公开(公告)号：US20100113117A1

公开(公告)日：2010-05-06

申请号：US12595791

申请日：2008-04-14

Applicant: Andrew Ku ,  Taehoon Kim ,  Do Hoon Kim ,  Jong Sook Kim ,  KeeSeok Jeong ,  Hui Jeong Hong

Inventor： Andrew Ku ,  Taehoon Kim ,  Do Hoon Kim ,  Jong Sook Kim ,  KeeSeok Jeong ,  Hui Jeong Hong

IPC: A63F9/24 ,  A63F13/00

CPC classification number: A63F13/814 ,  A63F13/10 ,  A63F13/12 ,  A63F13/46 ,  A63F13/5375 ,  A63F2300/8047

Abstract: A dance game method and computer-readable storage medium storing instructions for implementing the dance game method is provided. The dance game method arouses a user's interest to feel a sensation of being assimilated with a virtual character dancing according to music.

Abstract translation: 提供了一种舞蹈游戏方法和存储用于实现舞蹈游戏方法的指令的计算机可读存储介质。 舞蹈游戏方法唤起用户的兴趣，感受到与虚拟角色一起被吸收的感觉，根据音乐跳舞。

公开(公告)号：US07656709B2

公开(公告)日：2010-02-02

申请号：US11800002

申请日：2007-05-03

Applicant: Akira Goda ,  Taehoon Kim ,  Doyle Rivers ,  Roger Porter

Inventor： Akira Goda ,  Taehoon Kim ,  Doyle Rivers ,  Roger Porter

IPC: G11C16/04

CPC classification number: G11C16/10 ,  G11C5/145 ,  G11C11/5628 ,  G11C16/0483 ,  G11C16/3454 ,  G11C2211/5621

Abstract: Methods and memories having switching points for changing Vstep increments according to a level of a multilevel cell being programmed include programming at a smaller Vstep increment in narrow threshold voltage situations and programming at a larger Vstep increment where faster programming is desired.

Abstract translation: 具有用于根据正在编程的多电平单元的电平改变Vstep增量的切换点的方法和存储器包括在窄阈值电压情况下以较小的Vstep增量进行编程，并且在需要更快编程的较大Vstep增量下进行编程。

公开(公告)号：US20080038523A1

公开(公告)日：2008-02-14

申请号：US11878165

申请日：2007-07-20

Applicant: Dong Kim ,  Taehoon Kim ,  Jong Song ,  Sam Her ,  Jun Park

Inventor： Dong Kim ,  Taehoon Kim ,  Jong Song ,  Sam Her ,  Jun Park

IPC: B32B3/00 ,  H05K3/10

CPC classification number: H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.

Abstract translation: 这里公开了一种印刷电路板及其制造方法，其可以通过实现超薄精细电路图案来改善电性能，缩短处理时间并减小芯片封装的厚度。 印刷电路板包括绝缘材料; 形成在绝缘材料的给定位置的通孔; 通过离子束表面处理形成的铜籽晶层，并且在其中形成有通孔的绝缘材料的表面上真空沉积; 以及形成在其上形成有铜种子层的绝缘材料的给定区域上的铜图案镀层和通孔。

公开(公告)号：US20070141310A1

公开(公告)日：2007-06-21

申请号：US11585276

申请日：2006-10-24

Applicant: Jong Seok Song ,  Taehoon Kim

Inventor： Jong Seok Song ,  Taehoon Kim

IPC: B05D5/12 ,  B32B3/00

CPC classification number: H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

Abstract: Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

Abstract translation: 公开了一种印刷电路板及其制造方法，其中在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是形成铜层 常规湿法包括表面粗糙化和无电镀铜。 根据本发明，可以在不改变其表面粗糙度的情况下增加基板材料的界面粘合性，从而实现高可靠性的精细电路。 同样，由于氟树脂层的形成，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。

公开(公告)号：US09346136B2

公开(公告)日：2016-05-24

申请号：US14118921

申请日：2011-06-13

Applicant: Taehoon Kim

Inventor： Taehoon Kim

IPC: B23P19/04 ,  G09B19/10 ,  A63H9/00 ,  A63H33/42 ,  A63F9/12 ,  B44C3/12 ,  B44C3/02

CPC classification number: B23P19/04 ,  A63F9/1288 ,  A63F2009/1292 ,  A63F2009/1296 ,  A63H9/00 ,  A63H33/42 ,  B44C3/025 ,  B44C3/12 ,  G09B19/10 ,  Y10T29/49789 ,  Y10T29/49798 ,  Y10T29/49826 ,  Y10T29/49885

Abstract: A method for manufacturing a model is disclosed. The disclosed method for manufacturing the model comprises the steps of: a) preparing a plurality of pieces having contours in the shape of cross-sections of an object from specific distances away from a random axis direction; and b) assembling the plurality of pieces according to an integration process of connecting surfaces of adjacent pieces from the plurality of pieces and fixing same to each other so as to form the model which corresponds to the shape of the object.

Abstract translation: 公开了一种用于制造模型的方法。 所公开的用于制造模型的方法包括以下步骤：a）准备多个具有距离随机轴方向特定距离的物体的横截面形状的轮廓的部件; 以及b）根据从所述多个片的相邻片的连接表面的整合过程将所述多个片组合，并将它们彼此固定，以形成与所述物体的形状对应的模型。

公开(公告)号：US08851539B2

公开(公告)日：2014-10-07

申请号：US13477367

申请日：2012-05-22

Applicant: Dinesh Mana ,  Taehoon Kim

Inventor： Dinesh Mana ,  Taehoon Kim

IPC: B60R19/03

CPC classification number: B60R19/18 ,  B60R19/03 ,  B60R2019/1846

Abstract: An energy absorbing assembly for impact energy absorption can comprise: an elongated plastic member having a major axis, a first side and a second side, comprising a central portion disposed between a first end portion and a second end portion, the second side defines a channel extending from the first end portion to the second end portion; and an elongated insert having a front, edges, tips, and a rear, wherein the insert is configured to flex upon impact, and is removably friction fit within the channel such that the plastic member surrounds the front, and greater than or equal to 50% of the edges and tips. The energy absorbing assembly can be configured to attach to a vehicle to absorb energy absorption impact. A vehicle can comprise: a vehicle rail and the energy absorbing assembly attached to the vehicle rail.

Abstract translation: 用于冲击能量吸收的能量吸收组件可以包括：具有长轴的细长塑料构件，第一侧和第二侧，包括设置在第一端部和第二端部之间的中心部分，第二侧限定通道 从所述第一端部延伸到所述第二端部; 以及具有前部，边缘，尖端和后部的细长插入件，其中所述插入件构造成在冲击时弯曲，并且可移除地摩擦配合在所述通道内，使得所述塑料构件围绕所述前部，并且大于或等于50 ％的边缘和尖端。 能量吸收组件可以被配置成附接到车辆以吸收能量吸收冲击。 车辆可以包括：车辆轨道和附接到车辆轨道的能量吸收组件。

公开(公告)号：US20140082917A1

公开(公告)日：2014-03-27

申请号：US14118921

申请日：2011-06-13

Applicant: Taehoon Kim

Inventor： Taehoon Kim

IPC: B23P19/04

CPC classification number: B23P19/04 ,  A63F9/1288 ,  A63F2009/1292 ,  A63F2009/1296 ,  A63H9/00 ,  A63H33/42 ,  B44C3/025 ,  B44C3/12 ,  G09B19/10 ,  Y10T29/49789 ,  Y10T29/49798 ,  Y10T29/49826 ,  Y10T29/49885

Abstract: A method for manufacturing a model is disclosed. The disclosed method for manufacturing the model comprises the steps of: a) preparing a plurality of pieces having contours in the shape of cross-sections of an object from specific distances away from a random axis direction; and b) assembling the plurality of pieces according to an integration process of connecting surfaces of adjacent pieces from the plurality of pieces and fixing same to each other so as to form the model which corresponds to the shape of the object.

Abstract translation: 公开了一种用于制造模型的方法。 所公开的用于制造模型的方法包括以下步骤：a）准备多个具有距离随机轴方向特定距离的物体的横截面形状的轮廓的部件; 以及b）根据从所述多个片的相邻片的连接表面的整合过程将所述多个片组合，并将它们彼此固定，以形成与所述物体的形状对应的模型。

公开(公告)号：US20130287999A1

公开(公告)日：2013-10-31

申请号：US13702133

申请日：2011-06-07

Applicant: Nam-Goo Cha ,  Yolanda Ehegoyen ,  Ahmed Busnaina ,  Taehoon Kim

Inventor： Nam-Goo Cha ,  Yolanda Ehegoyen ,  Ahmed Busnaina ,  Taehoon Kim

IPC: B81B1/00 ,  B32B3/18 ,  B81C1/00

CPC classification number: B81B1/002 ,  B05D1/00 ,  B05D1/36 ,  B05D7/22 ,  B05D2401/32 ,  B22F2998/00 ,  B32B3/18 ,  B81C1/00373 ,  B81C1/0038 ,  C23C26/00 ,  Y10T428/24355 ,  Y10T428/24562 ,  B22F1/0022

Abstract: A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.

Abstract translation: 通过流体输送将胶体颗粒组装到基材表面上的方法。 该方法包括放置邻近衬底表面放置的第一流体，在第一流体层的顶部上施加胶态分散体并除去第一流体层。 该方法是非常通用的，并且特别可用于在高纵横比通道和通孔中沉积胶体材料，而不需要对表面进行先前的处理。

公开(公告)号：US20120267223A1

公开(公告)日：2012-10-25

申请号：US13534105

申请日：2012-06-27

Applicant: Sivasubramanian Somu ,  Ahmed Busnaina ,  Nicol McGruer ,  Peter Ryan ,  George G. Adams ,  Xugang Xiong ,  Taehoon Kim

Inventor： Sivasubramanian Somu ,  Ahmed Busnaina ,  Nicol McGruer ,  Peter Ryan ,  George G. Adams ,  Xugang Xiong ,  Taehoon Kim

IPC: C25D13/02 ,  H01H59/00 ,  B82Y30/00 ,  B82Y40/00 ,  B82Y99/00

CPC classification number: H01H11/04 ,  B82Y10/00 ,  B82Y40/00 ,  G11C11/50 ,  G11C13/025 ,  G11C2213/16 ,  H01L51/0048 ,  H01L51/0575 ,  H01L51/0591 ,  Y10S977/89 ,  Y10S977/943

Abstract: A non-volatile bistable nano-electromechanical switch is provided for use in memory devices and microprocessors. The switch employs carbon nanotubes as the actuation element. A method has been developed for fabricating nanoswitches having one single-walled carbon nanotube as the actuator. The actuation of two different states can be achieved using the same low voltage for each state.

公开(公告)号：US20120043125A1

公开(公告)日：2012-02-23

申请号：US13193699

申请日：2011-07-29

Applicant: Taehoon Kim ,  Jonggi Lee ,  Seungduk Baek

Inventor： Taehoon Kim ,  Jonggi Lee ,  Seungduk Baek

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/184 ,  C23C18/1605 ,  C23C18/2086 ,  C23C18/44 ,  H05K2203/0793 ,  H05K2203/122 ,  Y10T29/49155

Abstract: Provided is a method of forming a circuit board including an adhesion portion. The method may include forming a mask pattern including an opening on a board; performing a surface treatment process at a bottom of the opening; combining a linker with the surface on which a surface treatment process is performed; and forming a metal pattern combined with the linker in the opening.

Abstract translation: 提供一种形成包括粘合部分的电路板的方法。 该方法可以包括在板上形成包括开口的掩模图案; 在开口的底部进行表面处理过程; 将接头与其上进行表面处理过程的表面结合; 并在开口中形成与接头组合的金属图案。