公开(公告)号：US20050277281A1

公开(公告)日：2005-12-15

申请号：US10864957

申请日：2004-06-10

Applicant: Valery Dubin ,  Richard Emery ,  Ming Fang

Inventor： Valery Dubin ,  Richard Emery ,  Ming Fang

IPC: H01L21/44 ,  H01L21/4763 ,  H01L21/60 ,  H01L21/768 ,  H01L23/48 ,  H01L23/49

CPC classification number: B81C1/00301 ,  B81B2207/097 ,  H01L24/11 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for making a compliant interconnect with two or more layers of metal is described herein.

Abstract translation: 本文描述了用于制造具有两层或多层金属的柔性互连的方法。

公开(公告)号：US20050244572A1

公开(公告)日：2005-11-03

申请号：US10835867

申请日：2004-04-29

Applicant: Robert Bristol ,  Bryan Rice ,  Ming Fang ,  John Barnak ,  Melissa Shell

Inventor： Robert Bristol ,  Bryan Rice ,  Ming Fang ,  John Barnak ,  Melissa Shell

IPC: B32B15/04 ,  C23C14/08 ,  C23C14/16 ,  G03F7/20 ,  G21K1/06 ,  H05H1/00

CPC classification number: G03F7/70958 ,  C23C14/083 ,  C23C14/165 ,  G03F7/70175 ,  G03F7/70916 ,  G21K1/06 ,  G21K2201/067

Abstract: Passivation coatings and gettering agents may be used in an Extreme Ultraviolet (EUV) source which uses tin (Sn) vapor as a plasma “fuel” to prevent contamination and corresponding loss of reflectivity due to tin contamination. The passivation coating may be a material to which tin does not adhere, and may be placed on reflective surfaces in the source chamber. The gettering agent may be a material that reacts strongly with tin, and may be placed outside of the collector mirrors and/or on non-reflective surfaces. A passivation coating may also be provided on the insulator between the anode and cathode of the source electrodes to prevent shorting due to tin coating the insulator surface.

Abstract translation: 钝化涂层和吸气剂可以用于使用锡（Sn）蒸气作为等离子体“燃料”的极紫外（EUV）源，以防止污染和相应的锡污染引起的反射率的损失。 钝化涂层可以是锡不粘附的材料，并且可以放置在源室中的反射表面上。 吸气剂可以是与锡强烈反应的材料，并且可以放置在集电镜和/或非反射表面之外。 也可以在源电极的阳极和阴极之间的绝缘体上提供钝化涂层，以防止由于涂覆绝缘体表面的锡而导致短路。

公开(公告)号：US06953925B2

公开(公告)日：2005-10-11

申请号：US10424482

申请日：2003-04-28

Applicant: Ming Fang ,  Fuchao Wang ,  Hai Ding

Inventor： Ming Fang ,  Fuchao Wang ,  Hai Ding

IPC: G02B3/00 ,  G02B27/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/062 ,  H01L31/10 ,  H01L31/113

CPC classification number: H01L27/14685 ,  H01L27/14601 ,  H01L27/14627 ,  H01L31/02327

Abstract: A microlens of an inorganic material having a relatively high index of refraction is formed with a convex lower surface for refracting light from above through an underlying spacer layer to converge on a photodiode therebelow. The microlens and photodiode may be replicated in an array of such elements along with color filters and CMOS circuit elements on a semiconductor chip to provide an image sensor. The spacer layer, which has a relatively low refractive index, is subjected to a selective isotropic etch through an opening in an etch mask to define a concave surface that forms an interface with the convex lower surface of the microlens upon subsequent conformal deposition of the material of the microlens.

Abstract translation: 具有较高折射率的无机材料的微透镜形成有用于通过下面的间隔层从上方折射光以会聚在其下的光电二极管上的凸下表面。 微透镜和光电二极管可以与半导体芯片上的滤色器和CMOS电路元件一起复制在这样的元件的阵列中，以提供图像传感器。 具有相对较低折射率的间隔层通过蚀刻掩模中的开口进行选择性各向同性蚀刻，以限定在随后的材料共形沉积时与微透镜的凸下表面形成界面的凹面 的微透镜。

公开(公告)号：US20050212133A1

公开(公告)日：2005-09-29

申请号：US10812464

申请日：2004-03-29

Applicant: John Barnak ,  Gerald Feldewerth ,  Ming Fang ,  Kevin Lee ,  Tzuen-Luh Huang ,  Harry Liang ,  Seshu Sattiraju ,  Margherita Chang ,  Andrew Yeoh

Inventor： John Barnak ,  Gerald Feldewerth ,  Ming Fang ,  Kevin Lee ,  Tzuen-Luh Huang ,  Harry Liang ,  Seshu Sattiraju ,  Margherita Chang ,  Andrew Yeoh

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

Abstract: Apparatus and methods of fabricating an under bump metallization structure including an adhesion layer abutting a conductive pad, a molybdenum-containing barrier layer abutting the adhesion layer, a wetting layer abutting the molybdenum-containing barrier layer, and high tin content solder material abutting the wetting layer. The wetting layer may be substantially subsumed in the high content solder forming an intermetallic compound layer. The molybdenum-containing barrier layer prevents the movement of tin in the high tin content solder material from migrating to dielectric layers abutting the conductive pad and potentially causing delamination and/or attacking any underlying structures, particularly copper structures, which may be present.

Abstract translation: 制造凸起下金属化结构的装置和方法包括邻接导电垫的粘附层，邻接粘合层的含钼阻挡层，邻接含钼阻挡层的润湿层和邻接润湿剂的高锡含量焊料 层。 润湿层可以基本上包含在形成金属间化合物层的高含量焊料中。 含钼阻挡层防止高锡含量焊料材料中的锡的移动不会迁移到邻接导电焊盘的电介质层，并可能导致分层和/或攻击可能存在的任何下面的结构，特别是铜结构。

公开(公告)号：US06915010B2

公开(公告)日：2005-07-05

申请号：US09882077

申请日：2001-06-15

Applicant: Claus Neubauer ,  Ming Fang

Inventor： Claus Neubauer ,  Ming Fang

IPC: G06K9/46 ,  G06K9/64 ,  G06K9/52

CPC classification number: G06K9/4647 ,  G06K9/6203

Abstract: The present invention provides a method for detecting an object. The method includes capturing a binary image of the object, and determining a projection of the binary image to a first axis. The method further includes determining a difference between a profile of a target object to the first axis and the projection at a plurality of positions along the first axis, and detecting the object by determining if the difference between the profile and the projection is less than a threshold at one of the plurality of positions.

Abstract translation: 本发明提供一种检测物体的方法。 该方法包括捕获对象的二进制图像，以及确定二进制图像对第一轴的投影。 该方法还包括确定目标对象与第一轴的轮廓与沿着第一轴的多个位置处的投影之间的差异，以及通过确定轮廓和投影之间的差是否小于 阈值在多个位置中的一个位置。

公开(公告)号：US20050082552A1

公开(公告)日：2005-04-21

申请号：US10864188

申请日：2004-06-08

Applicant: Ming Fang ,  Valery Dubin ,  Daoqiang Lu

Inventor： Ming Fang ,  Valery Dubin ,  Daoqiang Lu

IPC: G02B6/42 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC classification number: H01L24/16 ,  G02B6/4204 ,  G02B6/4232 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/29099

Abstract: The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.

公开(公告)号：US20050077082A1

公开(公告)日：2005-04-14

申请号：US10685659

申请日：2003-10-14

Applicant: Ming Fang ,  Valery Dubin ,  Scott Haight

Inventor： Ming Fang ,  Valery Dubin ,  Scott Haight

IPC: C25D3/32 ,  C25D5/02 ,  H01L21/288 ,  H01L21/60 ,  H01R12/04

CPC classification number: H01L24/11 ,  C25D3/32 ,  C25D5/02 ,  H01L21/2885 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00

Abstract: A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.

Abstract translation: 一种器件包括集成电路和与集成电路的一部分电接触的沉积锡。 沉积的锡通过从浴中电沉积形成。 沉积的锡包括浴的特征残留物。 该浴包括溶于水的锡化合物，强酸和磺基丙基化阴离子表面活性剂。 在另一方面，组合物包括约20至40克/升的亚磺酸甲酯磺酸盐，硫酸亚锡及其混合物之间，约100至200克/升甲磺酸，硫酸和混合物之一 和约1至2克/升一种或多种聚乙二醇烷基-3-磺丙基二醚之间。 另一方面，一种方法包括电镀锡，其电流密度大于约30mA / cm 2，电镀效率大于约95％。

公开(公告)号：US20050065744A1

公开(公告)日：2005-03-24

申请号：US10932578

申请日：2004-09-02

Applicant: Zehra Cataltepe ,  Ming Fang ,  Claus Neubauer ,  Chao Yuan

Inventor： Zehra Cataltepe ,  Ming Fang ,  Claus Neubauer ,  Chao Yuan

IPC: G01C25/00 ,  G05B9/02 ,  G05B23/02

CPC classification number: G05B23/0221 ,  G05B17/02

Abstract: A system for detecting one or more faulty sensors in a multi-sensor monitor includes a partitioning module for partitioning sensor values generated by the multi-sensor monitor into two distinct sets, a training set and a validation set. The system also includes a training module for training a model using the sensor values belonging to the training set and applying the model to each sensor value belonging to the validation set so as to determine a range of acceptable sensor values. The system further includes an estimating module for obtaining an estimated sensor value for each sensor using the model, and a fault-determining module for testing at least one sensor combination if a sensor value is not within its range of acceptable sensor values. A sensor combination includes at least one sensor whose estimated sensor value is not within the range of acceptable values.

Abstract translation: 用于检测多传感器监视器中的一个或多个故障传感器的系统包括分区模块，用于将由多传感器监视器生成的传感器值分成两个不同的集合，训练集和验证集合。 该系统还包括训练模块，用于使用属于训练集的传感器值训练模型，并将该模型应用于属于验证集的每个传感器值，以便确定可接受的传感器值的范围。 该系统还包括估计模块，用于使用该模型获得每个传感器的估计传感器值;以及故障确定模块，用于如果传感器值不在可接受传感器值的范围内，则测试至少一个传感器组合。 传感器组合包括至少一个其估计传感器值不在可接受值的范围内的传感器。

公开(公告)号：US20050049827A1

公开(公告)日：2005-03-03

申请号：US10932577

申请日：2004-09-02

Applicant: Chao Yuan ,  Claus Neubauer ,  Hans-Gerd Brummel ,  Ming Fang ,  Zehra Cataltepe

Inventor： Chao Yuan ,  Claus Neubauer ,  Hans-Gerd Brummel ,  Ming Fang ,  Zehra Cataltepe

IPC: G05B9/02 ,  G05B23/02 ,  G06F15/00 ,  G06F17/18 ,  G06F101/14

CPC classification number: G05B9/02 ,  G05B23/0254

Abstract: A system for generating a sensor model for use in sensor-based monitoring is provided. The system includes a segmenting module for segmenting a collection of sensor vectors into a plurality of bins comprising distinct sensor vectors. The system also includes a set-generating module for generating a set of statistically significant sensor vectors for each bin. The system further includes a consistency determination module for generating at least one consistent set of sensor vectors from the sets of statistically significant sensor vectors. Additionally, the system includes a model-generating module for generating a sensor model based upon the at least one consistent set.

Abstract translation: 提供了一种用于生成用于基于传感器的监测的传感器模型的系统。 该系统包括分段模块，用于将传感器向量的集合分成多个包含不同传感器向量的箱。 该系统还包括用于为每个仓生成一组统计上显着的传感器向量的集合生成模块。 所述系统还包括一致性确定模块，用于从所述统计学上有意义的传感器向量集合生成至少一个一致的传感器向量集合。 另外，该系统包括用于基于至少一个一致集合生成传感器模型的模型生成模块。

公开(公告)号：US06859555B1

公开(公告)日：2005-02-22

申请号：US09664937

申请日：2000-09-19

Applicant: Tong Fang ,  Ming Fang

Inventor： Tong Fang ,  Ming Fang

IPC: G06K9/46 ,  G06T5/00 ,  G06T7/60

CPC classification number: G06K9/4604

Abstract: A method for determining a circle in an image is disclosed. The method extracts a first pair of edge points along an x-axis of the image, extracts a second pair of edge points along a y-axis of the image, determines an intersection of a first and second line extending perpendicular from a pair of midpoints of the first and second pair of edge points respectively, and determines a radius from the intersection to any edge point.

Abstract translation: 公开了一种用于确定图像中的圆的方法。 该方法沿着图像的x轴提取第一对边缘点，沿着图像的y轴提取第二对边缘点，确定垂直于一对中点延伸的第一和第二行的交点 分别确定从交点到任何边缘点的半径。