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11.发明授权Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive 失效多层次的高密度互连工艺和结构使用可变的交联粘合剂
公开(公告)号：US5161093A
公开(公告)日：1992-11-03
申请号：US546959
申请日：1990-07-02
IPC分类号： H01L23/12 , H01L21/48 , H01L23/15 , H01L23/498 , H01L23/538 , H01L25/00 , H01L25/04 , H01L25/18 , H05K3/38 , H05K3/46
CPC分类号： H01L24/25 , H01L21/4857 , H01L23/49894 , H01L23/5383 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24227 , H01L2224/245 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/3011
摘要： A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.
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12.发明授权Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s 失效MUTLIPLE LAMINATION高密度互连过程和结构使用具有顺序降低的热塑性粘合剂
公开(公告)号：US5157589A
公开(公告)日：1992-10-20
申请号：US546963
申请日：1990-07-02
IPC分类号： H01L23/13 , H01L23/498 , H01L23/538 , H01L25/04 , H01L25/18 , H05K1/18 , H05K3/38 , H05K3/46
CPC分类号： H01L23/5389 , H01L23/13 , H01L23/49822 , H01L24/24 , H01L24/82 , H05K3/4635 , H05K3/4673 , H01L2224/2402 , H01L2224/24227 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H05K1/185 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K3/386 , H05K3/4644
摘要： A high density interconnect structure incorporating a plurality of laminated dieletric layers is fabricated using thermoplastic adhesive layers of progressively lower glass transition temperature in order to maintain the stability of the already fabricated structure during the addition of the later laminations. This structure also facilitates the removal of only a portion of the high density interconnect structure where a fault in the system can be corrected in one of the upper layers of the high density interconnect structure.
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13.发明授权Excimer laser patterning of a novel resist using masked and maskless process steps 失效使用掩蔽和无掩模工艺步骤的新型抗蚀剂的准分子激光图案化
公开(公告)号：US4842677A
公开(公告)日：1989-06-27
申请号：US224416
申请日：1988-07-26
IPC分类号： G03F7/11 , G03F7/095 , G03F7/20 , G03F7/26 , H01L21/027 , H01L23/538 , H05K3/00 , H05K3/06
CPC分类号： H05K3/0082 , G03F7/095 , G03F7/2006 , H01L23/5389 , H01L2924/0002 , H05K2203/0505 , H05K2203/0577 , H05K2203/107 , H05K3/0032 , H05K3/064
摘要： A dual layer resist configuration is employed for photopatterning high resolution conductive patterns on underlying polymeric or ceramic substrates, particularly substrates exhibiting surface roughness and non-planar design features such as channels, bosses and ridges. More particularly, a thin underlayer of ablatable photoabsorptive polymer is disposed on a metal coated substrate, after which a thicker layer of substantially transparent material is disposed over the polymer. A beam of laser energy, such as that produced by an ultraviolet excimer layer, is directed through the upper layer and is absorbed by the lower layer which is ablated and simultaneously removes the thick layer above it. This results in the ability to etch high resolution features on polymeric and other substrates, particularly copper coated polyetherimide circuit boards. The resist system is also applicable to VLSI wafers even though such wafers usually do not exhibit surface roughness on the scale generally considered herein. It is also equally applicable in various high density interconnect systems used for the direct connection of chip devices. A mask for patterning and a method for making it are also seen to be desirable because of the high laser energy densities generally desired for thorough ablation. An alternate method is also disclosed which employs two laser exposure steps with the first step being a masked operation on only an ablatable layer and with the second step being an unmasked operation on a dual layer material.
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公开(公告)号：US4783695A
公开(公告)日：1988-11-08
申请号：US912456
申请日：1986-09-26
CPC分类号： H01L24/75 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24137 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/75315 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H01L2924/30107
摘要： A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnection metallization which serves to connect various chips and chip pads within the interconnection pads disposed on the chips. A significant advantage of the packaging method and configuration of the present invention is the ability for the polymer film to be removed. This significantly improves testability and effectively provides wafer scale integration circuit packages which are free of problems associated with yield and testability.
摘要翻译： 多芯片集成电路封装包括一个衬底，一个或多个具有互连焊盘的集成电路芯片。 覆盖和桥接存在的集成电路芯片的聚合物膜设置有多个通孔以容纳互连金属化层，其用于连接布置在芯片上的互连焊盘内的各种芯片和芯片焊盘。 本发明的包装方法和结构的显着优点是除去聚合物膜的能力。 这显着提高了可测试性，并有效提供了没有与产量和可测试性相关的问题的晶片级集成电路封装。
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15.发明授权Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging 失效在多电子电路芯片封装的聚合物电介质中制造通孔的方法
公开(公告)号：US4714516A
公开(公告)日：1987-12-22
申请号：US912455
申请日：1986-09-26
IPC分类号： B05D3/06 , B23K26/00 , B29C59/14 , C08J7/00 , H01L21/48 , H01L23/538 , H05K3/00 , H05K3/46 , B44C1/22 , B29C37/00 , C03C15/00 , C03C25/06
CPC分类号： H05K3/0041 , B23K26/0006 , B23K26/362 , H01L21/4803 , H01L23/5389 , H05K3/0035 , B23K2201/34 , B23K2201/42 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01L2924/0002 , H05K2201/09509 , H05K2201/09827 , H05K2203/0165 , H05K2203/095 , H05K3/0008 , H05K3/0055 , H05K3/4644
摘要： A method for producing holes in a polymer film includes the steps of irradiating a spot on the film with a burst of focused laser energy at a level sufficient to damage the film without puncturing it and then subsequently plasma etching the irradiated film so as to remove the damaged portions. This method is particularly applicable to the formation of multichip integrated circuit packages in which a plurality of microcircuit chips are affixed to an underlying substrate which is coated with a polymer film covering the chips and the substrates. The holes are provided for the purpose of interconnecting the chips or making intrachip connections by means of a subsequently applied metallization layer.
摘要翻译： 一种聚合物膜中的孔的制造方法，其特征在于，具有将聚焦的激光能量的突发以足以破坏所述膜的水平的方式照射在所述膜上的斑点的步骤，然后等离子体蚀刻所述被照射的膜， 损坏部分。 该方法特别适用于多芯片集成电路封装的形成，其中多个微电路芯片固定到涂覆有覆盖芯片和基板的聚合物膜的下面的基板上。 提供这些孔用于通过随后应用的金属化层互连芯片或进行连接间连接的目的。
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16.发明授权Cooking apparatus having internal pressurizing source and _integral heat source _ 失效具有内部加压源和整体热源的烹饪设备
公开(公告)号：US4430557A
公开(公告)日：1984-02-07
申请号：US336805
申请日：1982-01-04
CPC分类号： A47J27/16 , A47J37/0623 , A47J37/0629
摘要： A self-standing cooking apparatus is disclosed which consists of a pressurizable vessel having a door which can be latched and sealed, an integral steam-pressure source and integral upper and lower heating rod elements which serve as broil elements and bake elements, respectively, and a water-filled tray which can be disposed above the upper heating rod. An electrical control circuit enables selective energization of the bake and broil heat elements by continuous or controlled duration pulses of current which control the proportion of infrared energy that will be produced by the heating rods. The oven can be operated under pressure with the heating rods applying infrared radiation to the foodstuff being cooked in order to obtain browning or crisping of the foodstuff which is cooked at elevated pressure. The oven can also be operated in a conventional bake mode, a conventional broil mode, a steam cooking mode, a sealed cooking and warming mode and a toasting mode. Reinforcing fins lying in parallel planes are secured to and encircle the exterior of the container to provide necessary additional strength for the pressurizable vessel walls to withstand a maximum design pressure.
摘要翻译： 公开了一种独立的烹饪设备，其包括具有可锁定和密封的门的可加压容器，分别用作烤肉元件和烘烤元件的整体蒸汽压力源和整体的上下加热棒元件，以及 可以设置在上加热棒上方的充水托盘。 电控制电路能够通过连续或受控持续的电流脉冲来选择性地激励烘烤和烘烤加热元件，从而控制由加热棒产生的红外能量的比例。 烘箱可以在压力下操作，加热棒将红外辐射施加到烹饪的食品上，以获得在升高的压力下烹饪的食物的褐变或脆化。 烘箱也可以以常规烘烤模式，常规烘烤模式，蒸汽烹饪模式，密封烹饪和加温模式以及烘烤模式操作。 位于平行平面上的加强肋被固定在容器的外部并且环绕容器的外部，以便为可加压容器壁承受最大设计压力提供必要的附加强度。
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17.发明授权Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal 失效通过用更贵金属代替聚合物中的金属粉末来制造电导体
公开(公告)号：US4404237A
公开(公告)日：1983-09-13
申请号：US220342
申请日：1980-12-29
摘要： A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using a conventional tin-lead solders.
摘要翻译： 低成本导体，例如 通过将金属粉末和聚合物的混合物施加到基底上并固化聚合物来制备印刷电路，然后进行增强置换反应以用更贵金属代替一些金属粉末，使得 表面上沉积金属的总体积超过了该表面的原始金属粉末的总体积。 该过程在衬底上产生连续的导电金属层。 如此形成的导体可以容易地使用常规的锡铅焊料进行浸出而不进行浸出。
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18.发明授权公开(公告)号：US06883926B2
公开(公告)日：2005-04-26
申请号：US10207317
申请日：2002-07-29
摘要： An apparatus for visual illumination comprised of a display surface, including a phosphor material. At least one light emitting semi-conductor device is (LED) positioned to radiate the phosphor material. The LED emits electromagnetic radiation in a range which excites the phosphor material.
摘要翻译： 一种用于视觉照明的装置，包括显示表面，包括荧光体材料。 至少一个发光半导体器件是（LED）定位成辐射荧光体材料。 LED在激发磷光体材料的范围内发射电磁辐射。
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公开(公告)号：US06635363B1
公开(公告)日：2003-10-21
申请号：US09642901
申请日：2000-08-21
IPC分类号： H01L3300
CPC分类号： H01L33/508 , H01L24/32 , H01L33/44 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2933/0041 , Y10S428/917 , Y10T428/24521 , H01L2924/00014 , H01L2924/00
摘要： A light source (10) includes a light emitting component (32), such as a UV/blue light emitting diode or laser diode. A layer (62, 162, 262, 362) of a phosphor material is spaced from the light emitting component by a layer (60, 160, 260, 360) of a material which is transmissive to the light emitted by the light emitting component. The phosphor material converts a portion of the light emitted by the light emitting component to light of a longer wavelength such as yellow light. In a preferred embodiment, the light transmissive layer valise in thickness over the light emitting component so that the phosphor is spaced further from the diode in regions where the emission is higher. This increases the Surface area of the phosphor in these regions and minimizes the effects of overheating and saturation on the phosphor emission.
摘要翻译： 光源（10）包括诸如UV /蓝色发光二极管或激光二极管的发光部件（32）。 荧光体材料的层（62,162,262,362）与发光部件间隔开由对发光部件发出的光透射的材料层（60,160,260,360）。 荧光体材料将由发光部件发射的光的一部分转换成较长波长的光，例如黄色光。 在优选实施例中，透光层的厚度在发光部件上方的厚度使得荧光体在发射较高的区域中与二极管进一步隔开。 这增加了这些区域中的荧光体的表面积，并使过热和饱和对磷光体发射的影响最小化。
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公开(公告)号：US5562838A
公开(公告)日：1996-10-08
申请号：US037833
申请日：1993-03-29
CPC分类号： B29D11/00701 , G02B6/1221 , G02B6/13 , G02B6/421 , G02B6/43 , G02B2006/12173 , G02B2006/12176
摘要： HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.
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