公开(公告)号：US20130320420A1

公开(公告)日：2013-12-05

申请号：US13615071

申请日：2012-09-13

申请人： Min-Feng Kao ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Chun-Chieh Chuang ,  Hsiao-Hui Tseng ,  Tzu-Hsuan Hsu

发明人： Min-Feng Kao ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Chun-Chieh Chuang ,  Hsiao-Hui Tseng ,  Tzu-Hsuan Hsu

IPC分类号： H01L31/02 ,  H01L31/18

CPC分类号： H01L31/18 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14689 ,  H01L31/02 ,  H01L31/103 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

摘要： A device includes a diode, which includes a first, a second, and a third doped region in a semiconductor substrate. The first doped region is of a first conductivity type, and has a first impurity concentration. The second doped region is of the first conductivity type, and has a second impurity concentration lower than the first impurity concentration. The second doped region encircles the first doped region. The third doped region is of a second conductivity type opposite the first conductivity type, wherein the third doped region overlaps a portion of the first doped region and a portion of the second doped region.

摘要翻译： 一种器件包括二极管，其包括半导体衬底中的第一，第二和第三掺杂区域。 第一掺杂区域是第一导电类型，并具有第一杂质浓度。 第二掺杂区域是第一导电类型，并且具有低于第一杂质浓度的第二杂质浓度。 第二掺杂区域包围第一掺杂区域。 第三掺杂区域具有与第一导电类型相反的第二导电类型，其中第三掺杂区域与第一掺杂区域的一部分和第二掺杂区域的一部分重叠。

公开(公告)号：US20130299931A1

公开(公告)日：2013-11-14

申请号：US13597007

申请日：2012-08-28

申请人： Chun-Chieh Chuang ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Keng-Yu Chou ,  Shuang-Ji Tsai ,  Min-Feng Kao

发明人： Chun-Chieh Chuang ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Keng-Yu Chou ,  Shuang-Ji Tsai ,  Min-Feng Kao

IPC分类号： H01L31/0232

CPC分类号： H01L27/1462 ,  H01L27/1464 ,  H01L27/14685

摘要： An embodiment method for forming an image sensor includes forming an anti-reflective coating over a surface of a semiconductor supporting a photodiode, forming an etching stop layer over the anti-reflective coating, forming a buffer oxide over the etching stop layer, and selectively removing a portion of the buffer oxide through etching, the etching stop layer protecting the anti-reflective coating during the etching. An embodiment image sensor includes a semiconductor disposed in an array region and in a periphery region, the semiconductor supporting a photodiode in the array region, an anti-reflective coating disposed over a surface of the semiconductor, an etching stop layer disposed over the anti-reflective coating, a thickness of the etching stop layer over the photodiode in the array region less than a thickness of the etching stop layer in the periphery region, and a buffer oxide disposed over the etching stop layer in the periphery region.

摘要翻译： 用于形成图像传感器的实施例方法包括在支撑光电二极管的半导体的表面上形成抗反射涂层，在抗反射涂层上形成蚀刻停止层，在蚀刻停止层上形成缓冲氧化物，并且选择性地去除 通过蚀刻的缓冲氧化物的一部分，在蚀刻期间保护抗反射涂层的蚀刻停止层。 一种实施方式的图像传感器包括：配置在阵列区域和外围区域中的半导体，支撑阵列区域中的光电二极管的半导体，设置在半导体表面上的抗反射涂层， 在阵列区域中的光电二极管上的蚀刻停止层的厚度小于周边区域中的蚀刻停止层的厚度，以及设置在周边区域的蚀刻停止层上的缓冲氧化物。

公开(公告)号：US20130299886A1

公开(公告)日：2013-11-14

申请号：US13620016

申请日：2012-09-14

申请人： Chun-Chieh Chuang ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Keng-Yu Chou ,  Shuang-Ji Tsai ,  Min-Feng Kao

发明人： Chun-Chieh Chuang ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Keng-Yu Chou ,  Shuang-Ji Tsai ,  Min-Feng Kao

IPC分类号： H01L27/146 ,  H01L31/0216 ,  H01L31/18

CPC分类号： H01L27/14685 ,  G02B1/11 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L31/02161 ,  H01L31/1868 ,  Y02E10/50 ,  Y02P70/521

摘要： BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer.

摘要翻译： BSI图像传感器和方法。 在一个实施例中，提供具有传感器阵列和周边区域并具有前侧和后侧表面的基板; 底部抗反射涂层（BARC）在传感器阵列区域和外围区域的上方形成在第一厚度的背侧上; 在BARC上形成第一介电层; 形成金属屏蔽; 从所述传感器阵列区域上方选择性地去除所述金属屏蔽件; 从所述传感器阵列区域上方选择性地去除所述第一介电层，其中所述BARC的第一厚度的一部分也被去除，并且在选择性地去除所述第一介电层的过程中所述BARC的第一厚度的剩余部分保留; 在BARC的其余部分和金属屏蔽层之上形成第二电介质层; 以及在所述第二介电层上形成钝化层。

公开(公告)号：US08564085B2

公开(公告)日：2013-10-22

申请号：US13185204

申请日：2011-07-18

申请人： Min-Feng Kao ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Chun-Chieh Chuang ,  Wen-De Wang

发明人： Min-Feng Kao ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Chun-Chieh Chuang ,  Wen-De Wang

IPC分类号： H01L31/14

CPC分类号： H01L27/146 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687

摘要： Provided is a method of fabricating an image sensor device. The method includes providing a first substrate having a radiation-sensing region disposed therein. The method includes providing a second substrate having a hydrogen implant layer, the hydrogen implant layer dividing the second substrate into a first portion and a second portion. The method includes bonding the first portion of the second substrate to the first substrate. The method includes after the bonding, removing the second portion of the second substrate. The method includes after the removing, forming one or more microelectronic devices in the first portion of the second substrate. The method includes forming an interconnect structure over the first portion of the second substrate, the interconnect structure containing interconnect features that are electrically coupled to the microelectronic devices.

公开(公告)号：US08440540B2

公开(公告)日：2013-05-14

申请号：US12572833

申请日：2009-10-02

申请人： Han-Chi Liu ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Yuan-Hung Liu

发明人： Han-Chi Liu ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Yuan-Hung Liu

IPC分类号： H01L21/76

CPC分类号： H01L27/14683 ,  H01L21/2652 ,  H01L21/266 ,  H01L21/76232 ,  H01L27/14627 ,  H01L27/1463

摘要： A method includes forming a protective layer with an opening over a substrate, thereafter implanting a dopant into a substrate region through the opening, the protective layer protecting a different substrate region, and reducing thickness of the protective layer. A different aspect includes etching a substrate to form a recess therein, thereafter implanting a dopant into a substrate region within the recess and through an opening in a protective layer provided over the substrate, and reducing thickness of the protective layer. Another aspect includes forming a protective layer over a substrate, forming photoresist having an opening over the protective layer, etching the protective layer through the opening to expose the substrate, etching the substrate to form a recess in the substrate, implanting a dopant into a substrate portion, the protective layer protecting a different substrate portion thereunder, and etching the protective layer to reduce its thickness.

摘要翻译： 一种方法包括在衬底上形成具有开口的保护层，然后通过开口将掺杂剂注入到衬底区域中，保护层保护不同的衬底区域，并减小保护层的厚度。 不同的方面包括蚀刻衬底以在其中形成凹陷，然后将掺杂剂注入到凹陷内的衬底区域中，并通过设置在衬底上的保护层中的开口，并且减小保护层的厚度。 另一方面包括在衬底上形成保护层，在保护层上形成具有开口的光致抗蚀剂，通过开口蚀刻保护层以暴露衬底，蚀刻衬底以在衬底中形成凹陷，将掺杂剂注入到衬底中 保护层保护其下的不同基板部分，并蚀刻保护层以减小其厚度。

公开(公告)号：US20130093036A1

公开(公告)日：2013-04-18

申请号：US13644657

申请日：2012-10-04

申请人： Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

发明人： Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0232 ,  H01L21/6835 ,  H01L23/49805 ,  H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K2201/10151 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

摘要翻译： 提供一种制造背面照射图像传感器的方法，其包括提供具有前侧和后侧的器件基板，其中在前侧形成像素，并且在像素上形成互连结构，形成再分布层（RDL），覆盖 所述互连结构将第一玻璃基板接合到所述RDL，从背面稀释并处理所述器件基板，将第二玻璃基板粘合到所述背面，移除所述第一玻璃基板，以及重新使用所述第一玻璃基板以制造另一个背面照明 图像传感器。

公开(公告)号：US08405182B2

公开(公告)日：2013-03-26

申请号：US13099092

申请日：2011-05-02

申请人： Keng-Yu Chou ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Pao-Tung Cheng ,  Wen-De Wang ,  Chun-Chieh Chuang ,  Min-Feng Kao

发明人： Keng-Yu Chou ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Pao-Tung Cheng ,  Wen-De Wang ,  Chun-Chieh Chuang ,  Min-Feng Kao

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/1464 ,  H01L27/14623 ,  H01L27/14636

摘要： Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side opposite the first side. The substrate has a pixel region and a periphery region. The image sensor device includes a plurality of radiation-sensing regions disposed in the pixel region of the substrate. Each of the radiation-sensing regions is operable to sense radiation projected toward the radiation-sensing region through the back side. The image sensor device includes a reference pixel disposed in the periphery region. The image sensor device includes an interconnect structure that is coupled to the front side of the substrate. The interconnect structure includes a plurality of interconnect layers. The image sensor device includes a film formed over the back side of the substrate. The film causes the substrate to experience a tensile stress. The image sensor device includes a radiation-blocking device disposed over the film.

摘要翻译： 提供了一种图像传感器装置。 图像传感器装置包括具有与第一侧相对的前侧和后侧的基板。 基板具有像素区域和外围区域。 图像传感器装置包括设置在基板的像素区域中的多个辐射感测区域。 每个辐射感测区域可操作以感测通过后侧朝向辐射感测区域投射的辐射。 图像传感器装置包括设置在周边区域中的参考像素。 图像传感器装置包括耦合到基板的前侧的互连结构。 互连结构包括多个互连层。 图像传感器装置包括在基板的背面上形成的膜。 该膜导致基材经受拉伸应力。 图像传感器装置包括设置在膜上的辐射阻挡装置。

公开(公告)号：US20130037958A1

公开(公告)日：2013-02-14

申请号：US13205157

申请日：2011-08-08

申请人： Cheng-Ying Ho ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Jeng-Shyan Lin ,  Wen-De Wang ,  Shih Pei Chou

发明人： Cheng-Ying Ho ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Jeng-Shyan Lin ,  Wen-De Wang ,  Shih Pei Chou

IPC分类号： H01L23/48 ,  H01L31/18

CPC分类号： H01L24/48 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/45 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05017 ,  H01L2224/05027 ,  H01L2224/05093 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/05552

摘要： An integrated circuit structure includes an interconnect structure that includes a plurality of metal layers, wherein the interconnect structure is under a semiconductor substrate. A metal pad is formed in one of the plurality of metal layers. A dielectric pad extends from a bottom surface of the semiconductor substrate up into the semiconductor substrate. An opening extends from a top surface of the semiconductor substrate down to penetrate through the semiconductor substrate and the dielectric pad. An edge of the semiconductor substrate in the opening is vertically aligned to an edge of the dielectric pad in the opening. The opening stops on a top surface of the metal pad. A dielectric spacer is disposed in the opening, wherein the dielectric spacer is formed on the edge of the semiconductor substrate and the edge of the dielectric pad.

摘要翻译： 集成电路结构包括具有多个金属层的互连结构，其中互连结构位于半导体衬底之下。 金属垫形成在多个金属层中的一个中。 电介质垫从半导体衬底的底表面延伸到半导体衬底中。 开口从半导体衬底的顶表面向下延伸以穿透半导体衬底和介电垫。 开口中的半导体衬底的边缘与开口中的电介质垫的边缘垂直对准。 开口在金属垫的顶面停止。 电介质垫片设置在开口中，其中介电隔离件形成在半导体衬底的边缘和电介质垫的边缘上。

公开(公告)号：US20130032916A1

公开(公告)日：2013-02-07

申请号：US13198111

申请日：2011-08-04

申请人： Jeng-Shyan Lin ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Shuang-Ji Tsai ,  Yueh-Chiou Lin

发明人： Jeng-Shyan Lin ,  Dun-Nian Yaung ,  Jen-Cheng Liu ,  Wen-De Wang ,  Shuang-Ji Tsai ,  Yueh-Chiou Lin

IPC分类号： H01L31/0224

CPC分类号： H01L27/14636 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L27/14623 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14689 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11916 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/83359 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An integrated circuit structure includes a semiconductor substrate, and a dielectric pad extending from a bottom surface of the semiconductor substrate up into the semiconductor substrate. A low-k dielectric layer is disposed underlying the semiconductor substrate. A first non-low-k dielectric layer is underlying the low-k dielectric layer. A metal pad is underlying the first non-low-k dielectric layer. A second non-low-k dielectric layer is underlying the metal pad. An opening extends from a top surface of the semiconductor substrate down to penetrate through the semiconductor substrate, the dielectric pad, and the low-k dielectric layer, wherein the opening lands on a top surface of the metal pad. A passivation layer includes a portion on a sidewall of the opening, wherein a portion of the passivation layer at a bottom of the opening is removed.

摘要翻译： 集成电路结构包括半导体衬底和从半导体衬底的底表面延伸到半导体衬底中的介质衬垫。 低k电介质层设置在半导体衬底下方。 第一个非低k电介质层位于低k电介质层的下面。 金属焊盘位于第一非低k电介质层的下面。 第二个非低k电介质层位于金属焊盘的下方。 开口从半导体衬底的顶表面向下延伸以穿透半导体衬底，电介质衬垫和低k电介质层，其中，开口焊接在金属衬垫的顶表面上。 钝化层包括在开口的侧壁上的部分，其中去除开口底部的钝化层的一部分。

公开(公告)号：US08338917B2

公开(公告)日：2012-12-25

申请号：US12938272

申请日：2010-11-02

申请人： Dun-Nian Yaung ,  Jen-Cheng Liu ,  Jeng-Shyan Lin ,  Wen-De Wang ,  Shu-Ting Tsai

发明人： Dun-Nian Yaung ,  Jen-Cheng Liu ,  Jeng-Shyan Lin ,  Wen-De Wang ,  Shu-Ting Tsai

IPC分类号： H01L23/02 ,  H01L21/71

CPC分类号： H01L21/78 ,  H01L23/3157 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/00

摘要： The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring structure over the seal ring region, forming a second seal ring structure over the seal ring region and adjacent to the first seal ring structure, and forming a first passivation layer disposed over the first and second seal ring structures. A semiconductor device fabricated by such a method is also provided.

摘要翻译： 本公开提供一种制造半导体器件的方法，所述方法包括提供具有密封环区域和电路区域的衬底，在所述密封环区域上形成第一密封环结构，在所述密封环上形成第二密封环结构 并且邻近第一密封环结构，以及形成设置在第一和第二密封环结构上的第一钝化层。 还提供了通过这种方法制造的半导体器件。