公开(公告)号：US20170146566A1

公开(公告)日：2017-05-25

申请号：US15359245

申请日：2016-11-22

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge

IPC: G01R1/04

CPC classification number: G01R1/0441

Abstract: A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.

公开(公告)号：US20140340103A1

公开(公告)日：2014-11-20

申请号：US14274889

申请日：2014-05-12

Applicant: FormFactor, Inc.

Inventor： Toshihiro Kasai ,  Masanori Watanabe

IPC: G01R1/067

CPC classification number: G01R31/2887 ,  Y10T29/49117

Abstract: A probe card apparatus can comprise a tester interface to a test controller, probes for contacting terminals of electronic devices to be tested, and electrical connections there between. The probe card apparatus can comprise a primary sub-assembly, which can include the tester interface. The probe card apparatus can also comprise an interchangeable probe head, which can include the probes. The interchangeable probe head can be attached to and detached from the primary sub-assembly while the primary sub-assembly is secured to or in a housing of a test system. Different probe heads each having probes disposed in different patterns to test different types of electronic devices can thus be interchanged while the primary sub-assembly is secured to or in a housing of the test system.

Abstract translation: 探针卡装置可以包括到测试控制器的测试器接口，用于接触要测试的电子设备的端子的探针以及其间的电连接。 探针卡装置可以包括主要子组件，其可以包括测试器接口。 探针卡装置还可以包括可互换探针头，其可以包括探针。 可互换探针头可以连接到主子组件并从主子组件拆卸，同时将主子组件固定到测试系统的壳体或壳体中。 因此，可以将主要子组件固定到测试系统的壳体中或其中的每个具有以不同图案设置的探针以测试不同类型的电子设备的不同探针头。

公开(公告)号：US20140044985A1

公开(公告)日：2014-02-13

申请号：US13963402

申请日：2013-08-09

Applicant: FormFactor, Inc.

Inventor： January Kister

IPC: G01R3/00 ,  B23K26/38

CPC classification number: G01R3/00 ,  B23K26/38 ,  G01R1/06755 ,  Y10T428/12396

Abstract: A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body.

Abstract translation: 一种制造探针（和所得到的探针）的方法，包括提供金属箔，在箔的边缘上产生尖端，并且在身体的一端用一个或多个尖端从所述箔激光切割探针的主体 。

公开(公告)号：US20130096866A1

公开(公告)日：2013-04-18

申请号：US13693338

申请日：2012-12-04

Applicant: FORMFACTOR, INC.

Inventor： Todd R. Kemmerling

IPC: G01R31/3183

CPC classification number: G01R31/318307 ,  G06F8/30

Abstract: Methods, apparatus, and computer readable media for designing a custom test system are described. Examples of the invention can relate to a method of generating test system software for a semiconductor test system. In some examples, a method can include obtaining a configuration of the semiconductor test system, the configuration including a description of a device under test (DUT) and a description of test hardware; and generating an application programming interface (API) specific to the configuration of the semiconductor test system, the API being generated based on the description of the DUT and the description of the test hardware, the API providing a programming interface between the test system software and the test hardware to facilitate testing of the DUT.

公开(公告)号：US20040140822A1

公开(公告)日：2004-07-22

申请号：US10749358

申请日：2003-12-29

Applicant: FormFactor, Inc.

Inventor： Charles A. Miller

IPC: G01R001/00 ,  G01R031/02

CPC classification number: G01R1/073 ,  G01R1/06766 ,  G01R1/06772

Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.

公开(公告)号：US20040096994A1

公开(公告)日：2004-05-20

申请号：US10609263

申请日：2003-06-26

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge

IPC: H01L021/66

CPC classification number: G01R31/31926 ,  G01R1/07314 ,  G01R31/318505 ,  G01R31/31905 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed.. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

Abstract translation: 通过可拆卸地将集成电路连接到模块基板来组装电子模块。 然后以特定的操作速度对模块进行测试。如果模块在测试速度下无法正常工作，则导致故障的集成电路或电路被移除，并替换为新的集成电路，并重新测试模块。 一旦确定模块以测试速度正确运行，模块可能被评定为以测试速度运行并出售，或者模块可以以更高的速度进行测试。

公开(公告)号：US20040088670A1

公开(公告)日：2004-05-06

申请号：US10693484

申请日：2003-10-23

Applicant: FormFactor, Inc.

Inventor： Mac Stevens ,  Yves Parent

IPC: G06F017/50

CPC classification number: G06F17/5077

Abstract: An initial graph of nodes is created within a routing space, and the number and locations of the nodes in the graph are adjusted. Links are created between nodes of the graph, and traces between specified nodes are created through the linked graph.

公开(公告)号：US20040072456A1

公开(公告)日：2004-04-15

申请号：US10684094

申请日：2003-10-10

Applicant: FormFactor, Inc.

Inventor： Thomas H. Dozier II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H05K001/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48

Abstract: Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. For example, the support substrate is suitably a printed circuit board having plated through holes. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate. Variations of these two basic embodiments are described, including limiting wiping motion of the resilient contact structures across a terminal of an electronic component, and moving the resilient contact structures rather than the electronic component to effect pressure connections therebetween.

公开(公告)号：US20040046579A1

公开(公告)日：2004-03-11

申请号：US10430628

申请日：2003-05-05

Applicant: FormFactor, Inc.

Inventor： Matthew Chraft ,  Roy J. Henson ,  Charles A. Miller ,  Chih-Chiang Tseng

IPC: G01R031/02

CPC classification number: G01R1/07314 ,  G01R3/00

Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.

Abstract translation: 用于在集成电路（IC）测试器和要测试的IC的表面上的输入/输出，电源和接地焊盘之间提供信号路径的探针系统包括探针板组件，柔性电缆和一组探针， IC的I / O焊盘。 探针板组件包括一个或多个刚性衬底层，其具有形成在衬底层上或衬底层内的迹线和通孔，其提供将测试器连接到访问IC的一些衬垫的探针的相对低带宽的信号路径。 柔性电缆提供相对高带宽的信号路径，将测试仪连接到访问IC其他焊盘的探针。 柔性带可替代地设置在具有探针的基底之后。

公开(公告)号：US20040038560A1

公开(公告)日：2004-02-26

申请号：US10651821

申请日：2003-08-29

Applicant: FormFactor, Inc.

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。