公开(公告)号：US06168972A

公开(公告)日：2001-01-02

申请号：US09218781

申请日：1998-12-22

申请人： Wen-chou Vincent Wang ,  Michael G. Peters ,  Dashun S. Zhou ,  Yasuhito Takahashi

发明人： Wen-chou Vincent Wang ,  Michael G. Peters ,  Dashun S. Zhou ,  Yasuhito Takahashi

IPC分类号： H01L2148

CPC分类号： H01L24/94 ,  H01L21/563 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

摘要： An encapsulation process for flip-chip bonding chips to a substrate encapsulates solder balls on the chip in a separate encapsulation process in which the chip is coated with encapsulation layer and then a portion of the encapsulation layer is removed to expose a portion of the solder balls.

摘要翻译： 用于将衬底倒装芯片接合到衬底的封装工艺在单独的封装工艺中封装芯片上的焊球，其中芯片被封装层涂覆，然后去除一部分封装层以暴露焊料球的一部分 。

公开(公告)号：US6081026A

公开(公告)日：2000-06-27

申请号：US191755

申请日：1998-11-13

申请人： Wen-chou Vincent Wang ,  Yasuhito Takahashi ,  William T. Chou ,  Michael G. Peters ,  Michael G. Lee ,  Solomon Beilin

发明人： Wen-chou Vincent Wang ,  Yasuhito Takahashi ,  William T. Chou ,  Michael G. Peters ,  Michael G. Lee ,  Solomon Beilin

IPC分类号： H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L23/552 ,  H05K1/02 ,  H05K1/14 ,  H05K3/20 ,  H01L23/12 ,  H01L23/053

CPC分类号： H01L23/5383 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/552 ,  H05K1/0219 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/10378 ,  H05K3/20

摘要： An interposer for providing power, ground, and signal connections between an integrated circuit chip or chips and a substrate. The interposer includes a signal core and external power/ground connection wrap. The two sections may be fabricated and tested separately, then joined together using z-connection technology. The signal core is a dielectric film with patterned metal on both sides. The two metal layers are interconnected by a through via or post process. The power/ground wrap includes an upper substrate positioned above the signal core and a lower substrate positioned below the signal core. The upper and lower substrates of the power/ground wrap are formed from a dielectric film having a patterned metal layer on both sides connected by a through via or post process. The upper power/ground wrap substrate, signal core, and lower power/ground substrate are interconnected as desired using z-connection technology (e.g., solder or conductive ink). The power/ground layers on the upper substrate can be connected to the power/ground layers on the lower substrate by suitable edge connectors. With an integrated circuit chip or chips connected to the upper layer of the top substrate of the power/ground wrap and a printed circuit board or other mounting substrate connected to the bottom layer of the lower substrate of the wrap, the inventive interposer provides a set of high density and electrically isolated signal, power, and ground interconnections.

摘要翻译： 一种用于在集成电路芯片或芯片与基板之间提供电源，接地和信号连接的插入器。 插入器包括信号芯和外部电源/接地连接外壳。 这两个部分可以单独制造和测试，然后使用z连接技术连接在一起。 信号芯是两侧具有图案化金属的电介质膜。 两个金属层通过通孔或后处理相互连接。 电源/接地包裹物包括位于信号芯上方的上基板和位于信号芯下方的下基板。 电源/接地套管的上基板和下基板由具有通过通孔或后工艺连接的两侧上的图案化金属层的电介质膜形成。 上电源/地基封装衬底，信号芯和下电源/接地衬底根据需要使用z连接技术（例如焊料或导电油墨）互连。 上基板上的电源/接地层可以通过合适的边缘连接器连接到下基板上的电源/接地层。 通过将集成电路芯片或芯片连接到电源/接地外壳的顶部基板的上层，以及连接到包装的下基板的底层的印刷电路板或其它安装基板，本发明的插入件提供一组 高密度和电隔离的信号，电源和接地互连。

公开(公告)号：US06448106B1

公开(公告)日：2002-09-10

申请号：US09437736

申请日：1999-11-09

申请人： Wen-chou Vincent Wang ,  Thomas J. Massingill ,  Yasuhito Takahashi ,  Lei Zhang

发明人： Wen-chou Vincent Wang ,  Thomas J. Massingill ,  Yasuhito Takahashi ,  Lei Zhang

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/6835 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K1/0271 ,  H05K1/113 ,  H05K2201/10318 ,  H05K2201/1034 ,  H05K2201/10704 ,  H01L2924/00 ,  H01L2224/0401

摘要： Device modules with pins and methods for making device modules with pins are disclosed. One embodiment is directed to a method including forming a polymeric circuit structure having a first side and a second side on a substrate. The formed first side is adjacent to the substrate. A pin is bonded to the second side of the polymeric circuit structure. At least a portion of the substrate is removed to expose at least a portion of the first side of the polymeric circuit structure, and a device is mounted on the first side of the polymeric circuit structure.

摘要翻译： 公开了具有引脚的装置模块和用于制造具有引脚的装置模块的方法。 一个实施例涉及包括在基板上形成具有第一侧和第二侧的聚合物电路结构的方法。 形成的第一侧与基底相邻。 销被接合到聚合物电路结构的第二侧。 去除衬底的至少一部分以暴露聚合物电路结构的第一侧的至少一部分，并且将器件安装在聚合物电路结构的第一侧上。

公开(公告)号：US07513037B2

公开(公告)日：2009-04-07

申请号：US11060002

申请日：2005-02-17

申请人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Michael G. Peters ,  Yasuhito Takahashi

发明人： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Michael G. Peters ,  Yasuhito Takahashi

IPC分类号： H01K3/10

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/185 ,  H05K3/4602 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for producing a circuit board having an integrated electronic component comprising providing a circuit board substrate having a first substrate surface and a second substrate surface, securing an integrated electronic component to the first substrate surface, and disposing a first dielectric layer on the first substrate surface and over the first integrated electronic component. The method additionally includes disposing a metallic layer on the first dielectric layer to produce an integrated electronic component assembly, producing in the integrated electronic component assembly at least one via having a metal lining in contact with the metallic layer, and disposing a second dielectric layer over the via and over the metallic layer. At least one metal-lined opening is formed in the second dielectric layer and in the first dielectric layer to expose at least part of the integrated electronic component, and to couple the metal lining of the opening to the first integrated electronic component to produce a circuit board having at least one integrated electronic component. A multi-layer printed circuit board having at least one prefabricated, integrated electronic component.

摘要翻译： 一种具有集成电子部件的电路板的制造方法，其特征在于，具备：提供具有第一基板表面和第二基板表面的电路板基板，将集成电子部件固定到所述第一基板表面，以及将第一电介质层设置在所述第一基板 表面和第一个集成电子部件。 该方法还包括在第一电介质层上设置金属层以产生集成的电子部件组件，在集成电子部件组件中产生具有与金属层接触的金属衬里的至少一个通孔，并且将第二电介质层设置在 通孔和金属层上。 在第二电介质层和第一电介质层中形成至少一个金属衬里的开口以暴露集成电子元件的至少一部分，并将开口的金属衬里连接到第一集成电子元件以产生电路 具有至少一个集成电子部件的板。 具有至少一个预制的集成电子部件的多层印刷电路板。

公开(公告)号：US20070272941A1

公开(公告)日：2007-11-29

申请号：US10599501

申请日：2005-03-31

申请人： Hisashi Minemoto ,  Yasuo Kitaoka ,  Isao Kidoguchi ,  Yusuke Mori ,  Fumio Kawamura ,  Takatomo Sasaki ,  Yasuhito Takahashi

发明人： Hisashi Minemoto ,  Yasuo Kitaoka ,  Isao Kidoguchi ,  Yusuke Mori ,  Fumio Kawamura ,  Takatomo Sasaki ,  Yasuhito Takahashi

IPC分类号： C30B29/38 ,  C30B35/00 ,  H01L29/12 ,  H01L33/00

CPC分类号： C30B9/10 ,  C30B29/403 ,  C30B29/406 ,  Y10T117/1092 ,  Y10T117/1096

摘要： A method for producing Group-III-element nitride crystals by which an improved growth rate is obtained and large high-quality crystals can be grown in a short time, a producing apparatus used therein, and a semiconductor element obtained using the method and the apparatus are provided. The method is a method for producing Group-III-element nitride crystals that includes a crystal growth process of subjecting a material solution containing a Group III element, nitrogen, and at least one of alkali metal and alkaline-earth metal to pressurizing and heating under an atmosphere of a nitrogen-containing gas so that the nitrogen and the Group III element in the material solution react with each other to grow crystals. The method further includes, prior to the crystal growth process, a material preparation process of preparing the material solution in a manner that under an atmosphere of a nitrogen-containing gas, at least one of an ambient temperature and an ambient pressure is set so as to be higher than is set as a condition for the crystal growth process so that the nitrogen is allowed to dissolve in a melt containing the Group III element and the at least one of alkali metal and alkaline-earth metal. The method according to the present invention can be performed by using, for example, the producing apparatus shown in FIG. 7.

摘要翻译： 一种生产III族元素的氮化物晶体的方法，其中获得了改善的生长速率并且可以在短时间内生长大量的高质量晶体，其中使用的制造装置以及使用该方法和装置得到的半导体元件 被提供。 该方法是生产III族元素氮化物晶体的方法，其包括使含有III族元素，氮和至少一种碱金属和碱土金属的材料溶液经受加压和加热的晶体生长过程 含氮气体的气氛使得材料溶液中的氮和III族元素彼此反应生长晶体。 该方法还包括在晶体生长过程之前，制备材料制备方法，该方法是在含氮气体的环境温度和环境压力中的至少一种的气氛下， 高于设定为晶体生长过程的条件，使得氮能够溶解在含有III族元素和碱金属和碱土金属中的至少一种的熔体中。 根据本发明的方法可以通过使用例如图1所示的制造装置来进行。 7 。

公开(公告)号：US20070157876A1

公开(公告)日：2007-07-12

申请号：US10587223

申请日：2005-04-27

申请人： Hisashi Minemoto ,  Yasuo Kitaoka ,  Isao Kidoguchi ,  Yusuke Mori ,  Fumio Kawamura ,  Takatomo Sasaki ,  Hidekazu Umeda ,  Yasuhito Takahashi

发明人： Hisashi Minemoto ,  Yasuo Kitaoka ,  Isao Kidoguchi ,  Yusuke Mori ,  Fumio Kawamura ,  Takatomo Sasaki ,  Hidekazu Umeda ,  Yasuhito Takahashi

IPC分类号： C30B11/00 ,  C30B23/00 ,  C30B21/06 ,  B01J3/04

CPC分类号： C30B29/403 ,  C30B9/10 ,  C30B29/406 ,  C30B35/00 ,  Y10T117/1064 ,  Y10T117/1096

摘要： A manufacturing apparatus of Group III nitride crystals and a method for manufacturing Group III nitride crystals are provided, by which high quality crystals can be manufactured. For instance, crystals are grown using the apparatus of the present invention as follows. A crystal raw material (131) and gas containing nitrogen are introduced into a reactor vessel (120), to which heat is applied by a heater (110), and crystals are grown in an atmosphere of pressure applied thereto. The gas is introduced from a gas supplying device (180) to the reactor vessel (120) through a gas inlet of the reactor vessel, and then is exhausted to the inside of a pressure-resistant vessel (102) through a gas outlet of the reactor vessel. Since the gas is introduced directly to the reactor vessel (120) without passing through the pressure-resistant vessel (102), the mixture of impurities attached to the pressure-resistant vessel (102) and the like into the site of the crystal growth can be prevented. Further, since the gas flows through the reactor vessel (120), there is no aggregation of an evaporating alkali metal, etc., at the gas inlet or the like, and such an alkali metal does not flow into the gas supplying device (180). As a result, the quality of Group III nitride crystals obtained can be improved.

摘要翻译： 提供III族氮化物晶体的制造装置和制造III族氮化物晶体的方法，由此可以制造高质量的晶体。 例如，使用本发明的装置如下生长晶体。 将晶体原料（131）和含氮气体引入反应器容器（120）中，通过加热器（110）向其施加热量，并在施加压力的气氛中生长晶体。 气体通过反应器容器的气体入口从气体供给装置（180）引入反应器容器（120），然后通过反应器的气体出口被排出到耐压容器（102）的内部 反应堆容器。 由于气体不通过耐压容器（102）直接引入反应器容器（120），附着在耐压容器（102）等上的杂质混合物进入晶体生长位置可以 被阻止 此外，由于气体流过反应器容器（120），所以在气体入口等处没有蒸发的碱金属等的聚集，并且这种碱金属不会流入气体供给装置（180 ）。 结果，可以提高获得的III族氮化物晶体的质量。

公开(公告)号：USD435061S

公开(公告)日：2000-12-12

申请号：US108470

申请日：1999-07-29

申请人： Hiroyuki Ohtsuka ,  Hidenobu Kondo ,  Seiichi Irokawa ,  Hirohisa Hoshino ,  Yasuhito Takahashi

设计人： Hiroyuki Ohtsuka ,  Hidenobu Kondo ,  Seiichi Irokawa ,  Hirohisa Hoshino ,  Yasuhito Takahashi

公开(公告)号：US5860359A

公开(公告)日：1999-01-19

申请号：US737468

申请日：1997-02-07

申请人： Noboru Taniguchi ,  Takaharu Gamou ,  Yasuhito Takahashi ,  Kunihito Mori ,  Eiichi Yasumoto

发明人： Noboru Taniguchi ,  Takaharu Gamou ,  Yasuhito Takahashi ,  Kunihito Mori ,  Eiichi Yasumoto

IPC分类号： A23L3/3418 ,  A23L3/3436 ,  A47J27/04 ,  B01D53/32 ,  C01B3/00 ,  C01B13/02 ,  A23L1/00 ,  A47J27/00 ,  F27D11/02

CPC分类号： C01B13/0255 ,  A23L3/3418 ,  A23L3/3436 ,  A47J27/04 ,  B01D53/326 ,  C01B13/0251 ,  C01B3/0005 ,  B01D2257/104 ,  B01D2257/80 ,  C01B2210/0046 ,  C01B2210/0053 ,  Y02E60/324

摘要： A face shaped molding body of first electrode/solid electrolyte/second electrode composed of first and second electrodes on both the faces of the sold electrolyte layer is adapted to impress DC valve between the first electrode and second electrode in a condition where the solid electrolyte layer is heated to a given operation temperature. Atmosphere poor in oxygen or atmosphere rich in oxygen can be formed, by a gas pump which is selectively capable of discharging or feeding at least oxygen gas from the first atmosphere to the second atmosphere, so that atmosphere suitable for food preservation can be retained or chamber wherein oxygen is likely to be poor at heating can be retained in a condition rich in oxygen. Also, oxygen gas can be exchanged for steam when necessary so that the exchange ratio can be controlled by the controlling of the electrolysis voltage. Further, atmosphere is likely to be controlled, because the transportation amount of the oxygen gas and steam can be weighed by the current amount.

摘要翻译： PCT No.PCT / JP96 / 00718 Sec。 371日期1997年2月7日 102（e）日期1997年2月7日PCT 1996年3月18日PCT公布。 公开号WO96 / 28589 日期1996年9月19日在出售的电解质层的两个表面上由第一和第二电极组成的第一电极/固体电解质/第二电极的面状成形体适于在第一电极和第二电极之间的条件下施加DC阀 其中固体电解质层被加热到给定的操作温度。 可以通过选择性地能够将至少氧气从第一大气排出或进料至第二气氛的气泵形成氧气或富氧气氛的气氛，从而可以保持适合于食物保存的气氛或室 其中氧气在加热时可能很差，可以保持在富氧的条件下。 此外，氧气可以根据需要进行蒸汽交换，从而可以通过控制电解电压来控制交换比。 此外，由于氧气和蒸汽的输送量可以通过当前量称量，所以可能控制气氛。

公开(公告)号：US5510883A

公开(公告)日：1996-04-23

申请号：US386598

申请日：1995-02-10

申请人： Tsutomu Kimura ,  Masaaki Fukuhara ,  Yasuhito Takahashi ,  Toru Isosu

发明人： Tsutomu Kimura ,  Masaaki Fukuhara ,  Yasuhito Takahashi ,  Toru Isosu

IPC分类号： G03G15/08 ,  G03G15/00

CPC分类号： G03G15/0822 ,  G03G2215/0819

摘要： An electrophotographic single-component developing device including a development roller; a toner storing portion provided in parallel relationship to an axis of the development roller, for storing a single-component toner; and a toner feeding unit provided in the toner storing portion, for feeding the single-component toner stored in the toner storing portion in a direction parallel to the axis of the development roller and supplying the single-component toner to the development roller. The toner feeding unit has a spiral agitator formed from a wire. Accordingly, the ability of toner feed along the development roller and the ability of toner supply to the development roller can be improved without deterioration of the toner.

摘要翻译： 一种电子照相单组分显影装置，包括显影辊; 调色剂存储部分，其与显影辊的轴线平行地设置，用于存储单组分调色剂; 以及调色剂供给单元，设置在调色剂存储部分中，用于沿着平行于显影辊的轴线的方向供给存储在调色剂存储部分中的单组分调色剂，并将单组分调色剂供给到显影辊。 调色剂供给单元具有由导线形成的螺旋搅拌器。 因此，可以提高调色剂沿着显影辊进给的能力和调色剂供应到显影辊的能力，而不会降低调色剂。

公开(公告)号：US5331382A

公开(公告)日：1994-07-19

申请号：US142114

申请日：1993-10-28

申请人： Kanenori Miura ,  Shiro Suzuki ,  Yasuhito Takahashi ,  Masaru Ono

发明人： Kanenori Miura ,  Shiro Suzuki ,  Yasuhito Takahashi ,  Masaru Ono

IPC分类号： G03G15/08 ,  G03G15/00 ,  G03G15/06

CPC分类号： G03G15/0886 ,  G03G15/0868 ,  G03G15/0872 ,  G03G2215/0665 ,  G03G2215/0675 ,  G03G2215/0685

摘要： A toner cartridge for an image forming apparatus including a case body having a tubular portion, first and second end walls, and first and second positioning members. The first positioning member radially protrudes from the first end wall and has a flat end face. The first positioning member, which is used for positioning the toner cartridge at the start of loading the toner cartridge into the image forming apparatus, is aligned with a first guide in the image forming apparatus at the start of loading the toner cartridge. The second positioning member, which radially protrudes from the second end wall of the cartridge and has a flat end face, is angularly shifted from the first positioning member. After the first positioning member is aligned with the guide, the cartridge is rotated to align the second positioning member with a second guide in said image forming apparatus.

摘要翻译： 一种用于图像形成装置的调色剂盒，包括具有管状部分的壳体，第一和第二端壁以及第一和第二定位构件。 第一定位构件从第一端壁径向突出并具有平坦的端面。 在开始将调色剂盒装载到图像形成装置中时用于定位调色剂盒的第一定位构件在开始装载调色剂盒时与图像形成装置中的第一引导件对齐。 第二定位构件从盒的第二端壁径向突出并且具有平坦的端面，从第一定位构件成角度地移位。 在第一定位构件与引导件对准之后，盒被旋转以使第二定位构件与所述图像形成装置中的第二引导件对准。