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公开(公告)号：US20220123182A1
公开(公告)日：2022-04-21
申请号：US17645644
申请日：2021-12-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μ.
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公开(公告)号：US20220059737A1
公开(公告)日：2022-02-24
申请号：US17515138
申请日：2021-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US10916686B2
公开(公告)日：2021-02-09
申请号：US15033664
申请日：2014-11-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer , Alexander Linkov , Stefan Illek , Wolfgang Moench
IPC: H01L33/58
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the radiation-emitting face, wherein the optical element includes a material in which light-scattering particles are embedded, and a concentration of the embedded light-scattering particles has a gradient forming an angle not equal to 90° with the radiation emission face.
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公开(公告)号：US10256380B2
公开(公告)日：2019-04-09
申请号：US15524413
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Wolfgang Moench , Frank Singer , Thomas Schwarz , Jürgen Moosburger , Stefan Illek
Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.
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15.发明授权公开(公告)号：US09954150B2
公开(公告)日：2018-04-24
申请号：US14382578
申请日：2013-02-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Stefan Illek
IPC: H01L33/64 , H01L33/54 , H01L33/62 , H01L25/075
CPC classification number: H01L33/54 , H01L25/0753 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
Abstract: The invention relates to a light-emitting semiconductor component comprising a light-emitting semiconductor chip with a semiconductor layer series, a light out-coupling surface, a rear surface lying opposite said light out-coupling surface and lateral surfaces, and a support body with a shaped body that directly covers the lateral surfaces in form-locked manner, two electric contact layers and a thermal contact layer being provided on the rear surface. The thermal contact layer is electrically insulated from the electric contact layers and the semiconductor layer series, the support body has electric connection elements in direct contact with the electric contact layers and a thermal connection element in direct contact with the thermal contact layer on the rear surface and the thermal connection element at least partially forms an assembly surface of the semiconductor component facing away from the semiconductor chip. The invention further relates to a method for producing a semiconductor component.
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Patent Agency Ranking
16.发明授权公开(公告)号：US09825198B2
公开(公告)日：2017-11-21
申请号：US14364099
申请日：2012-11-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Patrick Rode , Lutz Hoeppel , Norwin von Malm , Stefan Illek , Albrecht Kieslich , Siegfried Herrmann
IPC: H01L21/304 , H01L21/28 , H01L21/3205 , H01L21/283 , H01L31/18 , H01L33/36 , H01L33/00 , H01L33/38
CPC classification number: H01L31/1876 , H01L33/005 , H01L33/36 , H01L33/382 , H01L2933/0016
Abstract: A method of producing a plurality of optoelectronic semiconductor chips includes a) providing a layer composite assembly having a principal plane which delimits the layer composite assembly in a vertical direction, and includes a semiconductor layer sequence having an active region that generates and/or detects radiation, wherein a plurality of recesses extending from the principal plane in a direction of the active region are formed in the layer composite assembly; b) forming a planarization layer on the principal plane such that the recesses are at least partly filled with material of the planarization layer; c) at least regionally removing material of the planarization layer to level the planarization layer; and d) completing the semiconductor chips, wherein for each semiconductor chip at least one semiconductor body emerges from the semiconductor layer sequence.
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17.发明申请公开(公告)号：US20160336307A1
公开(公告)日：2016-11-17
申请号：US15112765
申请日：2015-01-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Siegfried Herrmann , Stefan Illek , Frank Singer
IPC: H01L27/02 , H01L33/48 , H01L33/60 , H01L33/00 , H01L33/54 , H01L33/38 , H01L33/62 , H01L25/16 , H01L33/50
CPC classification number: H01L27/0248 , H01L23/147 , H01L23/49822 , H01L23/49827 , H01L23/552 , H01L24/80 , H01L25/167 , H01L27/0251 , H01L33/0079 , H01L33/382 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/08235 , H01L2224/80895 , H01L2224/80896 , H01L2933/0016 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of producing a semiconductor component includes providing a carrier with a first insulation layer, a mirror layer at least partially covered by the first insulation layer and a connection element, wherein the carrier includes an exposed planar mounting surface and the connection element extends through the first insulation layer to the mounting surface, providing a main body with a semiconductor body, a second insulation layer and a contact element to electrically contact the semiconductor body, wherein the main body has an exposed planar contact surface and the contact element extends through the second insulation layer to the contact surface, and connecting the main body to the carrier, wherein the planar contact surface and the planar mounting surface are brought together to form a connecting surface, and the contact element and the connection element electrically connect with one another.
Abstract translation: 制造半导体部件的方法包括：提供具有第一绝缘层的载体，至少部分地被第一绝缘层覆盖的反射镜层和连接元件，其中载体包括暴露的平面安装表面，并且连接元件延伸穿过 第一绝缘层到安装表面，提供具有半导体主体的主体，第二绝缘层和与半导体本体电接触的接触元件，其中主体具有暴露的平面接触表面，并且接触元件延伸穿过第二绝缘层 绝缘层到接触表面，并且将主体连接到载体上，其中平面接触表面和平面安装表面一起形成连接表面，并且接触元件和连接元件彼此电连接。
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公开(公告)号：US20160181491A1
公开(公告)日：2016-06-23
申请号：US15058667
申请日：2016-03-02
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
CPC classification number: H01L33/60 , H01L25/0753 , H01L25/167 , H01L25/50 , H01L31/00 , H01L31/02322 , H01L33/46 , H01L33/486 , H01L33/54 , H01L33/56 , H01L51/5271 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2924/00
Abstract: An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.
Abstract translation: 一种包括具有第一表面的光电子半导体芯片的光电半导体部件，其中所述第一表面是所述光电子半导体芯片的辐射发射表面，所述半导体芯片被嵌入在模体中，所述第一表面相对于顶侧被升高 并且反射层设置在模体的顶侧。
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公开(公告)号：US09209372B2
公开(公告)日：2015-12-08
申请号：US14404428
申请日：2013-05-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L33/64 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01L2933/0091 , H01L2924/00
Abstract: An optoelectronic module has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has a layer having a first conductivity, a layer having a second conductivity, a radiation surface and a contact surface which lies opposite the radiation surface. A contact is attached to the radiation surface. A frame made of a potting compound laterally encloses the semiconductor chip in at least some regions such that the radiation surface and the contact surface are substantially free of the potting compound. A first contact structure is arranged in at least some regions on the frame and in at least some regions on the contact surface. A second contact structure is arranged in at least some regions on the frame and in at least some regions on the contact of the radiation surface.
Abstract translation: 光电子模块具有至少一个用于发射电磁辐射的半导体芯片。 半导体芯片具有具有第一导电性的层，具有第二导电性的层，辐射表面和与辐射表面相对的接触表面。 接触件附着在辐射表面上。 由灌封化合物制成的框架在至少一些区域中侧向包围半导体芯片，使得辐射表面和接触表面基本上不含灌封化合物。 第一接触结构布置在框架和接触表面上的至少一些区域中的至少一些区域中。 第二接触结构布置在框架上的至少一些区域中以及辐射表面的接触件上的至少一些区域中。
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公开(公告)号：US20150243857A1
公开(公告)日：2015-08-27
申请号：US14424796
申请日：2013-08-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz , Walter Wegleiter
CPC classification number: H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
Abstract translation: 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
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