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    METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
    13.
    发明申请
    METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD 审中-公开
    制造多层印刷电路板的方法

    公开(公告)号：US20130047418A1

    公开(公告)日：2013-02-28

    申请号：US13568693

    申请日：2012-08-07

    申请人： Yang Je Lee ,  Gi Suk Kim ,  Joong Hyuk Jung ,  Dek Gin Yang

    发明人： Yang Je Lee ,  Gi Suk Kim ,  Joong Hyuk Jung ,  Dek Gin Yang

    IPC分类号： H05K3/02

    CPC分类号： H05K3/0097 ,  H05K3/225 ,  H05K3/429 ,  H05K3/4652 ,  Y10T29/49004 ,  Y10T29/49155

    摘要： The present invention discloses a method of manufacturing a multilayer PCB including: a panel preparation step of preparing a working panel on which a plurality of PCB units having a plurality of inner layer circuit pattern portions are arrayed; a defective portion removing step of removing a defective inner layer circuit pattern portion among the plurality of inner layer circuit pattern portions; a good portion providing step of providing a good inner layer circuit pattern portion in a portion of the working panel, from which the defective inner layer circuit pattern portion is removed; and an outer layer forming step of forming an outer layer circuit pattern portion in the PCB unit. The present invention is capable of improving productivity and reducing manufacturing costs by preventing product loss due to disposal of the PCB unit having the defective inner layer circuit pattern portion.

    摘要翻译： 本发明公开了一种多层PCB的制造方法，其特征在于，包括：准备工作面板的面板准备工序，其上排列有多个内层电路图形部分的多个PCB单元; 去除所述多个内层电路图形部分中的有缺陷的内层电路图形部分的缺陷部分去除步骤; 良好的部分提供步骤，在工作面板的一部分中提供良好的内层电路图形部分，去除有缺陷的内层电路图案部分; 以及在PCB单元中形成外层电路图形部分的外层形成步骤。 本发明能够通过防止由于处理具有内层电路图形部分有缺陷的PCB单元而导致的产品损失，从而提高生产率并降低制造成本。

    Electromagnetic bandgap structure and printed circuit board having the same
    14.
    发明授权
    Electromagnetic bandgap structure and printed circuit board having the same 失效
    电磁带隙结构和具有相同功能的印刷电路板

    公开(公告)号：US08330048B2

    公开(公告)日：2012-12-11

    申请号：US12650486

    申请日：2009-12-30

    申请人： Won Woo Cho ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    发明人： Won Woo Cho ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    IPC分类号： H05K9/00

    CPC分类号： H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    摘要： Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

    摘要翻译： 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 带隙结构包括包括多个导电板的导电层; 以及设置在所述导电层上或下的金属层，并且包括将所述第一导电板电连接到所述多个导电板的第二导电板的缝合图案。 带隙结构包括形成在与导电层不同的金属层中的螺旋缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。

    Apparatus for manufacturing printed circuit board
    15.
    发明申请
    Apparatus for manufacturing printed circuit board 审中-公开
    印刷电路板制造装置

    公开(公告)号：US20110132546A1

    公开(公告)日：2011-06-09

    申请号：US12659029

    申请日：2010-02-23

    申请人： Yoong Oh ,  Dek Gin Yang

    发明人： Yoong Oh ,  Dek Gin Yang

    IPC分类号： B32B38/14 ,  B32B37/02 ,  B32B38/04

    CPC分类号： B32B38/1816 ,  B32B38/0004 ,  B32B38/145 ,  B32B39/00 ,  B32B2457/08 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

    摘要： Disclosed is an apparatus for manufacturing a printed circuit board. The apparatus for manufacturing the printed circuit board includes: a supplier for supplying a substrate of a sheet type; a first printer for printing paste on the substrate supplied from the supplier to thereby form preliminary bumps; a provisional dryer which is arranged on one side of the first printer and provisional-dries the preliminary bumps; a second printer which is arranged on one side of the provisional dryer to be in series to the first printer and prints paste on the preliminary bumps; a dryer which is arranged on one side of the second printer and dries and cures the preliminary bumps to thereby form bumps; and a penetrator which is arranged on one side of the dryer, and allows the bump to pass through prepreg and bonds the prepreg and the substrate together.

    摘要翻译： 公开了一种印刷电路板的制造装置。 用于制造印刷电路板的装置包括：用于供应片状基板的供应商; 第一打印机，用于在从供应商供应的基板上印刷浆料，从而形成初步凸块; 临时干燥器，布置在第一打印机的一侧并对初步凸块进行暂时干燥; 第二打印机，其布置在所述临时干衣机的一侧以与所述第一打印机串联，并且在所述预备凸块上印刷浆料; 布置在第二打印机的一侧的干衣机，干燥并固化预备凸块从而形成凸块; 以及布置在干燥器的一侧的穿透器，并且允许凸块穿过预浸料并将预浸料和基材粘合在一起。

    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME
    18.
    发明申请
    ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD HAVING THE SAME 失效
    电磁带结构与印刷电路板

    公开(公告)号：US20100252319A1

    公开(公告)日：2010-10-07

    申请号：US12650486

    申请日：2009-12-30

    申请人： Won Woo CHO ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    发明人： Won Woo CHO ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    IPC分类号： H05K9/00

    CPC分类号： H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    摘要： Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

    摘要翻译： 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 带隙结构包括包括多个导电板的导电层; 以及设置在所述导电层上或下的金属层，并且包括将所述第一导电板电连接到所述多个导电板的第二导电板的缝合图案。 带隙结构包括形成在与导电层不同的金属层中的螺旋缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。

    Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
    19.
    发明申请
    Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof 审中-公开
    化学镀镍溶液组合物，柔性印刷电路板及其制造方法

    公开(公告)号：US20100155108A1

    公开(公告)日：2010-06-24

    申请号：US12457002

    申请日：2009-05-28

    申请人： Chul Min Lee ,  Sung Wook Chun ,  Dek Gin Yang ,  Kyung Jin Heo ,  Young Ho Lee ,  Dong-Gi An

    发明人： Chul Min Lee ,  Sung Wook Chun ,  Dek Gin Yang ,  Kyung Jin Heo ,  Young Ho Lee ,  Dong-Gi An

    IPC分类号： H05K1/00 ,  B05D5/12 ,  C09D1/00 ,  C08K3/10

    CPC分类号： C23C18/34 ,  H05K1/118 ,  H05K3/244

    摘要： The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

    摘要翻译： 本发明涉及一种化学镀镍溶液组合物，柔性印刷电路板及其制造方法，更具体地，涉及一种能够同时满足电镀的化学镀镍溶液组合物，柔性印刷电路板及其制造方法 通过与含有水溶性镍化合物，还原剂，络合剂的化学镀镍溶液组合物形成具有垂直生长结构的镀镍层，分别为柔性印刷电路板的焊盘单元和外部连接单元需要的特性 和垂直生长诱导剂。

    Method of manufacturing PCB and PCB manufactured by the same
    20.
    发明申请
    Method of manufacturing PCB and PCB manufactured by the same 审中-公开
    制造PCB和PCB的方法

    公开(公告)号：US20090277679A1

    公开(公告)日：2009-11-12

    申请号：US12219660

    申请日：2008-07-25

    申请人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    发明人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    IPC分类号： H05K3/42 ,  H05K1/11

    CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/09554 ,  H05K2203/073

    摘要： Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.

    摘要翻译： 提供一种制造PCB的方法，该方法包括：提供包括铝芯的基板; 形成通过所述基板的通孔; 通过在通孔的内表面上进行锌酸盐处理，用锌膜代替铝芯的表面; 通过在锌膜上进行取代电镀用金属膜代替锌膜; 在形成金属膜的通孔的表面上通过无电镀形成第一镀膜; 以及通过电镀在所述第一镀膜上形成第二镀膜。