公开(公告)号：US06255138B1

公开(公告)日：2001-07-03

申请号：US09102351

申请日：1998-06-23

Applicant: Takahiro Haishima

Inventor： Takahiro Haishima

IPC: H01L2144

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2201/0239 ,  H05K2201/10674 ,  H05K2203/0285 ,  H01L2924/00

Abstract: A process for producing a microencapsulated electroconductive filler comprising conductive filler particles each having an insulating resin coated on the surface thereof, which comprises: a first step of treating the surface of conductive filler particles with a coupling agent having reactive functional group A at a terminal end or in a side chain of its molecule; and a second step of allowing the coupling agent having functional group A present on the surface of the conductive filler particles to undergo nonaqueous polymerization reaction with a reactant B which is polymerizable with the functional group A, to thereby form an insulating resin layer on the surface of the conductive filler particles.

Abstract translation: 一种微胶囊化导电填料的制造方法，其特征在于，在导电性填充剂粒子的表面具有绝缘性树脂的导电性填充剂粒子，其特征在于，包括：在末端用具有反应性官能团A的偶联剂处理导电性填料粒子表面的第一工序 或其分子的侧链; 并且使具有存在于导电性填料颗粒表面的官能团A的偶联剂与可与官能团A聚合的反应物B进行非水聚合反应的第二步骤，从而在表面上形成绝缘树脂层 的导电填料颗粒。

公开(公告)号：US5891365A

公开(公告)日：1999-04-06

申请号：US676292

申请日：1996-07-18

Applicant: Werner Gruenwald ,  Ralf Haug ,  Frank-Dieter Hauschild ,  Martin Seyffert ,  Holger Guenster

Inventor： Werner Gruenwald ,  Ralf Haug ,  Frank-Dieter Hauschild ,  Martin Seyffert ,  Holger Guenster

IPC: C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H01R11/01 ,  H05K3/32 ,  H01B1/20 ,  C09J5/00

CPC classification number: C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1163 ,  H05K2203/121

Abstract: An anisotropically conducting adhesive includes an adhesive base material; and conductive particles which are dispersed in the adhesive base material and which have provided on the surface of the conductive particles a separating agent comprised of at least one ligand which is selected from the group consisting of triphenylphosphine and propionic acid, which decomposes during use of the anisotropically conducting adhesive in an adhesion process and which is non-polymeric. A method for producing a bonded, electrically conductive connection between a plurality of strip connectors includes (a) providing the foregoing anisotropically conducting adhesive; (b) positioning strip connectors on opposite surfaces of the anisotropically conducting adhesive; (c) applying pressure to the anisotropically conducting adhesive and the strip connectors; and (d) decomposing the at least one ligand of the anisotropically conducting adhesive.

Abstract translation: PCT No.PCT / DE95 / 00151 Sec。 371日期：1996年7月18日 102（e）日期1996年7月18日PCT提交1995年2月7日PCT公布。 公开号WO95 / 23416 日期：1995年8月31日各向异性导电粘合剂包括粘合剂基材; 和分散在粘合剂基材中并且在导电颗粒表面上提供的分离剂的导电颗粒，该分离剂由选自三苯基膦和丙酸中的至少一种配体组成，其在使用期间分解 各向异性导电粘合剂在粘合过程中是非聚合的。 一种用于在多个条形连接器之间制造结合导电连接的方法包括（a）提供前述的各向异性导电粘合剂; （b）将条形连接器定位在各向异性导电粘合剂的相对表面上; （c）向各向异性导电粘合剂和带状连接器施加压力; 和（d）分解各向异性导电粘合剂的至少一种配体。

公开(公告)号：US5162087A

公开(公告)日：1992-11-10

申请号：US753198

申请日：1991-08-30

Applicant: Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

Inventor： Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

IPC: C09J135/00 ,  C08K9/08 ,  C09J1/02 ,  C09J9/02 ,  C09J133/04 ,  C09J133/08 ,  C09J201/00 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/323 ,  C08K9/08 ,  C09J133/08 ,  H01B1/22 ,  H01L2924/07811 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K3/361

Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

公开(公告)号：US5123986A

公开(公告)日：1992-06-23

申请号：US602715

申请日：1990-10-24

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B44C1/165

CPC classification number: H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

Abstract: A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接方法。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US20180261930A1

公开(公告)日：2018-09-13

申请号：US15907107

申请日：2018-02-27

Applicant: Yazaki Corporation ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor： Hayato Iizuka ,  Satoshi Nakai ,  Kazuma Kayo ,  Hiroshi Aihara

IPC: H01R4/04 ,  H05K3/32 ,  H01B1/22

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01R11/09 ,  H01R13/03 ,  H01R13/405 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/10272

Abstract: A conductor unit includes: a plurality of conductors each including a conducting portion covered with an insulating coating; an annular core that includes a first core constituent portion and a second core constituent portion combined with the first core constituent portion, and that interposes the conductors between the first core constituent portion and the second core constituent portion; and a holding member that makes the first core constituent portion and the second core constituent portion press and hold the conductors therebetween.

公开(公告)号：US20180192507A1

公开(公告)日：2018-07-05

申请号：US15736802

申请日：2016-05-18

Applicant: OSRAM GmbH

Inventor： Michael Schöwel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/02 ,  H05K3/46 ,  H05K3/00 ,  F21S41/19

CPC classification number: H05K1/0204 ,  F21S41/192 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/02 ,  H05K3/202 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0104 ,  H05K2201/0224 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2036

Abstract: A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. The circuit support may further include a large number of spacers which are designed and arranged in order to set a height of the second region. The circuit support may further include a second insulation material with which the second region is filled.

公开(公告)号：US09924599B2

公开(公告)日：2018-03-20

申请号：US14184733

申请日：2014-02-20

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki Ishimatsu

IPC: H05K1/18 ,  H05K13/04 ,  H01R4/04

CPC classification number: H05K1/181 ,  H01R4/04 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T156/10 ,  Y10T428/2991

Abstract: To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.

公开(公告)号：US09831211B2

公开(公告)日：2017-11-28

申请号：US15015758

申请日：2016-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunmo Chu ,  Wonsuk Chang ,  Chanmoon Chung

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/532 ,  H01B1/22 ,  H01R4/04 ,  H01R13/24

CPC classification number: H01L24/33 ,  H01B1/22 ,  H01L23/53276 ,  H01L23/5328 ,  H01L24/09 ,  H01L24/29 ,  H01L2224/29028 ,  H01L2224/29105 ,  H01L2224/29198 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/2949 ,  H01L2224/2957 ,  H01L2224/29691 ,  H01L2224/32227 ,  H01L2924/01006 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/1426 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10674 ,  H05K2203/0425

Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.

公开(公告)号：US09786463B2

公开(公告)日：2017-10-10

申请号：US13581178

申请日：2011-02-17

Applicant: Takuya Aoyagi ,  Takashi Naito ,  Yuji Hashiba ,  Kei Yoshimura ,  Shinichi Tachizono

Inventor： Takuya Aoyagi ,  Takashi Naito ,  Yuji Hashiba ,  Kei Yoshimura ,  Shinichi Tachizono

IPC: H01J11/12 ,  H01B1/22 ,  H01J9/02 ,  H01J11/22 ,  H01L31/0224 ,  H05K1/09 ,  C03C8/18 ,  H05K3/46

CPC classification number: H01J11/12 ,  C03C8/18 ,  H01B1/22 ,  H01J9/02 ,  H01J11/22 ,  H01J2211/225 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/4629 ,  H05K2201/0224 ,  Y02E10/50

Abstract: The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

公开(公告)号：US20170252804A1

公开(公告)日：2017-09-07

申请号：US15447062

申请日：2017-03-01

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： David Guy Hanni ,  James Charles Beffa ,  Robert Barrett Geyer ,  Lawrence C. Loh ,  Kelly M. Parent ,  Alfred A. Zinn

IPC: B22F3/10 ,  B22F5/00 ,  B22F1/00 ,  B33Y10/00 ,  B29C67/00

CPC classification number: B22F3/1021 ,  B22F1/0018 ,  B22F3/008 ,  B22F5/00 ,  B22F2301/10 ,  B22F2302/45 ,  B22F2998/10 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y70/00 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/1275 ,  H05K2201/0224 ,  H05K2201/0257 ,  B22F1/0062

Abstract: It is currently difficult to deposit metallic conductors as contiguous metal traces during additive manufacturing processes, particularly when dielectric materials are present that are readily heat-softened. Additive manufacturing processes can include: providing a first printing composition containing metal nanoparticles and a second printing composition containing a dielectric material; depositing the first and second printing compositions together to form an object having a desired shape, in which the metal nanoparticles are unconsolidated with one another after being deposited; and heating the object above a fusion temperature of the metal nanoparticles and below a softening temperature of the dielectric material to define one or more contiguous metal traces in the object in which the metal nanoparticles are at least partially fused together with one another in a defined shape.