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    SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE
    13.
    发明申请
    SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE 审中-公开
    用于提供基片系统的系统和方法

    公开(公告)号：US20130141861A1

    公开(公告)日：2013-06-06

    申请号：US13678425

    申请日：2012-11-15

    Applicant: Apple Inc.

    Inventor： Gloria Lin ,  Bryson Gardner ,  Joseph Fisher ,  Dave Goh ,  Barry Corlett ,  Dennis Pyper ,  Amir Salehi

    IPC: G06F1/16

    CPC classification number: G06F1/16 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10159 ,  H05K2201/10515

    Abstract: This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.

    Abstract translation: 这涉及用于提供衬底上系统的系统和方法。 在一些实施例中，整个系统（例如，处理器，存储器，加速度计，I / O电路或任何其它合适的部件）的必要组件可以以“裸模”形式制造在单个微芯片上。 例如，管芯可以通过基板和柔性印刷电路板（“挠曲”）耦合到合适的闪存。 在一些实施例中，柔性件可以延伸经过衬底，管芯或两者，以允许附加的相对较大的部件联接到弯曲部。 在一些实施例中，管芯可以通过弯曲而不与衬底耦合到闪存。 在一些实施例中，组件测试点可以放置在衬底的闪存侧。

    SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT
    14.
    发明申请
    SYSTEMS AND METHODS FOR PROVIDING VIAS THROUGH A MODULAR COMPONENT 有权
    通过模块化组件提供VIAS的系统和方法

    公开(公告)号：US20130063914A1

    公开(公告)日：2013-03-14

    申请号：US13668692

    申请日：2012-11-05

    Applicant: Apple Inc.

    Inventor： Gloria Lin ,  Bryson Gardner, JR. ,  Joseph Fisher, JR. ,  Dennis Pyper ,  Amir Salehi

    IPC: H05K7/00

    CPC classification number: H05K1/145 ,  H05K1/115 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0919 ,  H05K2201/09627 ,  H05K2201/10446 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49169

    Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

    Abstract translation: 这涉及用于通过电气系统的模块提供一个或多个通孔的系统和方法。 例如，在一些实施例中，模块可以包括电气系统的一个或多个无源元件和/或主动元件，其中包装已经被塑料模制。 该模块可以堆叠在电气系统的另一个部件下。 然后可以提供通过模块延伸的通孔。 通孔可以包括例如导电通路。 以这种方式，通孔可以提供用于将堆叠在模块顶部上的部件耦合到包括电气系统的电子设备的其他实体的电路径。 例如，组件可以耦合到诸如其他组件，其他模块，印刷电路板，其他电气系统或任何其他合适实体的其他实体。

    LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE
    16.
    发明申请
    LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE 审中-公开
    SIP模块的低配置空间有效屏蔽

    公开(公告)号：US20160270213A1

    公开(公告)日：2016-09-15

    申请号：US15041033

    申请日：2016-02-11

    Applicant: APPLE INC.

    Inventor： Amir Salehi ,  Vu T. Vo ,  Wyeman Chen ,  Chang Liu ,  Dennis R. Pyper ,  Steven Patrick Cardinali ,  Lan Hoang ,  Siddharth Nangia ,  Meng Chi Lee ,  Takayoshi Katahira

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K3/284 ,  B33Y80/00 ,  H05K1/0224 ,  H05K2201/0141 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2201/10969 ,  H05K2201/2036

    Abstract: Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

    Abstract translation: 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。

    Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements
    19.
    发明申请
    Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements 有权
    具有交错接触垫和紧凑型元件安装布置的印刷电路

    公开(公告)号：US20130122725A1

    公开(公告)日：2013-05-16

    申请号：US13674834

    申请日：2012-11-12

    Applicant: Apple Inc.

    Inventor： Wyeman Chen ,  Michael Nikkhoo ,  Amir Salehi

    IPC: H01R12/00 ,  H05K13/04

    CPC classification number: H01R9/095 ,  H01R12/526 ,  H05K1/111 ,  H05K3/3415 ,  H05K13/0465 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2203/1572 ,  H05K2203/304 ,  Y02P70/611 ,  Y10T29/49144

    Abstract: Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.

    Abstract translation: 电子设备可以设置有可以安装集成电路和其他电气部件的印刷电路。 第一印刷电路可以具有以行和列排列的接触焊盘阵列的第一表面。 每列接触垫可具有由间隙分开的一系列接触垫。 每列中的接触垫可以相对于相邻列中的接触垫交错，使得给定列中的每个接触垫水平邻近相邻列中的相关间隙。 组件可以安装到印刷电路的相对表面，使得它与交错接触垫之间的间隙中的一个重叠。 通过将组件安装到不与交错接触垫重叠的第一印刷电路的部分，可以最小化在回流焊接操作期间损坏电气部件的风险。

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