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    Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device
    13.
    发明申请
    Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device 有权
    制造光电半导体器件和光电半导体器件的方法

    公开(公告)号：US20160284679A1

    公开(公告)日：2016-09-29

    申请号：US15036794

    申请日：2014-10-23

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Jürgen Moosburger ,  Markus Pindl ,  Simon Jerebic ,  Frank Singer

    IPC: H01L25/00 ,  H01L33/48 ,  H01L33/60

    CPC classification number: H01L25/50 ,  H01L33/46 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058

    Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

    Abstract translation: 提供了一种制造多个光电半导体器件的方法。 许多半导体芯片被紧固在辅助支架上。 半导体芯片在横向彼此间隔开。 至少在半导体芯片之间的区域中形成反射层。 至少在半导体芯片之间的某些区域中形成复合封装体。 辅助支撑件被移除并且复合壳体被分离成多个光电子半导体器件。 每个光电半导体器件具有至少一个半导体芯片，反射层的一部分和作为封装体的复合封装体的一部分。

    ELECTRICAL COMPONENT AND METHOD OF PRODUCING ELECTRICAL COMPONENTS
    15.
    发明申请
    ELECTRICAL COMPONENT AND METHOD OF PRODUCING ELECTRICAL COMPONENTS 有权
    电气部件和电气部件的制造方法

    公开(公告)号：US20150214446A1

    公开(公告)日：2015-07-30

    申请号：US14410956

    申请日：2013-06-18

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Boss ,  Markus Pindl ,  Tobias Gebuhr ,  Simon Jerebic ,  Martin Brandl

    IPC: H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L23/498 ,  H01L21/78 ,  H01L33/58 ,  H01L23/29

    CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/49811 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2924/00014

    Abstract: An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.

    Abstract translation: 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。

    Controlled Wetting in the Manufacture of Electronic Components
    17.
    发明申请
    Controlled Wetting in the Manufacture of Electronic Components 有权

    公开(公告)号：US20220077357A1

    公开(公告)日：2022-03-10

    申请号：US17432908

    申请日：2020-02-25

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Daniel Leisen ,  Simon Jerebic ,  Max Wenzel

    IPC: H01L33/54

    Abstract: In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.

    Method for producing optoelectronic semiconductor components
    18.
    发明授权
    Method for producing optoelectronic semiconductor components 有权

    公开(公告)号：US11158771B2

    公开(公告)日：2021-10-26

    申请号：US16485412

    申请日：2018-03-01

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Markus Pindl ,  Simon Jerebic

    IPC: H01L33/52 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

    Abstract: A method for producing optoelectronic semiconductor components is disclosed. In an embodiment a method includes A) applying radiation-emitting semiconductor chips to an intermediate carrier, wherein the semiconductor chips are volume emitters configured to emit radiation at light exit main sides and on chip side surfaces; B) applying a clear potting permeable to the radiation directly onto the chip side surfaces so that the chip side surfaces are predominantly or completely covered by the clear potting and a thickness of the clear potting in each case decreases monotonically in a direction away from the main light exit sides; C) producing a reflection element so that the reflection element and the clear potting touch on an outer side of the clear potting opposite the chip side surfaces; and D) detaching the semiconductor chips from the intermediate carrier and attaching the semiconductor chips to a component carrier so that the light exit main sides of the semiconductor chips face away from the component carrier.

    Device for slurrying a suspension and method for operating a device
    19.
    发明授权
    Device for slurrying a suspension and method for operating a device 有权

    公开(公告)号：US10940488B2

    公开(公告)日：2021-03-09

    申请号：US16221350

    申请日：2018-12-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Harald Dimmelmeier ,  Stefan Barthel ,  Simon Jerebic ,  Benedikt Beer ,  Harald Laux

    IPC: B01F5/16 ,  B03D1/14

    Abstract: A method and device for slurrying a suspension, the device including a mixing container with an inlet opening configured to introduce the suspension into the mixing container, a distributor element having a collecting container and an outlet arm fastened to the collecting container, and a shaft with a longitudinal axis, with the shaft and the distributor element arranged inside the mixing container, and the distributor element rotatable around the shaft. The collecting container has a collecting opening that permits passage of the suspension from the inlet opening into the distributor element, the outlet arm has an outflow opening that lets the suspension leave the distributor element, and the outlet arm permitting the suspension to flow out of the distributor element, with a flow of the suspension causing a torque on the distributor element so that the torque supports a rotation around the shaft.

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