中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

15 records (took 0.011 seconds)

    REFLECTED SIGNAL ABSORPTION IN INTERCONNECT
    14.
    发明申请
    REFLECTED SIGNAL ABSORPTION IN INTERCONNECT 审中-公开

    公开(公告)号：US20160242273A1

    公开(公告)日：2016-08-18

    申请号：US15138880

    申请日：2016-04-26

    Applicant: Intel Corporation

    Inventor： Shaowu Huang ,  John J. Abbott

    IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K1/024 ,  H01R12/71 ,  H01R13/6598 ,  H05K1/0234 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/10621 ,  Y10T29/49156 ,  Y10T29/49167

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed.

    Reflected signal absorption in interconnect
    15.
    发明授权
    Reflected signal absorption in interconnect 有权
    互连中的反射信号吸收

    公开(公告)号：US09351394B2

    公开(公告)日：2016-05-24

    申请号：US14303396

    申请日：2014-06-12

    Applicant: INTEL CORPORATION

    Inventor： Shaowu Huang ,  John J. Abbott

    IPC: H05K1/11 ,  H05K1/02 ,  H01R12/71 ,  H01R13/6598

    CPC classification number: H05K1/024 ,  H01R12/71 ,  H01R13/6598 ,  H05K1/0234 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/10621 ,  Y10T29/49156 ,  Y10T29/49167

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及用于互连短截线中的电信号吸收的技术和配置。 在一种情况下，印刷电路板（PCB）组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连（例如通孔）。 互连可以包括形成在互连上的短截线。 短截线的至少一部分可以用吸收材料覆盖以至少部分地吸收被短截线反射的电信号的一部分。 对于电信号的反射部分的频率的频率范围，可以选择吸收材料使得其介电损耗角正切大于1。 吸收材料的介电常数可以与反射电信号的频率成反比。 可以描述和/或要求保护其他实施例。

Patent Agency Ranking