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11.发明授权Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly 有权集成散热器，散热器或具有预附加相变热界面材料的热管和制造电子组件的方法公开(公告)号：US07473995B2
公开(公告)日：2009-01-06
申请号：US10103801
申请日：2002-03-25
IPC分类号： H01L23/28 , H01L23/495 , H01L23/12 , H01L23/10 , H01L21/00
CPC分类号： H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.
摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。
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公开(公告)号：US07303977B2
公开(公告)日：2007-12-04
申请号：US10985572
申请日：2004-11-10
IPC分类号： H01L21/00
CPC分类号： B23K26/0624 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser micromachining method is disclosed wherein a workpiece is milled using an incident beam from a laser beam focused above the surface of the workpiece. The incident beam is guided by a plasma channel generated by the incident beam. The plasma channel, which has a relatively constant diameter over an extended distance, is generated by continual Kerr effect self-focusing balanced by ionization of air beam defocusing.
摘要翻译： 公开了一种激光微加工方法，其中使用来自聚焦在工件表面上的激光束的入射光束研磨工件。 入射光束由入射光束产生的等离子体通道引导。 等离子体通道在延长的距离上具有相对恒定的直径，是由通过气流散焦电离平衡的连续克尔效应自聚焦产生的。
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公开(公告)号：US07059045B2
公开(公告)日：2006-06-13
申请号：US10728329
申请日：2003-12-04
申请人： Daoqiang Lu , Christopher L. Rumer
发明人： Daoqiang Lu , Christopher L. Rumer
IPC分类号： H05K3/34
CPC分类号： H01L21/68707 , Y10S29/044 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , Y10T29/53265
摘要： In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.
摘要翻译： 在一些实施例中，一种方法包括用卡盘拾取夹子，并且在用卡盘夹住夹子的同时，用IC芯片拾取与夹子接触的集成电路（IC）模具。
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公开(公告)号：US06992891B2
公开(公告)日：2006-01-31
申请号：US10406721
申请日：2003-04-02
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L21/563 , H01L23/36 , H01L23/38 , H01L23/473 , H01L25/0655 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/00
摘要： An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.
摘要翻译： 一种组件，包括具有附接表面的散热装置，具有附接表面的基板和在散热装置附接表面和基板附接表面之间延伸的多个金属球。 组件可以包括设置在散热装置附接表面和基板附接表面之间的至少一个微电子管芯。
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公开(公告)号：US06892927B2
公开(公告)日：2005-05-17
申请号：US10423117
申请日：2003-04-24
IPC分类号： B23K20/00 , B23K20/10 , B23K20/24 , H01L21/607 , B23K37/00 , B23K1/06 , B23K5/20 , B23K31/02
CPC分类号： H01L24/85 , B23K20/005 , B23K20/10 , B23K20/24 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the temperature that is higher than the temperature of the device. The bond head is subsequently moved toward the device to bring a portion of the wire into contact with the bond pad. Ultrasonic energy is provided to an interface between the portion of the wire and the bond pad.
摘要翻译： 提供了将电线键合到电子或光子器件上的接合焊盘的方法。 线的一部分保持在引线接合装置的接合头内。 激光束被引导到接合焊盘上。 激光束的能量将接合焊盘加热到高于器件温度的温度。 接合头随后朝向该装置移动以使一部分电线与接合焊盘接触。 超声能量被提供到线的部分和接合垫之间的界面。
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公开(公告)号：US07619318B2
公开(公告)日：2009-11-17
申请号：US11238596
申请日：2005-09-29
IPC分类号： H01L23/29
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/32505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
摘要翻译： 在一些实施方案中，一种方法包括提供一种组合物，其包括至少部分填充有填料颗粒的基质并将该组合物作为底部填充剂组合物施用。 至少一些填料颗粒是导电的。
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公开(公告)号：US07247517B2
公开(公告)日：2007-07-24
申请号：US10676883
申请日：2003-09-30
CPC分类号： H01L23/055 , H01L23/481 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13025 , H01L2224/14181 , H01L2224/16225 , H01L2224/17181 , H01L2224/32225 , H01L2224/33181 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2224/11 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.
摘要翻译： 公开了一种其中形成有通孔的半导体管芯。 第一导电层形成在管芯的前侧，并且第二导电层形成在管芯的背面，并与通孔相连。 第一封装衬底与第一导电层电耦合，并且第二封装衬底与第二导电层电耦合。 在另一个实施例中，衬底球电耦合第一和第二封装衬底。 在另一实施例中，倒装芯片凸块附接到第一封装衬底。
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公开(公告)号：US06924551B2
公开(公告)日：2005-08-02
申请号：US10447493
申请日：2003-05-28
IPC分类号： H01L23/48 , H01L23/498 , H01L23/538 , H01L25/065 , H01L23/34 , H01L23/52 , H01L29/40
CPC分类号： H01L23/4985 , H01L23/481 , H01L23/5387 , H01L24/48 , H01L25/0657 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/17181 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/85399 , H01L2225/06517 , H01L2225/06579 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.
摘要翻译： 一种微电子封装，其包括具有延伸穿过其后表面的硅通孔的微电子管芯，其允许微电子管芯的有源表面和后表面具有连接到柔性基板的功率，接地和/或输入/输出信号 。 柔性基板还可以通过至少一个外部接触件连接到外部基板。
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公开(公告)号：US07897486B2
公开(公告)日：2011-03-01
申请号：US11801465
申请日：2007-05-09
申请人： Eric J. Li , Daoqiang Lu , Christopher L. Rumer , Paul A. Koning , Darcy E. Fleming , Gudbjorg H. Oskarsdottir , Tiffany Byrne
发明人： Eric J. Li , Daoqiang Lu , Christopher L. Rumer , Paul A. Koning , Darcy E. Fleming , Gudbjorg H. Oskarsdottir , Tiffany Byrne
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/78 , H01L24/10 , H01L24/13 , H01L24/81 , H01L2221/6834 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1181 , H01L2224/13 , H01L2224/13099 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.
摘要翻译： 公开了用于形成晶片涂层的制剂和方法。 在一个实施方案中，在激光划线操作之前，将有机表面保护剂并入沉积到半导体晶片上的晶片涂层制剂中。 在去除晶片涂层时，有机表面保护剂保留在凸块上，从而防止芯片准备和芯片之间的凸起的氧化附着。 在替代实施例中，将紫外光吸收剂添加到晶片涂层配方中以增强晶片涂层的能量吸收，从而提高激光器烧蚀晶片涂层的能力。 在替代实施例中，保形晶片涂层沉积在晶片和模具凸起上，从而减少可能影响激光划线能力的晶片涂层厚度变化。
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公开(公告)号：US06982492B2
公开(公告)日：2006-01-03
申请号：US10692062
申请日：2003-10-23
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/81 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/32505 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01021 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
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