公开(公告)号：US08779601B2

公开(公告)日：2014-07-15

申请号：US13287826

申请日：2011-11-02

Applicant: Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

Inventor： Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/48 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/157 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: An eWLB package for 3D and PoP applications includes a redistribution layer on a support wafer. A semiconductor die is coupled to the redistribution layer, and solder balls are also positioned on the redistribution layer. The die and solder balls are encapsulated in a molding compound layer, which is planarized to expose top portions of the solder balls. A second redistribution layer is formed on the planarized surface of the molding compound layer. A ball grid array can be positioned on the second redistribution layer to couple the semiconductor package to a circuit board, or additional semiconductor dies can be added, each in a respective molding compound layer. The support wafer can act as an interposer, in which case it is processed to form TSVs in electrical contact with the first redistribution layer, and a redistribution layer is formed on the opposite side of the support substrate, as well.

Abstract translation: 用于3D和PoP应用的eWLB封装包括支撑晶片上的再分配层。 半导体管芯耦合到再分配层，并且焊球也位于再分配层上。 模具和焊球被封装在模制化合物层中，其被平坦化以暴露焊球的顶部部分。 在模塑料层的平坦化表面上形成第二重分布层。 球栅阵列可以位于第二再分配层上以将半导体封装耦合到电路板，或者可以在相应的模制化合物层中添加另外的半导体管芯。 支撑晶片可以用作插入件，在这种情况下，它被处理以形成与第一再分配层电接触的TSV，并且再分配层也形成在支撑衬底的相对侧上。

公开(公告)号：US08779443B2

公开(公告)日：2014-07-15

申请号：US13629379

申请日：2012-09-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L27/15

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

公开(公告)号：US08772943B2

公开(公告)日：2014-07-08

申请号：US13313397

申请日：2011-12-07

Applicant: Xueren Zhang ,  Kim-Yong Goh

Inventor： Xueren Zhang ,  Kim-Yong Goh

IPC: H01L29/72

CPC classification number: H01L24/05 ,  H01L21/563 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05092 ,  H01L2224/05124 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05681 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/13027 ,  H01L2224/13147 ,  H01L2224/14104 ,  H01L2224/14131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An integrated circuit die has a dielectric layer positioned over all the contact pads on the integrated circuit die. Openings are provided in the dielectric layer over each of the contact pads of the integrated circuit die in order to permit electrical coupling to be made between the integrated circuit and circuit boards outside of the die. For those contact pads located in the central region of the die, the opening in the dielectric layer is in a central region of the contact pad. For those contact pads located in a peripheral region of the die, spaced adjacent the perimeter die, the opening in the dielectric layer is offset from the center of the contact pad and is positioned closer to the central region of the die than the center of the contact pad is to the central region of the die.

Abstract translation: 集成电路管芯具有位于集成电路管芯上的所有接触焊盘上的电介质层。 在集成电路管芯的每个接触焊盘上的介电层中设置开口，以便允许在集成电路和管芯外部的电路板之间进行电耦合。 对于位于管芯的中心区域的接触焊盘，电介质层中的开口位于接触焊盘的中心区域。 对于那些位于模具周边区域的接触垫，邻近周边模具间隔开，电介质层中的开口偏离接触焊盘的中心，并且位于比芯片中心更靠近模具的中心区域 接触垫是到模具的中心区域。

公开(公告)号：US20140084308A1

公开(公告)日：2014-03-27

申请号：US13629379

申请日：2012-09-27

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Wing Shenq Wong ,  Hk Looi

IPC: H01L33/48

CPC classification number: H01L25/167 ,  G01S7/4813 ,  H01L31/02325 ,  H01L31/173 ,  H01L2224/32225 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A sensor package is provided having a light sensitive component and a light emitting component attached to a same substrate. Light from the light emitting component is emitted from the package through a first opening and reflected back into the package to the light sensitive component through a second opening in the package. A glass attachment is placed between the light emitting component and the light sensitive component. A portion of the glass is removed and filled with an opaque substance to prevent light travelling between the light emitting component and the light sensitive component in the package.

Abstract translation: 提供了具有光敏部件和附接到同一基板上的发光部件的传感器封装。 来自发光部件的光从封装通过第一开口发射，并通过封装中的第二开口反射回封装到光敏部件中。 在发光部件和感光部件之间配置玻璃附件。 去除玻璃的一部分并填充不透明物质，以防止光在包装中的发光部件和光敏部件之间传播。

公开(公告)号：US20140083557A1

公开(公告)日：2014-03-27

申请号：US13625210

申请日：2012-09-24

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Gino GEORGE ,  KeenYip Koh ,  CheeChiang LEE ,  Ditto ADNAN

IPC: B65B3/06

CPC classification number: G03F7/16 ,  H01L21/6715

Abstract: A photoresist delivery system includes a photoresist pump, a photoresist reservoir coupled to the photoresist pump, and a photoresist container. A control valve is between the photoresist reservoir and the photoresist container and is movable from a closed position to an open position upon engagement of the photoresist container with the photoresist reservoir to replenish photoresist therein.

Abstract translation: 光致抗蚀剂传输系统包括光致抗蚀剂泵，耦合到光致抗蚀剂泵的光致抗蚀剂储存器和光致抗蚀剂容器。 控制阀位于光致抗蚀剂储存器和光致抗蚀剂容器之间，并且在光致抗蚀剂容器与光致抗蚀剂储存器接合时能够从关闭位置移动到打开位置，以补充其中的光致抗蚀剂。

公开(公告)号：US08680673B2

公开(公告)日：2014-03-25

申请号：US12975194

申请日：2010-12-21

Applicant: Ravi Shankar ,  Olivier Le Neel

Inventor： Ravi Shankar ,  Olivier Le Neel

IPC: H01L23/34

CPC classification number: H01L23/522 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The thermal energy transfer techniques of the disclosed embodiments utilize passive thermal energy transfer techniques to reduce undesirable side effects of trapped thermal energy at the circuit level. The trapped thermal energy may be transferred through the circuit with thermally conductive structures or elements that may be produced as part of a standard integrated circuit process. The localized and passive removal of thermal energy achieved at the circuit level rather just at the package level is both more effective and more efficient.

Abstract translation: 所公开的实施例的热能传递技术利用无源热能传递技术来减少在电路级别被捕获的热能的不期望的副作用。 捕获的热能可以通过具有导热结构或可以作为标准集成电路工艺的一部分产生的元件的电路传输。 在电路级别实现的热能的局部和被动去除，而不仅仅是在封装级别更有效和更有效。

公开(公告)号：US20140057394A1

公开(公告)日：2014-02-27

申请号：US13594498

申请日：2012-08-24

Applicant: Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

Inventor： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

IPC: H01L21/60 ,  H01L21/56

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2224/05 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A manufacturing process includes forming a reconstituted wafer, including embedding semiconductor dice in a molding compound layer and forming through-wafer vias in the layer. A fan-out redistribution layer is formed on a front side of the wafer, with electrical traces interconnecting the dice, through-wafer vias, and contact pads positioned on the redistribution layer. Solder balls are positioned on the contact pads and a molding compound layer is formed on the redistribution layer, reinforcing the solder balls. A second fan-out redistribution layer is formed on a back side of the wafer, with electrical traces interconnecting back ends of the through-wafer vias and contact pads positioned on a back face of the second redistribution layer. Flip-chips and/or surface-mounted devices are coupled to the contact pads of the second redistribution layer and encapsulated in an underfill layer formed on the back face of the second redistribution layer.

Abstract translation: 一种制造方法包括形成重构的晶片，包括将半导体晶片嵌入到模塑复合层中并在该层中形成贯通晶片通孔。 在晶片的前侧形成扇出重分布层，其中电迹线将骰子，贯穿晶片通孔和位于再分布层上的接触焊盘相互连接。 焊球定位在接触垫上，并且在再分布层上形成模塑料层，从而加强焊球。 第二扇出再分配层形成在晶片的背面上，其中电迹线互连贯通晶片通孔的后端和位于第二再分布层的背面上的接触焊盘。 翻转芯片和/或表面安装器件耦合到第二再分布层的接触焊盘，并且封装在形成在第二再分配层的背面上的底部填充层中。

公开(公告)号：US08642119B2

公开(公告)日：2014-02-04

申请号：US12888223

申请日：2010-09-22

Applicant: Wingshenq Wong ,  David Gani ,  Glenn De Los Reyes

Inventor： Wingshenq Wong ,  David Gani ,  Glenn De Los Reyes

IPC: B05D5/06

CPC classification number: B05D1/325 ,  B05D1/02 ,  G02B27/0018

Abstract: The present disclosure is directed to a camera module that includes at least a semiconducting die, an image-sensing circuit, a lens, a lens aperture, and a coating that adheres to an exterior surface of the camera module. The coating is opaque to light and prevents light from accessing the camera other than through the lens aperture. The opaque coating is applied as a fluid and is cured. In one embodiment, a mask material is selectively applied to exterior surfaces of the semiconducting die, electrical interconnect layers, glass layers, the lens body, or the lens aperture. After applying the opaque coating, the selectively applied mask material is removed. Methods of selectively applying a mask material include applying a conformable and peelably releasable dope-like material, placing an array of joined, selectively shaped rigid masks over an array of assemblies, and applying a conformable mask material that is heat-expandable.

Abstract translation: 本公开涉及一种照相机模块，其包括至少半导体裸片，图像感测电路，透镜，透镜孔径以及附着到相机模块的外表面的涂层。 涂层对于光是不透明的，并且防止除了通过透镜孔之外的光进入相机。 将不透明涂层作为流体施加并固化。 在一个实施例中，掩模材料被选择性地施加到半导体管芯，电互连层，玻璃层，透镜体或透镜孔的外表面。 在施加不透明涂层之后，去除选择性施加的掩模材料。 选择性地施加掩模材料的方法包括施加适形和可剥离的可剥离的涂料样材料，将一组连接的选择性形状的刚性掩模放置在组件阵列上，以及施加可热膨胀的适形掩模材料。

公开(公告)号：US08598681B2

公开(公告)日：2013-12-03

申请号：US13341286

申请日：2011-12-30

Applicant: Olivier Le Neel ,  Ravi Shankar

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01L29/00 ,  H01L21/20

CPC classification number: G01K7/20 ,  G01K3/005

Abstract: The present disclosure is directed to a device and a method for forming a precision temperature sensor switch with a Wheatstone bridge configuration of four resistors and a comparator. When the temperature sensor detects a temperature above a threshold, the switch will change states. The four resistors in the Wheatstone bridge have the same resistance, with three of the resistors having a low temperature coefficient of resistance and the fourth resistor having a high temperature coefficient of resistance. As the temperature increases, the resistance of the fourth resistor will change. The change in resistance of the fourth resistor will change a voltage across the bridge. The voltage across the bridge is coupled to the comparator and compares the voltage with the threshold temperature, such that when the threshold temperature is exceeded, the comparator switches the output off.

Abstract translation: 本公开涉及用于形成具有四个电阻器和比较器的惠斯登电桥配置的精密温度传感器开关的装置和方法。 当温度传感器检测到温度高于阈值时，开关将改变状态。 惠斯通电桥中的四个电阻具有相同的电阻，其中三个电阻具有低的电阻温度系数，第四电阻具有高的电阻温度系数。 随着温度的升高，第四个电阻的电阻将发生变化。 第四个电阻器的电阻变化会改变跨桥的电压。 桥上的电压耦合到比较器并将电压与阈值温度进行比较，使得当超过阈值温度时，比较器关闭输出。

公开(公告)号：US08502367B2

公开(公告)日：2013-08-06

申请号：US12893651

申请日：2010-09-29

Applicant: Jing-En Luan

Inventor： Jing-En Luan

IPC: H01L23/495

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2924/00

Abstract: An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking.

Abstract translation: 一种包括复合材料基底的电子封装。 在一个实施例中，电子封装是扩展的晶片级封装。 复合材料基底由编织线和聚合物材料组成。 在一个实施方案中，复合材料基底由编织的玻璃纤维束和环氧材料组成。 在各种实施例中，封装包括在复合材料基底的一个或另一个面上的电子电路层。 在其它实施例中，导电通孔连接电路层，包括再分配层。 在另一个实施例中，电子封装安装在复合材料基底上并电耦合到扩展的晶片级封装的电路。 具有复合材料基底的包装机械地更坚固，并且可以制成比依赖于用于结构的密封剂材料的包装，并且抗龟裂。