公开(公告)号：US20160343918A1

公开(公告)日：2016-11-24

申请号：US15160444

申请日：2016-05-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Tomonori OZAKI ,  Shinsaku IKUTA ,  Yuichi YAMADA

IPC: H01L33/54 ,  H01L33/56 ,  H01L33/50 ,  H01L33/58

Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is Δn1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is Δn2, a ratio of Δn2 to Δn1 is in a range of 95% to 105%.

Abstract translation: 发光器件包括发光元件; 覆盖发光元件的密封树脂; 以及包含在密封树脂中的光漫射材料。 当密封树脂和光扩散材料之间在10℃的折射率差为Δn1时，密封树脂和光漫射材料之间的折射率差在50℃是Δn2，Δn2与 Δn1在95％至105％的范围内。

公开(公告)号：US20160252218A1

公开(公告)日：2016-09-01

申请号：US15054588

申请日：2016-02-26

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Tomohiro IKEDA ,  Yohei INAYOSHI ,  Motokazu YAMADA

IPC: F21K99/00 ,  F21V23/00

CPC classification number: F21V19/005 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2113/00 ,  F21Y2115/10 ,  G02F1/1336 ,  G02F1/133603 ,  G02F1/133605 ,  H01L25/0753 ,  H05K1/189 ,  H05K2201/10106

Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.

Abstract translation: 发光器件包括多个长方形柔性基板，每个柔性基板包括片状基体和形成在基体的一个面上的布线图案，并且每个柔性基板具有设置在其上的多个发光部分; 多个反射层，每个反射层设置在相应柔性基板上方的相应发光部分的周边; 由光反射树脂制成的绝缘反射片，所述反射片具有多个通孔，所述多个通孔使得所述发光部分和所述反射层的至少一部分经由所述通孔露出; 以及多个粘合部件，在不形成反射层的区域中，各粘接部件将各柔性基板粘贴在反射片上。

公开(公告)号：US20160087169A1

公开(公告)日：2016-03-24

申请号：US14956804

申请日：2015-12-02

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

IPC: H01L33/54 ,  H01L27/15 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56 ,  H01L33/32 ,  H01L33/60

CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.

Abstract translation: 发光器件包括衬底，发光器件和密封树脂构件。 基板包括柔性基座，多个布线部分，槽部分和一对端子部分。 柔性基部沿着与基板的纵向相对应的第一方向延伸，并且多个布线部布置在柔性基部上。 槽部形成在彼此间隔开的多个配线部之间。 一对端子部分沿着第一方向布置在多个布线部分的两侧。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 发光元件以倒装芯片方式安装在基板上。

公开(公告)号：US20160035952A1

公开(公告)日：2016-02-04

申请号：US14884718

申请日：2015-10-15

Applicant: Nichia Corporation

Inventor： Motokazu YAMADA ,  Ryota Seno ,  Kazuhiro Kamada

IPC: H01L33/60 ,  H01L33/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

公开(公告)号：US20250056942A1

公开(公告)日：2025-02-13

申请号：US18932321

申请日：2024-10-30

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

IPC: H01L33/60 ,  F21V3/06 ,  F21Y105/16 ,  F21Y115/10 ,  H01L33/54

Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

公开(公告)号：US20210239297A1

公开(公告)日：2021-08-05

申请号：US17238711

申请日：2021-04-23

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: F21V9/30 ,  F21V13/14 ,  F21V7/00 ,  F21V9/08 ,  F21V15/01 ,  F21V3/00 ,  F21V19/00 ,  F21V3/10 ,  F21V3/12 ,  F21V1/17 ,  F21V3/08 ,  F21V7/28

Abstract: A light emitting device includes a base having a light reflecting surface and having a first side on which the light reflecting surface is provided, light sources mounted on the first side, and a half mirror disposed opposite to the base to reflect a part of incident light and to transmit another part of the incident light. Each of the light sources includes a reflecting layer on an upper surface of each of the light sources. The half mirror has an oblique reflectance with respect to wavelengths of light emitted from the light sources in a case where the light travels obliquely toward the half mirror. The half mirror has a perpendicular reflectance with respect to the wavelengths in a case where the light travels perpendicularly toward the half mirror. The oblique reflectance is smaller than the perpendicular reflectance.

公开(公告)号：US20200147908A1

公开(公告)日：2020-05-14

申请号：US16737904

申请日：2020-01-09

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: B29D11/00 ,  H01L33/00 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.

公开(公告)号：US20200003370A1

公开(公告)日：2020-01-02

申请号：US16567580

申请日：2019-09-11

Applicant: NICHIA CORPORATION

Inventor： Tomonori OZAKI ,  Motokazu YAMADA

IPC: F21K9/60

Abstract: A lighting module includes a mounting board; a plurality of first light sources located on the mounting board; and one or more second light sources located on the mounting board. A wavelength range and/or a correlated color temperature of the plurality of first light sources is different from a wavelength range and/or a correlated color temperature of the one or more second light sources. A quantity of the first light sources is greater than a quantity of the one or more second light sources. A light distribution angle of each of the one or more second light sources is greater than a light distribution angle of each of the plurality of first light sources.

公开(公告)号：US20190257499A1

公开(公告)日：2019-08-22

申请号：US16402129

申请日：2019-05-02

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Tomohiro IKEDA ,  Yohei INAYOSHI ,  Motokazu YAMADA

IPC: F21V19/00 ,  G02F1/13357 ,  G02F1/1335 ,  H01L25/075

Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.

公开(公告)号：US20180301603A1

公开(公告)日：2018-10-18

申请号：US16017953

申请日：2018-06-25

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA

IPC: H01L33/54 ,  H01L33/50

Abstract: A light emitting device includes a base having a conductor wiring, at least one light emitting element mounted on the base and electrically connected to the conductor wiring, and a light transmissive sealing member. The light transmissive sealing member includes a light diffusion material. The light transmissive sealing member covers the at least one light emitting element. The light transmissive sealing member has a projection shape. The projection shape has a substantially circular bottom surface facing the base and a height in a light axis direction of the at least one light emitting element. The height is greater than a diameter of the substantially circular bottom surface. The light transmissive sealing member has a maximum length when the light transmissive sealing member is viewed from the light axis direction. The diameter of the substantially circular bottom surface is smaller than the maximum length of the light transmissive sealing member.