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    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION
    22.
    发明申请
    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION 失效
    具有受控热膨胀的散热器的装置和系统

    公开(公告)号：US20050121775A1

    公开(公告)日：2005-06-09

    申请号：US10726558

    申请日：2003-12-04

    申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/42

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

    摘要翻译： 装置和系统包括具有可控制的热膨胀的散热器。 例如，整体散热器可以包括由具有第一热膨胀系数的高热导率材料形成的插入件和由具有第二热膨胀系数的刚性材料形成的环，其中第二热膨胀系数为 小于或明显小于第一热膨胀系数。 整体散热器可以任选地包括例如电镀，涂层或贴片，并且可以包括在例如半导体器件中。

    APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE
    24.
    发明申请
    APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE 有权
    使用铜离子在背面最小化热阻的装置

    公开(公告)号：US20080296754A1

    公开(公告)日：2008-12-04

    申请号：US12179225

    申请日：2008-07-24

    申请人： Fay Hua ,  Gregory M. Chrysler ,  James G. Maveety ,  K. V. Ravi

    发明人： Fay Hua ,  Gregory M. Chrysler ,  James G. Maveety ,  K. V. Ravi

    IPC分类号： H01L23/36 ,  H01L23/52 ,  H01L21/4763

    CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L2224/32245 ,  H01L2924/3011

    摘要： A method and apparatus to minimize thermal impedance using copper on the die or chip backside. Some embodiments use deposited copper having a thickness chosen to complement a given chip thickness, in order to reduce or minimize wafer warpage. In some embodiments, the wafer, having a plurality of chips (e.g., silicon), is thinned (e.g., by chemical-mechanical polishing) before deposition of the copper layer, to reduce the thermal resistance of the chip. Some embodiments further deposit copper in a pattern of bumps, raised areas, or pads, e.g., in a checkerboard pattern, to thicken and add copper while reducing or minimizing wafer warpage and chip stress.

    摘要翻译： 使用铜芯在芯片或芯片背面上最小化热阻抗的方法和装置。 一些实施例使用具有选择的厚度的沉积铜来补充给定的芯片厚度，以便减小或最小化晶片翘曲。 在一些实施例中，具有多个芯片（例如硅）的晶片在沉积铜层之前被薄化（例如通过化学机械抛光），以降低芯片的热阻。 一些实施例进一步将铜以凸起，凸起区域或焊盘（例如棋盘图案）的图案沉积，以增加和添加铜，同时减少或最小化晶片翘曲和芯片应力。

    DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HEAT SPREADER
    26.
    发明申请
    DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HEAT SPREADER 有权
    一体化热交换器中的包装温度补偿的装置和方法

    公开(公告)号：US20070020813A1

    公开(公告)日：2007-01-25

    申请号：US11470209

    申请日：2006-09-05

    申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/00

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

    摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

    摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）装配期间的物理操作（2）运行期间的热梯度和（3）不同的膨胀和收缩速率导致的变形 的包装材料在高温下与多个包装组装步骤相结合，使得一体式散热器的一个表面将具有平坦的形状。

    Device and system for heat spreader with controlled thermal expansion
    29.
    发明授权
    Device and system for heat spreader with controlled thermal expansion 失效
    具有受控热膨胀的散热器的装置和系统

    公开(公告)号：US07081669B2

    公开(公告)日：2006-07-25

    申请号：US10726558

    申请日：2003-12-04

    申请人： Thomas J. Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas J. Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

    摘要翻译： 装置和系统包括具有可控制的热膨胀的散热器。 例如，整体散热器可以包括由具有第一热膨胀系数的高导热材料形成的插入件和由具有第二热膨胀系数的刚性材料形成的环，其中第二热膨胀系数为 小于或明显小于第一热膨胀系数。 整体散热器可以任选地包括例如电镀，涂层或贴片，并且可以包括在例如半导体器件中。