公开(公告)号：US2898518A

公开(公告)日：1959-08-04

申请号：US54090255

申请日：1955-10-17

Applicant: PHILCO CORP

Inventor： LYNN RAOUL B

IPC: H01R12/70 ,  H05K3/30

CPC classification number: H01R12/7076 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2203/1446

公开(公告)号：US2754486A

公开(公告)日：1956-07-10

申请号：US38723753

申请日：1953-10-20

Applicant: STACKPOLE CARBON CO

Inventor： HATHORN CLARENCE J

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y10T29/49142

公开(公告)号：US2470618A

公开(公告)日：1949-05-17

申请号：US65730346

申请日：1946-03-26

Applicant: HOLDEN LAWRENCE T

Inventor： HOLDEN LAWRENCE T

IPC: H01R12/18 ,  H01R35/02 ,  H05K1/14

CPC classification number: H01R35/02 ,  H05K1/148 ,  H05K2201/097 ,  H05K2201/1028 ,  H05K2201/10401 ,  H05K2201/10757 ,  H05K2203/1572 ,  Y10T24/45885 ,  Y10T24/45958 ,  Y10T403/60

公开(公告)号：US11927431B1

公开(公告)日：2024-03-12

申请号：US16602843

申请日：2019-12-10

Applicant: Northrop Grumman Systems Corporation

Inventor： James D. Lucas ,  Eric M. McDonough

IPC: F42B3/12 ,  F42C11/04 ,  F42D1/05 ,  H01L23/498 ,  H05K1/18

CPC classification number: F42B3/124 ,  F42C11/04 ,  F42D1/05 ,  H01L23/49811 ,  H05K1/181 ,  F42B3/121 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: A capacitive discharge unit (CDU) for detonating an explosive in response to a control signal comprises a set of CDU components, including an exploding foil initiator (EFI), a trigger circuit, a firing capacitor, and an insulated-gate bipolar transistor (IGBT) firing switch. In various embodiments the components are arranged on a board for mechanically and electrically supporting the components in an ordered arrangement along a CDU axis where the CDU having an axial length defined by the ordered arrangement of two or more of the EFI, the firing capacitor, and the IBGT firing switch, wherein the trigger circuit is offset from the CDU axis such that the trigger circuit does not contribute to the axial length.

公开(公告)号：US10083790B1

公开(公告)日：2018-09-25

申请号：US15832861

申请日：2017-12-06

Applicant: Universal Lighting Technologies, Inc.

Inventor： Donald Folker

IPC: H01F27/29 ,  H05K1/18 ,  H05K1/11 ,  H01F27/24 ,  H01F27/32 ,  H05K3/00 ,  H05K3/30 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F5/02 ,  H01F5/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/325 ,  H01F2005/043 ,  H01F2005/046 ,  H01F2027/297 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/1003 ,  H05K2201/10568 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: A bobbin provides secure attachment of a magnetic component to a printed circuit board. The circuit board includes a set of slotted apertures and a set of tubular apertures. The bobbin includes at least two pin rails and a plurality of standoffs proximate each pin rail. L-shaped pins are attached to one of the pin rails. Straight pins are attached to the other pin rail. The component further includes a core, and at least one winding. The L-shaped pins are shaped to pass through and slide within the set of slotted apertures. The L-shaped pins engage the bottom surface of the circuit board when the straight pins are inserted through the set of tubular apertures (i.e., in a secured position). In the secured position, the magnetic component is held in place against the top surface of the circuit board and provides a soldering area for mounting on the bottom surface.

公开(公告)号：US20180235088A1

公开(公告)日：2018-08-16

申请号：US15953823

申请日：2018-04-16

Applicant: Guangdong Oppo Mobile Telecommunications Corp., Ltd.

Inventor： Wenzhen Zhang

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H04M1/02 ,  H05K5/03 ,  H05K3/30 ,  H05K1/11 ,  G06F1/16 ,  G06K9/00

CPC classification number: H05K1/189 ,  G06F1/1684 ,  G06F2203/0338 ,  G06K9/00 ,  G06K9/00006 ,  H04M1/026 ,  H04M2250/12 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K3/363 ,  H05K5/03 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10757

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. The cover plate defines an assembling region. The fingerprint chip is fixed in the assembling region and has a plurality of pads. The intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate. The fingerprint chip is electrically connected to the intermediate board via the pads. The circuit board is electrically connected to the fingerprint chip via the intermediate board. The pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip.

公开(公告)号：US20180063959A1

公开(公告)日：2018-03-01

申请号：US15378385

申请日：2016-12-14

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： MING-GOO CHIEN ,  SHIH-SHAN LIU

IPC: H05K1/18 ,  H01G2/10 ,  G02F1/01

CPC classification number: H05K1/181 ,  G02F1/0147 ,  H01G2/06 ,  H01G2/10 ,  H01G2/103 ,  H01G2/106 ,  H01G9/08 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757

Abstract: The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a thermochromic layer for showing a color that is changeable according to temperature variation.

公开(公告)号：US20180054896A1

公开(公告)日：2018-02-22

申请号：US15677415

申请日：2017-08-15

Applicant: Guangdong Oppo Mobile Telecommunications Corp., LTD.

Inventor： Wenzhen Zhang

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H05K3/36 ,  H05K5/03

CPC classification number: H05K1/189 ,  G06F1/1684 ,  G06F2203/0338 ,  G06K9/00006 ,  G06K9/00053 ,  H04M1/026 ,  H04M2250/12 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K3/363 ,  H05K5/03 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10757

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.

公开(公告)号：US09888558B2

公开(公告)日：2018-02-06

申请号：US13152419

申请日：2011-06-03

Applicant: Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H05K1/03 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

公开(公告)号：US20170352495A1

公开(公告)日：2017-12-07

申请号：US15541779

申请日：2015-12-21

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Shinichiro Sato

IPC: H01G11/10 ,  H01G11/76 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01G11/10 ,  H01G2/04 ,  H01G9/08 ,  H01G9/28 ,  H01G11/08 ,  H01G11/74 ,  H01G11/76 ,  H01G11/78 ,  H01G11/82 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K5/0026 ,  H05K5/0056 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10757

Abstract: A capacitor module has a module case including a lower case and an upper case. A housing case is fixed to an inner face of the upper case, and a capacitor is housed in the housing case. A circuit board is fixed to an upper face of the lower case. The circuit board has wiring that is electrically connectable to the capacitor, and electronic components and constituting a circuit that controls electric current to the capacitor are mounted on the circuit board.