摘要:
Disclosed is a printed circuit board and a method of preparing the printed circuit board, The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
摘要:
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition.
摘要:
Woven glass fiber cloth for printed circuit substrates in which the warp is of plied yarn and the fill is of unplied or twisted yarn to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.
摘要:
A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled. Fine-line circuitry may be routed over landless, plated through holes thereby increasing the aspect ratio and the available surface area for additional components and wiring.
摘要:
A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is provided over the elements and, significantly, on the internal surfaces of the formed cavity to thereby enhance the electrical properties of the finished product, e.g., by assuring a solid, continuous path between upper and lower surfaces of the product.
摘要:
A method of recovering solvents from an impure effluent stream of an industrial process. The effluent waste stream contains less than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The waste stream contains dissolved polymers, polymeric particles, and the hydrolysis, oxidation and/or other decomposition products of one of the solvents. In one embodiment, the first step involves filtering particulate matter from the waste stream. In another embodiment, the filtering step is omitted. The filtered or unfiltered waste stream is fed to a first separation stage for separation into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the solvent, water, semi-volatile and non-volatile contaminants, and photoresist products. Following the first separation stage, the dewatered solvent-containing suspension is either distilled or evaporated to separate the solvent from photoresist products and other non-volatile contaminants. Then the solvent-containing suspension is separated into (i) a solvent vapor fraction which contains solvent and semi-volatile contaminants such as plasticizers and monomers, and (ii) a sludge fraction which contains non-volatile contaminants such as polymer and benzoic acid. Thereafter, the solvent vapor fraction is fed into a vapor stripper to strip the semi-volatile contaminants from the solvent vapor fraction using an organic solvent as a mass transfer medium. This removes the semi-volatiles from the solvent-containing vapor fraction and produces a solvent vapor fraction that is essentially pure.
摘要:
A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.
摘要:
Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
摘要:
A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.
摘要:
A fibrous substrate is coated with a hydrolyzed aminosilane. The aminosilane is hydrolyzed in an aqueous solution having a pH of 3.4 to 3.7. The substrate is useful for preparing fiber reinforced plastics such as prepreg polyepoxide substrates. Improved adhesion between the fibrous substrate and the polymer is obtained.