公开(公告)号：US20060278980A1

公开(公告)日：2006-12-14

申请号：US11329576

申请日：2006-01-10

申请人： John Trezza ,  John Callahan ,  Gregory Dudoff

发明人： John Trezza ,  John Callahan ,  Gregory Dudoff

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/427 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2224/45111 ,  H01L2224/75 ,  H01L2224/75305 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2224/81894 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/183 ,  H01S5/18308 ,  H01S2301/176 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

摘要翻译： 一种具有至少一个电触点的芯片，其具有靠近芯片的第一端和从芯片移除的第二端，第二端包括构造成便于将至少一个触点插入另一个芯片上的可延展触点的图案， 图案包括具有周长和表面积的非平面表面，所述表面面积大于相同周边的平坦表面。

公开(公告)号：US20060105826A1

公开(公告)日：2006-05-18

申请号：US10991045

申请日：2004-11-16

申请人： M. Wimberly ,  John Callahan

发明人： M. Wimberly ,  John Callahan

IPC分类号： A63F9/24

CPC分类号： A63F13/24 ,  A63F13/08 ,  A63F13/10 ,  A63F13/5372 ,  A63F2300/64

摘要： An electronic game wherein a participant, using a joysick to control the movement of an indica of player position on a video display, attempts to keep his indicia of player position between two moving and encroaching end zones longer than other participants.

摘要翻译： 一种电子游戏，其中使用玩偶来控制玩家位置在视频显示器上的移动的参与者试图将玩家位置的标记保持在比其他参与者更长的两个移动和侵入的终点区域之间。

公开(公告)号：US20060103660A1

公开(公告)日：2006-05-18

申请号：US10992628

申请日：2004-11-18

申请人： Stephen Maynard ,  John Callahan ,  Ben Payne

发明人： Stephen Maynard ,  John Callahan ,  Ben Payne

IPC分类号： G09G5/02

CPC分类号： H04N21/40 ,  H04N19/186 ,  H04N19/46 ,  H04N19/70

摘要： Methods and apparatus for generating images, compressing image data, decompressing image data, and processing the decompressed image data so that it can be used by a rendering circuit of a device, e.g., a set top box, are described. Images are generated in the native format used by the rendering circuit of the device which will ultimately control the display of the image avoiding the need to perform processing associated with converting color component information from one format to another. Uncompressed image data is arranged in a file with color component values being grouped separately from alpha values to facilitate compression by a standard file compression technique. The file is compressed using a conventional file compression operation. The compressed image file is decompressed when needed and the alpha data and color component data is reorganized so that the color component values and alpha value(s) corresponding to individual pixels are grouped together.

摘要翻译： 描述了用于生成图像的方法和装置，压缩图像数据，解压缩图像数据以及处理解压缩的图像数据，使得其可以被诸如机顶盒的装置的呈现电路使用。 图像以由设备的渲染电路使用的原始格式生成，这将最终控制图像的显示，避免了执行与将颜色分量信息从一种格式转换成另一格式相关联的处理的需要。 将未压缩的图像数据排列在具有与α值分开分组的颜色分量值的文件中，以便于通过标准文件压缩技术的压缩。 使用常规文件压缩操作压缩文件。 压缩图像文件在需要时进行解压缩，并且重新组织alpha数据和颜色分量数据，使得与各个像素相对应的颜色分量值和α值被分组在一起。

公开(公告)号：US07598163B2

公开(公告)日：2009-10-06

申请号：US11675268

申请日：2007-02-15

申请人： John Callahan ,  John Trezza

发明人： John Callahan ,  John Trezza

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A method involves pattern etching a photoresist that is located on a wafer that contains a deposited seed layer to expose portions of the seed layer, plating the wafer so that plating metal builds up on only the exposed seed layer until the plating metal has reached an elevation above the seed layer that is at least equal to a thickness of the seed layer, removing the solid photoresist, and removing seed layer exposed by removal of the photoresist and plated metal until all of the exposed seed layer has been removed.

摘要翻译： 一种方法包括图案蚀刻位于晶片上的光致抗蚀剂，该光致抗蚀剂包含沉积的种子层以暴露种子层的部分，电镀晶片，使得电镀金属仅在暴露的种子层上积累，直到电镀金属达到高度 在种子层上方至少等于种子层的厚度，去除固体光致抗蚀剂，以及通过去除光致抗蚀剂和电镀金属去除暴露的种子层，直到所有暴露的种子层已被去除。

公开(公告)号：US20060281303A1

公开(公告)日：2006-12-14

申请号：US11330011

申请日：2006-01-10

申请人： John Trezza ,  John Callahan ,  Gregory Dudoff

发明人： John Trezza ,  John Callahan ,  Gregory Dudoff

IPC分类号： H01L21/4763

CPC分类号： H01L25/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/24226 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of joining contacts on two chips, each having multiple contacts, to each other involves maintaining a first of the chips at a first temperature, the first of the chips having a rigid electrical contact thereon, bringing a second chip, having an electrical contact that is malleable with respect to the rigid contact and matingly corresponding thereto, into contact with the first such that the corresponding rigid and malleable contacts are brought together, locally raising the second of the chips to a local temperature that is sufficiently high to cause material of the rigid and malleable contact to interdiffuse, interpenetrate or both, but below both a temperature that would cause the material to become liquidus and a fuse temperature, and allowing the second of the chips to cool to at least the first temperature.

摘要翻译： 将彼此具有多个触点的两个芯片上的触点接合的方法包括将第一芯片保持在第一温度，第一芯片在其上具有刚性电接触，带来具有电接触的第二芯片 相对于其刚性接触并且与其配合地相对应地是可延展的，与第一接触部相接触，使得相应的刚性和可延展的触点被接合在一起，将第二芯片局部地升高到足够高的局部温度， 刚性和可延展的接触件相互扩散，互穿或两者，但低于将导致材料变成液相线的温度和熔丝温度，并且允许第二芯片冷却至少第一温度。

公开(公告)号：US20060278988A1

公开(公告)日：2006-12-14

申请号：US11329481

申请日：2006-01-10

申请人： John Trezza ,  John Callahan ,  Gregory Dudoff

发明人： John Trezza ,  John Callahan ,  Gregory Dudoff

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/427 ,  H01L23/48 ,  H01L23/481 ,  H01L23/488 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/02 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11912 ,  H01L2224/13012 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/16146 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2224/45111 ,  H01L2224/75 ,  H01L2224/75305 ,  H01L2224/81001 ,  H01L2224/81011 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2224/81894 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/0422 ,  H01S5/0425 ,  H01S5/183 ,  H01S5/18308 ,  H01S2301/176 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

摘要翻译： 一种半导体芯片，其具有IC焊盘，所述半导体芯片具有与所述IC焊盘至少一个电触头电连接的器件，所述电触头具有穿过所述高度的高度和横截面轮廓，所述高度和横截面轮廓被构造成促进穿透 在第二半导体芯片上的电触点的至少一部分成为可延展的触点。

公开(公告)号：US20060229811A1

公开(公告)日：2006-10-12

申请号：US11103680

申请日：2005-04-12

申请人： Daren Herman ,  John Callahan

发明人： Daren Herman ,  John Callahan

IPC分类号： G01C21/00

CPC分类号： G01C21/3688

摘要： A vehicle navigation system that includes a vehicle mounted data display and a portable global positioning system (“GPS”) unit that may interface with the vehicle mounted data display.

摘要翻译： 一种包括车载数据显示器和可与车载数据显示器接口的便携式全球定位系统（“GPS”）单元的车辆导航系统。

公开(公告)号：US20050177855A1

公开(公告)日：2005-08-11

申请号：US11056625

申请日：2005-02-11

申请人： Stephen Maynard ,  Tho Autruong ,  John Callahan ,  Nicholas Nielsen

发明人： Stephen Maynard ,  Tho Autruong ,  John Callahan ,  Nicholas Nielsen

IPC分类号： H04L12/28 ,  H04N7/173 ,  H04N7/18 ,  H04N7/16

CPC分类号： H04N21/6587 ,  H04L12/2801 ,  H04N7/17336 ,  H04N21/2387 ,  H04N21/2402 ,  H04N21/47202 ,  H04N21/47217 ,  H04N21/64738

摘要： Methods and apparatus for performing dynamic compensation for delays over extant infrastructure within a content-based network. In one embodiment, the network comprises a cable network, and the infrastructure comprises that nominally used for on-demand (OD) services such as VOD. The method includes periodically or situationally assessing variable delays within the system associated with functional commands (such as “trick mode” commands), and dynamically compensating for these variable delays in order to improve the accuracy and timeliness of the user's trick mode command. This approach increases user satisfaction, and obviates the issuance of additional compensatory trick mode commands that only further degrade the performance of the network.

摘要翻译： 对基于内容的网络中的现有基础设施的延迟执行动态补偿的方法和装置。 在一个实施例中，网络包括有线网络，并且基础设施包括名义上用于诸如VOD的点播（OD）服务。 该方法包括周期地或情境地评估与功能命令（例如“特技模式”命令）相关联的系统内的可变延迟，以及动态补偿这些可变延迟，以便提高用户特技模式命令的准确性和及时性。 这种方法提高了用户的满意度，避免了额外的补偿性技巧模式命令的发布，这种命令只会进一步降低网络的性能。

公开(公告)号：US06489035B1

公开(公告)日：2002-12-03

申请号：US09628766

申请日：2000-07-31

申请人： Jiangtao Wang ,  John Callahan ,  Dan Lillie

发明人： Jiangtao Wang ,  John Callahan ,  Dan Lillie

IPC分类号： B32B1504

CPC分类号： C23C2/02 ,  C23C2/26 ,  C23C14/024 ,  C23C14/025 ,  C23C28/044 ,  C23C28/321 ,  C23C28/345 ,  H05K1/167 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/12438 ,  Y10T428/12472

摘要： A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.

摘要翻译： 由经过处理以在其上具有稳定层的铜箔组成的​​片材。 稳定层由氧化锌，氧化铬或其组合构成，其厚度介于约和之间。 在稳定层上提供蒸镀电阻材料。

公开(公告)号：US06489034B1

公开(公告)日：2002-12-03

申请号：US09500192

申请日：2000-02-08

申请人： Jiangtao Wang ,  John Callahan ,  Dan Lillie

发明人： Jiangtao Wang ,  John Callahan ,  Dan Lillie

IPC分类号： B32B1504

CPC分类号： H05K1/167 ,  C23C2/02 ,  C23C2/26 ,  C23C14/024 ,  C23C14/025 ,  C23C28/321 ,  C23C28/322 ,  C23C28/3225 ,  C23C28/345 ,  C23C28/3455 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T428/12438

摘要： A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.

摘要翻译： 一种在铜层上施加金属的方法，包括以下步骤：通过向其施加稳定层来稳定铜层的表面，所述稳定层由氧化锌，氧化铬，镍，氧化镍或其组合构成，稳定层由 具有约5埃至约70埃的厚度; 并将从铝，镍，铬，铜，铁，铟，锌，钽，锡，钒，钨，锆，钼及其合金中选出的金属蒸镀沉积在铜层的稳定化表面上， 由此形成的材料。