ,  H05K3/1275 ,  H05K2201/09754 ,  H05K2201/10303 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49149 ,  Y10T29/49156

Abstract: A continuous process for fabricating a substrate for mounting of an integrated circuit thereon, in which an array of conductive patterns is formed in a copper sheet on a flexible insulator by a rotogravure printing and subtractive copper etch process. The flexible insulator sheet is then cut into individual pieces and a rigid member is mounted to the opposite side of the flexible insulator from the array of conducting patterns by means of contact pins which fasten the rigid members to the flexible insulator and are electrically connected to the conducting patterns.

Abstract translation: 一种制造用于在其上安装集成电路的基板的连续工艺，其中通过凹版印刷和减色铜蚀刻工艺在柔性绝缘体上的铜片中形成导电图案阵列。 然后将柔性绝缘片切割成单独的部件，并且刚性部件借助于将刚性部件固定到柔性绝缘体的接触销安装到柔性绝缘体的与导电图案阵列相反的一侧，并且电连接到 进行模式

公开(公告)号：US12127344B2

公开(公告)日：2024-10-22

申请号：US17506881

申请日：2021-10-21

Applicant: BorgWarner Inc.

Inventor： Sisay Tadele ,  Riza Oguz ,  Alexander Dauth ,  Michael Krappel ,  Michael Degendorfer

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/36 ,  H05K2201/09754 ,  H05K2201/10325 ,  H05K2201/10977

Abstract: A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).

公开(公告)号：US09867274B2

公开(公告)日：2018-01-09

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

公开(公告)号：US20170279207A1

公开(公告)日：2017-09-28

申请号：US15076752

申请日：2016-03-22

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H01R12/71 ,  H01R12/70 ,  H01R12/91

CPC classification number: H01R12/714 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01R12/52 ,  H01R12/7005 ,  H01R12/91 ,  H01R13/2428 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/09754

Abstract: An exemplary miniature support has upper and lower spaced-apart engagement surfaces each having at least a portion that are parallel to each other. Two supports each with an end supporting the upper engagement surface and another end supporting the lower engagement surface. The two supports have a spring-like property so that the upper and lower engagement surfaces can repeatedly move between an uncompressed state when not engaged to provide an interconnection and a compressed state when engaged between two opposing boards to provide an interconnection between the boards. The connector is preferably made using 3-D printing and may be integrally made as part of a board also made using the same 3-D printing. The support may have upper and lower engagement surfaces and at least one of the at least two supports that are conductive to establish connectivity between the upper and lower engagement surfaces.