Abstract:
Techniques for providing a semiconductor assembly having an interconnect die for die-to-die interconnection, an IC package, a method for manufacturing, and a method for routing signals in an IC package are described. In one implementation, a semiconductor assembly is provided that includes a first interconnect die coupled to a first integrated circuit (IC) die and a second IC die by inter-die connections. The first interconnect die includes solid state circuitry that provides a signal transmission path between the IC dice.
Abstract:
An integrated circuit enabling the communication of data is described. The integrated circuit comprises an input/output port; a plurality of data converter circuits; and programmable interconnect circuits coupled between the input/output port and the plurality of data converter circuits, the programmable interconnect circuits enabling a connection of the plurality of data converter circuits to the input/output port of the integrated circuit. A method of enabling the communication of data in an integrated circuit is also described.
Abstract:
An integrated circuit (IC) chip device includes testing interface circuity and testing circuitry to test the operation of the IC chips of the IC chip device. The IC chip device includes a first IC chip that comprises first testing circuitry. The first testing circuitry receives a mode select signal, a clock signal, and encoded signals, and comprises finite state machine (FSM) circuitry, decoder circuitry, and control circuitry. The FSM circuitry determines an instruction based on the mode select signal and the clock signal. The decoder circuitry decodes the encoded signals to generate a decoded signal. The control circuitry generates a control signal from the instruction and the decoded signal. The control signal indicates a test to be performed by the first testing circuitry.
Abstract:
Circuits and methods involve an integrated circuit (IC) device, a plurality of application-specific sub-circuits, and a plurality of instances of a measuring circuit. The application-specific sub-circuits are disposed within respective areas of the IC device. Each instance of the measuring circuit is associated with one of the application-specific sub-circuits and is disposed within a respective one of the areas of the device. Each instance of the measuring circuit further includes a ring oscillator and a register for storage of a value indicative of an interval of time. Each instance of the measuring circuit is configured to measure passage of the interval of time based on a first clock signal, count oscillations of an output signal of the ring oscillator during the interval of time, and output a value indicating a number of oscillations counted during the interval of time.
Abstract:
An integrated circuit can include one or more clock controllers. Each clock controller corresponds to a different clock signal of a set of one or more clock signals of the integrated circuit. Each clock controller is configured to implement a clock stretch mode that generates a modified clock signal having a frequency that is less than the clock signal. The integrated circuit can include a trigger circuit configured to enable selected ones of the one or more clock controllers to implement the clock stretch mode. The trigger circuit and the one or more clock controllers are hardwired and are programmable using control infrastructure circuitry of the integrated circuit.
Abstract:
Methods and circuits for performing a clock-stop process of a circuit are disclosed. For example, a circuit includes a clock group having a first clock domain, a first clock multiplexer, a first synchronizer and a controller. The controller is configured to initiate a clock stop process of the circuit by sending an alternative mode signal to the first synchronizer. The first synchronizer is configured to synchronize the alternative mode signal to a clock of the first clock domain and is further configured to output, to a select line of the first clock multiplexer, the alternative mode signal that is synchronized to the clock of the first clock domain. The select line of the first clock multiplexer is for selecting from between an input of the first clock multiplexer for the clock of the first clock domain and an alternative clock input of the first clock multiplexer for an alternative clock signal from the controller.
Abstract:
In an apparatus relating generally to an IC die, the IC die has a regulated power supply, a power supply grid, and a test circuit. The regulated power supply is biased between a source supply node and a source ground node, which are externally accessible nodes of the IC die. An internal supply node of the power supply grid is coupled to the regulated power supply. The test circuit is coupled to the internal supply node of the power supply grid. The test circuit is configured to test for at least one short in the power supply grid. The test circuit is configured to limit power through the power supply grid to less than that of a probe tip tolerance. The test circuit is configured to test for the at least one short in presence of background current leakage of the power supply grid.
Abstract:
In one example, an integrated circuit (IC) is provided that includes data circuitry and a processing circuitry. The data circuitry is configured to provide data to be transferred to a different circuitry within the IC or to an external IC. The processing circuitry is configured to: read the data provided by the data circuitry before it is transferred to the different circuitry or the external IC; calculate a first signature for the data; attach the first signature to the data; calculate, after transferring the data to the different circuitry or the external IC, a second signature for the data; extract the first signature corresponding to the data; compare the first signature to the second signature; and generate a signal based on a comparison of the first signature to the second signature.
Abstract:
A semiconductor device comprises a plurality of memory elements, test control circuitry, and a testing interface. The test control circuitry is configure to determine that one or more clock signals associated with the memory elements have been stopped and generate a scan clock signal based on the determination that the one or more clock signals have been stopped. The test control circuitry is further configured to communicate the scan clock signal to the memory elements. The testing interface is configured to communicate test data from the memory elements. In one example, the test data is delimited with start and end marker elements. The semiconductor device is mounted to a circuit board and is communicatively coupled to communication pins of the circuit board.
Abstract:
Embodiments herein describe a hardware based scrubbing scheme where correction logic is integrated with memory elements such that scrubbing is performed by hardware. The correction logic reads the data words stored in the memory element during idle cycles. If a correctable error is detected, the correction logic can then use a subsequent idle cycle to perform a write to correct the error (i.e., replace the corrupted data stored in the memory element with corrected data). By using built-in or integrated correction logic, the embodiments herein do not add extra work for the processor, or can work with applications that do not include a processor. Further, because the correction logic scrubs the memory during idle cycles, correcting bit errors does not have a negative impact on the performance of the memory element. Memory scrubbing can delay the degradation of data error, extending the integrity of the data in the memory.