公开(公告)号：US20090237770A1

公开(公告)日：2009-09-24

申请号：US12375343

申请日：2007-04-24

Applicant: Hyun-Soo Kim ,  Jeong-Woo Park ,  Bongki Mheen ,  Gyungock Kim

Inventor： Hyun-Soo Kim ,  Jeong-Woo Park ,  Bongki Mheen ,  Gyungock Kim

IPC: G02F1/015 ,  H01L29/78 ,  H01L33/00

CPC classification number: G02F1/025 ,  G02F1/225 ,  G02F1/3132 ,  H01L31/105

Abstract: Provided is an optical device with improved phase shift and propagation loss of light without decreasing the dynamic characteristics of the optical device. The optical device includes a first semiconductor layer which is doped with a first type of conductive impurities and has a uniform thickness; a gate insulating layer which has a ? shape and is formed on a portion of the first semiconductor layer and has a thin center portion; and a second semiconductor layer which covers an upper surface of the gate insulating layer and is doped with a second type of conductive impurities opposite to the first type of conductive type impurities.

Abstract translation: 提供了一种具有改善的相移和光传播损耗的光学器件，而不会降低光学器件的动态特性。 光学器件包括掺杂有第一类导电杂质并具有均匀厚度的第一半导体层; 栅绝缘层， 形成在第一半导体层的一部分上，并且具有薄的中心部分; 以及第二半导体层，其覆盖所述栅极绝缘层的上表面并且掺杂有与所述第一类型的导电类型杂质相反的第二类型的导电杂质。

公开(公告)号：US07373032B2

公开(公告)日：2008-05-13

申请号：US11450575

申请日：2006-06-09

Applicant: Jeong Woo Park ,  Hyun Sung Ko ,  Yong Soon Baek

Inventor： Jeong Woo Park ,  Hyun Sung Ko ,  Yong Soon Baek

IPC: G02B6/36 ,  H01L29/22

CPC classification number: H04B10/2504

Abstract: Provided is an optical transceiver module of an optical transceiver, which is used for optical communications. The optical transceiver module prevents electrical crosstalk between a light source and a light receiver. Additionally, the optical transceiver module includes an optical transceiver unit including a light source and a light receiver together integrated into a substrate, a circuit unit including a drive circuit driving the light source and a detect circuit reading a signal of the light receiver, and a crosstalk prevention unit connected between the substrate and ground to prevent electrical crosstalk between the light source and the light receiver.

Abstract translation: 提供了用于光通信的光收发器的光收发模块。 光收发器模块防止光源和光接收器之间的电串扰。 此外，光收发器模块包括光收发器单元，其包括一起集成到基板中的光源和光接收器，包括驱动光源的驱动电路和读取光接收器的信号的检测电路的电路单元，以及 连接在基板和接地之间的串扰防止单元，以防止光源和光接收器之间的电串扰。

公开(公告)号：US20080102410A1

公开(公告)日：2008-05-01

申请号：US11976211

申请日：2007-10-22

Applicant: Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

Inventor： Ji-Eun Kim ,  Myung-Sam Kang ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Jeong-Woo Park ,  Sang-Duck Kim

IPC: G03C5/00

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/108 ,  H05K3/20 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on the core board in correspondence with a position of the cavity; stacking a first build-up layer, on which a first outer circuit is formed, on the core board; and selectively removing the first build-up layer in correspondence with the position of the cavity and removing the first photoresist. Utilizing the method, a board can be manufactured with greater precision, as the thickness tolerance of the cavity may be obtained by controlling the thickness of the photoresist, and the overall thickness of the board can be controlled by controlling the height of the cavity.

Abstract translation: 公开了一种制造印刷电路板的方法，其中形成用于嵌入部件的空腔，其包括：提供其中埋入内部电路的芯板; 在芯板中形成层间导电的第一通孔; 在所述芯板上与所述腔的位置对应地选择性地形成第一光致抗蚀剂; 在芯板上堆叠形成有第一外部电路的第一堆积层; 并且与空腔的位置相对应地选择性地去除第一堆积层并除去第一光致抗蚀剂。 利用该方法，可以通过控制光致抗蚀剂的厚度来获得更高精度的板，因为通过控制光致抗蚀剂的厚度可以获得空腔的厚度公差，并且可以通过控制空腔的高度来控制板的整体厚度。

公开(公告)号：US08426880B2

公开(公告)日：2013-04-23

申请号：US12155877

申请日：2008-06-11

Applicant: Ho Young Song ,  Dong Yu Kim ,  Jeong Woo Park ,  Yong Chun Kim ,  Hyung Ky Back

Inventor： Ho Young Song ,  Dong Yu Kim ,  Jeong Woo Park ,  Yong Chun Kim ,  Hyung Ky Back

IPC: H01L33/00

CPC classification number: H01L33/12 ,  H01L33/16 ,  H01L33/22

Abstract: There are provided a semiconductor light emitting device that can be manufactured by a simple process and has excellent light extraction efficiency and a method of manufacturing a semiconductor light emitting device that has high reproducibility and high throughput. A semiconductor light emitting device having a substrate and a lamination in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially laminated onto the substrate according to an aspect of the invention includes a silica particle layer; and an uneven part formed at a lower part of the silica particle layer.

公开(公告)号：US08418355B2

公开(公告)日：2013-04-16

申请号：US11976071

申请日：2007-10-19

Applicant: Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

Inventor： Sang-Duck Kim ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Jeong-Woo Park

IPC: H05K3/20

CPC classification number: H05K3/20 ,  H05K3/205 ,  H05K3/207 ,  H05K3/386 ,  H05K2203/0113 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.

Abstract translation: 公开了一种形成转录电路的方法及其制造方法。 一种形成转录电路的方法，其包括通过在模板上选择性地形成抗蚀剂来形成对应于电路图案的凹版图案，将导电材料填充到凹版图案中，以及通过将载体压载到载体上而将载体转移到 使得载体面向具有填充有导电材料的模板的表面的模板，使得可以形成可以使用现有设备转录成绝缘板的转录电路，由此可以降低成本。

公开(公告)号：US08180184B2

公开(公告)日：2012-05-15

申请号：US12504607

申请日：2009-07-16

Applicant: Jeong Woo Park ,  Jongbum You ,  Gyungock Kim

Inventor： Jeong Woo Park ,  Jongbum You ,  Gyungock Kim

IPC: G02F1/035

CPC classification number: G02F1/025 ,  G02F2001/0156 ,  G02F2201/063 ,  G02F2201/12 ,  G02F2202/105 ,  G02F2202/32

Abstract: An absorption modulator is provided. The absorption modulator includes a substrate, an insulation layer disposed on the substrate, and a waveguide having a P-I-N diode structure on the insulation layer. Absorptance of an intrinsic region in the P-I-N diode structure is varied when modulating light inputted to the waveguide. The absorption modulator obtains the improved characteristics, such as high speed, low power consumption, and small size, because it greatly reduces the cross-sectional area of the P-I-N diode structure.

Abstract translation: 提供吸收调制器。 吸收调制器包括衬底，设置在衬底上的绝缘层和在绝缘层上具有P-I-N二极管结构的波导。 当调制输入到波导的光时，P-I-N二极管结构中的本征区域的吸收变化。 吸收调制器由于大大降低了P-I-N二极管结构的截面面积而获得了高速，低功耗，小尺寸等改进的特性。

公开(公告)号：US20120063714A1

公开(公告)日：2012-03-15

申请号：US13013012

申请日：2011-01-25

Applicant: Jeong Woo PARK ,  Gyungock KIM

Inventor： Jeong Woo PARK ,  Gyungock KIM

IPC: G02F1/295

CPC classification number: G02F1/025 ,  G02F1/2257 ,  G02F2201/063

Abstract: Provided are an electro-optic device with a high modulation rate and a mach-zehnder optical modulator having the same. The electro-optic device includes a slap, a rip waveguide, a first impurity region, a second impurity region, and a third impurity region. The slap is disposed on a substrate. The rip waveguide includes a mesa extending in one direction on the slap and the slap disposed under the mesa. The first impurity region is disposed in the slap of one side of the mesa. The third impurity region is disposed in the slap of the other side of the mesa to oppose the first impurity region. The second impurity region is disposed in the rip waveguide between the first impurity region and the third impurity region.

Abstract translation: 提供具有高调制率的电光装置和具有该电光装置的马赫 - 泽德光调制器。 电光装置包括拍打，裂口波导，第一杂质区，第二杂质区和第三杂质区。 拍击被设置在基板上。 裂口波导包括在拍击上沿一个方向延伸的台面和设置在台面下方的拍子。 第一杂质区设置在台面的一侧的一旁。 第三杂质区域设置在台面的另一侧的拍击中以与第一杂质区域相对。 第二杂质区设置在第一杂质区和第三杂质区之间的裂缝波导中。

公开(公告)号：US20110226626A1

公开(公告)日：2011-09-22

申请号：US13039822

申请日：2011-03-03

Applicant: Ju-il Choi ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park

Inventor： Ju-il Choi ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park

IPC: C25D5/48 ,  H01L21/306

CPC classification number: H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/6719 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate treating device may include a plating treatment portion configured to perform a plating process of a substrate, a wet treatment portion configured to perform a wet treating process of the substrate, the wet treatment portion being under the plating treatment portion, and a substrate support portion configured to support the substrate so that a plating surface of the substrate faces upward, the substrate support portion being further configured to move the substrate between the plating treatment portion and the wet treatment portion.

Abstract translation: 基板处理装置可以包括：电镀处理部，被配置为进行基板的电镀处理;湿处理部，被配置为进行基板的湿式处理;湿处理部位于电镀处理部下;以及基板支撑 被配置为支撑所述基板的部分，使得所述基板的电镀表面面向上，所述基板支撑部分还被配置为在所述电镀处理部分和所述湿处理部分之间移动所述基板。

公开(公告)号：US07972460B2

公开(公告)日：2011-07-05

申请号：US12408366

申请日：2009-03-20

Applicant: Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

Inventor： Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC: B32B37/02 ,  H05K1/02 ,  H01L21/70

CPC classification number: B32B38/04 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.

Abstract translation: 公开了印刷电路板的制造方法。 制造具有用于将一层连接到另一层的通路的印刷电路板的制造方法可以包括在载体的一个表面上形成电路图案; 在载体的一个表面上处理与通孔对应的孔; 将载体的表面压缩到绝缘体的一个表面中; 移除载体; 处理绝缘体上的通孔，对应于孔的位置; 并且在通孔中形成导电材料，从而容易地加工用于形成通孔的孔，并具有高的设计自由度。

公开(公告)号：US07937833B2

公开(公告)日：2011-05-10

申请号：US11976072

申请日：2007-10-19

Applicant: Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

Inventor： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

IPC: H03K3/02

CPC classification number: H05K3/20 ,  H05K3/0058 ,  H05K3/108 ,  H05K3/4611 ,  H05K3/4682 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.

Abstract translation: 公开了一种制造电路板的方法。 一种制造电路板的方法，包括在载体的绝缘层上形成第一电路图案，其中绝缘层和第一种子层依次层叠; 堆叠并按压载体和绝缘板，其中载体侧具有面向绝缘板的第一电路图案; 移除载体以将第一电路图案和绝缘层转移到绝缘板上; 并且在转移到绝缘板的绝缘层上形成第二电路图案，允许精细的间距电路图案能够在板上制造高密度的精细电路图案，并且允许制造具有简单的多层电路板 处理。