Abstract:
A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer.
Abstract:
A resistive memory device includes a memory cell array that has a plurality of resistive memory cells that are arranged respectively on regions where a plurality of first signal lines and a plurality of second signal lines cross each other. A write circuit is connected to a selected first signal line that is connected to a selected memory cell from among the plurality of memory cells, and provides pulses to the selected memory cell. A voltage detector detects a node voltage at a connection node between the selected first signal line and the write circuit. A voltage generation circuit generates a first inhibit voltage and a second inhibit voltage that are applied respectively to unselected first and second signal lines connected to unselected memory cells from among the plurality of memory cells, and changes a voltage level of the second inhibit voltage based on the node voltage that is detected.
Abstract:
A memory device and a method of operating the memory device are provided for performing a read-retry operation. The method of operating the memory device includes starting a read-retry mode, reading data of multiple cell regions using different read conditions, and setting a final read condition for the cell regions according to results of data determination operations on data read from the cell regions.
Abstract:
A method of operating a memory device includes determining a value of an operating current flowing through a selected first signal line, to which a selection voltage is applied, from among a plurality of first signal lines; dividing an array of memory cells into n blocks, n being an integer greater than 1, based on the value of the operating current; and applying inhibit voltages having different voltage levels corresponding to the n blocks to unselected ones of second signal lines included in the n blocks. Each of the unselected second signal lines is a pathway through which leakage current may potentially flow due to the operating current flowing through the selected first signal line and a memory cell addressed by the unselected second signal line and the selected first signal line.
Abstract:
A resistive memory device includes a memory cell array including a plurality vertically stacked layers having one layer designated as an interference-free layer and another layer designated as an access prohibited layer, wherein the interference-free layer and the access prohibited layer share a connection with at least one signal line and access operations directed to memory cells the access prohibited layer are prohibited.
Abstract:
A nonvolatile memory device includes multi-level cells. A sensing method of the nonvolatile memory device includes: precharging a bit line and a sense-out node during a first precharge interval; identifying a first state of a selected memory cell, by developing the sense-out node during a first develop time and sensing a first voltage level of the sense-out node; precharging the sense-out node to a second sense-out precharge voltage; and identifying the first state of the selected memory cell from a second state adjacent thereto, by developing the sense-out node during a second develop time different from the first develop time and sensing a second voltage level of the sense-out node.
Abstract:
A semiconductor device includes a substrate including cell and dummy regions, first channel structures on the cell region and extending in a first direction vertical with respect to the substrate, gate lines surrounding outer sidewalls of the first channel structures and extending in a second direction parallel to the substrate, the gate lines being spaced apart from each other along the first direction, cutting lines between the gate lines on the cell region and extending in the second direction, dummy patterns spaced apart from each other along the first direction on the dummy region, the dummy patterns having a stepped shape along a third direction parallel to the top surface of the substrate and perpendicular to the second direction, at least a portion of the dummy patterns including a same conductive material as that in the gate lines, and dummy lines through the dummy patterns.
Abstract:
A memory device is provided as follows. A memory cell region includes a plurality of blocks, each block including a plurality of NAND strings. A control logic divides the plurality of blocks into a plurality of block regions based on a smaller distance of a first distance with respect to a first edge of the memory cell region and a second distance with respect to a second edge of the memory cell region and controls an operation performed on the memory cell region using a plurality of bias sets of operation parameters for the operation. Each bias set is associated with one of the block regions.
Abstract:
An operating method for a resistive memory device includes; applying a bias control voltage to a memory cell array of the resistive memory device, measuring leakage current that occurs in the memory cell array in response to the applied bias control voltage to generate a measuring result, generating a control signal based on the measuring result, and adjusting a level of the bias control voltage in response to the control signal.
Abstract:
A method of operating a memory device includes; applying a pre-write voltage to a selected memory cell by applying a first voltage to a first signal line connected to the selected memory cell and a second voltage to a second signal line connected to the selected memory cell during a first set writing interval, wherein a level of the first voltage is higher than a level of the second voltage, and thereafter, applying a write voltage to the selected memory cell by applying a third voltage having a level lower than the level of the first voltage and higher than the level of the second voltage to the first signal line during a second set writing interval.