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    Circuit structure
    22.
    发明授权
    Circuit structure 有权
    电路结构

    公开(公告)号：US08288662B2

    公开(公告)日：2012-10-16

    申请号：US12718194

    申请日：2010-03-05

    Applicant: Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: H05K1/11

    CPC classification number: H05K3/184 ,  H05K3/0032 ,  H05K3/387 ,  H05K3/421 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2203/107 ,  H05K2203/1173

    Abstract: A circuit structure including a circuit board, an insulating layer, a conductive via, a platable dielectric layer and a conductive pattern is provided. The insulating layer is disposed on the circuit board and covers a circuit layer of the circuit board. The conductive via passes through the insulating layer and connects the circuit layer and protrudes from a surface of the insulating layer. The platable dielectric layer having a trench pattern is disposed on the surface of the insulating layer wherein the portion of the conductive via protruding from the surface is located in the trench pattern. The material of the platable dielectric layer includes a chemical platable material. The conductive pattern is in the trench pattern and connects the conductive via wherein an interface exists between the conductive pattern and the conductive via and protrudes from the surface of the insulating layer.

    Abstract translation: 提供了包括电路板，绝缘层，导电通孔，可镀介电层和导电图案的电路结构。 绝缘层设置在电路板上并覆盖电路板的电路层。 导电通孔穿过绝缘层并连接电路层并从绝缘层的表面突出。 具有沟槽图案的可镀介电层设置在绝缘层的表面上，其中从表面突出的导电通孔的部分位于沟槽图案中。 可镀介电层的材料包括化学镀层材料。 导电图案处于沟槽图案中并且连接导电通孔，其中在导电图案和导电通孔之间存在界面，并从绝缘层的表面突出。

    Circuit substrate and manufacturing method thereof
    23.
    发明授权
    Circuit substrate and manufacturing method thereof 有权
    电路基板及其制造方法

    公开(公告)号：US08247705B2

    公开(公告)日：2012-08-21

    申请号：US12718226

    申请日：2010-03-05

    Applicant: Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: H05K1/11

    CPC classification number: H05K3/387 ,  C23C18/1653 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24322

    Abstract: A manufacturing method of a circuit substrate includes the following steps. A dielectric layer is formed on at least one surface of a substrate. An insulating layer is formed on the dielectric layer. A portion of the insulating layer and a portion of the dielectric layer are removed, so as to form at least one blind via in the dielectric layer and the insulating layer. An electroless plating layer is formed on the sidewall of the blind via and a remaining portion of the insulating layer, wherein the binding strength between the insulating layer and the electroless plating layer is greater than that between the dielectric layer and the electroless plating layer. A patterned conductive layer is plated to cover the electroless plating layer.

    Abstract translation: 电路基板的制造方法包括以下步骤。 在基板的至少一个表面上形成介电层。 在电介质层上形成绝缘层。 去除绝缘层的一部分和电介质层的一部分，以在电介质层和绝缘层中形成至少一个盲孔。 在盲通孔的侧壁和绝缘层的剩余部分上形成化学镀层，其中绝缘层和化学镀层之间的结合强度大于介电层和化学镀层之间的结合强度。 电镀图案化导电层以覆盖化学镀层。

    CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
    24.
    发明申请
    CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    电路基板及其制造方法

    公开(公告)号：US20110155427A1

    公开(公告)日：2011-06-30

    申请号：US12718226

    申请日：2010-03-05

    Applicant: Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: H05K1/09 ,  B05D5/12 ,  H05K1/11 ,  H05K1/02

    CPC classification number: H05K3/387 ,  C23C18/1653 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24322

    Abstract: A manufacturing method of a circuit substrate includes the following steps. A dielectric layer is formed on at least one surface of a substrate. An insulating layer is formed on the dielectric layer. A portion of the insulating layer and a portion of the dielectric layer are removed, so as to form at least one blind via in the dielectric layer and the insulating layer. An electroless plating layer is formed on the sidewall of the blind via and a remaining portion of the insulating layer, wherein the binding strength between the insulating layer and the electroless plating layer is greater than that between the dielectric layer and the electroless plating layer. A patterned conductive layer is plated to cover the electroless plating layer.

    Abstract translation: 电路基板的制造方法包括以下步骤。 在基板的至少一个表面上形成介电层。 在电介质层上形成绝缘层。 去除绝缘层的一部分和电介质层的一部分，以在电介质层和绝缘层中形成至少一个盲孔。 在盲通孔的侧壁和绝缘层的剩余部分上形成化学镀层，其中绝缘层和化学镀层之间的结合强度大于介电层和化学镀层之间的结合强度。 电镀图案化导电层以覆盖化学镀层。

    CIRCUIT STRUCTURE
    25.
    发明申请
    CIRCUIT STRUCTURE 有权
    电路结构

    公开(公告)号：US20110094779A1

    公开(公告)日：2011-04-28

    申请号：US12718194

    申请日：2010-03-05

    Applicant: Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/184 ,  H05K3/0032 ,  H05K3/387 ,  H05K3/421 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2203/107 ,  H05K2203/1173

    Abstract: A circuit structure including a circuit board, an insulating layer, a conductive via, a platable dielectric layer and a conductive pattern is provided. The insulating layer is disposed on the circuit board and covers a circuit layer of the circuit board. The conductive via passes through the insulating layer and connects the circuit layer and protrudes from a surface of the insulating layer. The platable dielectric layer having a trench pattern is disposed on the surface of the insulating layer wherein the portion of the conductive via protruding from the surface is located in the trench pattern. The material of the platable dielectric layer includes a chemical platable material. The conductive pattern is in the trench pattern and connects the conductive via wherein an interface exists between the conductive pattern and the conductive via and protrudes from the surface of the insulating layer.

    Abstract translation: 提供了包括电路板，绝缘层，导电通孔，可镀介电层和导电图案的电路结构。 绝缘层设置在电路板上并覆盖电路板的电路层。 导电通孔穿过绝缘层并连接电路层并从绝缘层的表面突出。 具有沟槽图案的可镀介电层设置在绝缘层的表面上，其中从表面突出的导电通孔的部分位于沟槽图案中。 可镀介电层的材料包括化学镀层材料。 导电图案处于沟槽图案中并且连接导电通孔，其中在导电图案和导电通孔之间存在界面，并从绝缘层的表面突出。

    CIRCUIT BOARD AND FABRICATION METHOD THEREOF
    26.
    发明申请
    CIRCUIT BOARD AND FABRICATION METHOD THEREOF 审中-公开
    电路板及其制造方法

    公开(公告)号：US20110094778A1

    公开(公告)日：2011-04-28

    申请号：US12606192

    申请日：2009-10-27

    Applicant: Cheng-Po Yu ,  Chi-Min Chang ,  Wei-Ming Cheng

    Inventor： Cheng-Po Yu ,  Chi-Min Chang ,  Wei-Ming Cheng

    IPC: H05K1/00 ,  B23K26/38

    CPC classification number: H05K3/185 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0236

    Abstract: A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.

    Abstract translation: 提供一种制造电路板的方法。 非导电材料层设置在芯基板上，其中非导电材料层包括电介质材料和催化颗粒。 然后在非导电材料层中用激光束形成凹陷的电路结构。 同时，凹陷电路结构中的催化颗粒借助于激光器被激活。 然后通过化学铜沉积方法在凹陷电路结构中形成掩埋导电结构。

    METHOD OF FABRICATING SUBSTRATE
    29.
    发明申请
    METHOD OF FABRICATING SUBSTRATE 有权
    制造基板的方法

    公开(公告)号：US20090197364A1

    公开(公告)日：2009-08-06

    申请号：US12422428

    申请日：2009-04-13

    Applicant: Tzyy-Jang Tseng ,  Chih-Ming Chang ,  Cheng-Po Yu ,  Chung W. Ho

    Inventor： Tzyy-Jang Tseng ,  Chih-Ming Chang ,  Cheng-Po Yu ,  Chung W. Ho

    IPC: H01L21/02 ,  H01L21/78

    CPC classification number: H01L23/142 ,  H01L21/6835 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/06 ,  H05K3/202 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A method of fabricating a substrate includes following steps. First, a metallic panel having a first surface and a second surface is provided. A first half-etching process is carried out to etch the first surface of the metallic panel to a first depth so that a first patterned metallic layer is formed on the first surface. Next, a first insulating material is deposited into gaps in the first patterned metallic layer to form a first insulator. Thereafter, a second half-etching process is carried out to etch the second surface of the metallic panel to a second depth and expose at least a portion of the first insulator so that a second patterned metallic layer is formed on the second surface. The first depth and the second depth together equal the thickness of the metallic panel.

    Abstract translation: 制造衬底的方法包括以下步骤。 首先，提供具有第一表面和第二表面的金属板。 执行第一半蚀刻工艺以将金属板的第一表面蚀刻到第一深度，使得在第一表面上形成第一图案化金属层。 接下来，将第一绝缘材料沉积在第一图案化金属层中的间隙中以形成第一绝缘体。 此后，执行第二半蚀刻工艺以将金属板的第二表面蚀刻到第二深度，并且暴露第一绝缘体的至少一部分，使得在第二表面上形成第二图案化金属层。 第一深度和第二深度一起等于金属面板的厚度。

    PROCESS OF FABRICATING CIRCUIT STRUCTURE
    30.
    发明申请
    PROCESS OF FABRICATING CIRCUIT STRUCTURE 有权
    制作电路结构的过程

    公开(公告)号：US20090104772A1

    公开(公告)日：2009-04-23

    申请号：US12345474

    申请日：2008-12-29

    Applicant: Cheng-Po Yu

    Inventor： Cheng-Po Yu

    IPC: H01L21/44 ,  H01L21/02

    CPC classification number: H05K1/116 ,  H01L21/6835 ,  H01L2221/68359 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4658 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124

    Abstract: A process for forming a circuit structure includes providing a first composite-layer structure at first. A second composite-layer structure is then provided. The first composite-layer structure, a second dielectric layer and the second composite-layer structure are pressed so that a second circuit pattern and an independent via pad are embedded in the second dielectric layer, and the second dielectric layer is connected to the first dielectric layer. A first carrier substrate and a second carrier substrate are removed to expose a first circuit pattern and the second circuit pattern. At least one first opening that passes through the second dielectric layer and exposes the independent via pad is formed, and the first opening is filled with a conductive material to form a second conductive via that connects the independent via pad and a second via pad.

    Abstract translation: 一种形成电路结构的工艺包括首先提供第一复合层结构。 然后提供第二复合层结构。 第一复合层结构，第二介电层和第二复合层结构被按压，使得第二电路图案和独立通孔焊盘嵌入第二电介质层中，并且第二电介质层连接到第一电介质层 层。 去除第一载体衬底和第二载体衬底以暴露第一电路图案和第二电路图案。 形成穿过第二电介质层并暴露独立通孔焊盘的至少一个第一开口，并且用导电材料填充第一开口以形成连接独立通孔焊盘和第二通孔焊盘的第二导电通孔。

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