公开(公告)号：US09054079B2

公开(公告)日：2015-06-09

申请号：US14025581

申请日：2013-09-12

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: G02C7/04 ,  H01L23/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: G02C11/10 ,  A61B5/6821 ,  A61B2562/12 ,  B29D11/00048 ,  B29D11/00807 ,  G02C7/04 ,  G02C7/049 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/08225 ,  H01L2224/11312 ,  H01L2224/13109 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8012 ,  H01L2224/8085 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2924/20646 ,  H01L2924/20647 ,  H01L2924/20648 ,  H01L2924/20649 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2224/83104 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00013 ,  H01L2924/20105 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

Abstract translation: 集成有薄硅芯片的隐形眼镜与隐形眼镜中的硅芯片的组装方法一起提供。 一方面，一种方法包括在透镜基板上形成多个透镜接触焊盘并在芯片上产生多个芯片接触焊盘。 该方法还包括将组装接合材料施加到多个透镜接触焊盘或芯片接触焊盘中的每一个上，将多个透镜接触焊盘与多个芯片接触焊盘对准，通过组装接合材料将芯片粘合到透镜基板 使用倒装芯片接合，并且与透镜基板形成隐形眼镜。

公开(公告)号：US09009958B2

公开(公告)日：2015-04-21

申请号：US14034303

申请日：2013-09-23

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: H05K3/30 ,  A61B5/145 ,  G01N27/327 ,  C12Q1/00 ,  G02B1/04 ,  G02C7/04 ,  A61B5/1473 ,  A61B5/00 ,  H05K3/32 ,  H05K1/18 ,  A61B5/1477

CPC classification number: A61B5/14546 ,  A61B3/101 ,  A61B5/0002 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/1477 ,  A61B5/6813 ,  A61B5/6821 ,  A61B2560/0214 ,  A61B2562/12 ,  B29D11/00817 ,  C12Q1/006 ,  G01N27/3272 ,  G02B1/043 ,  G02C7/04 ,  G02C7/049 ,  G02C7/083 ,  H01L2224/04105 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/32 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1469 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.

Abstract translation: 可安装的装置包括嵌入在聚合物中的生物相容结构，其限定至少一个安装表面。 生物相容性结构包括具有电触点，传感器电极和传感器电极与电触点之间的电互连的电子部件。 生物相容结构被制造成除了传感器电极之外，其被生物相容的材料完全包封。 在制造中，电子部件被定位在生物相容材料的第一层上，并且生物相容性材料的第二层形成在第一层生物相容材料和电子部件上。 通过去除第二层的一部分来暴露电触点，形成导电图案以限定传感器电极和电互连，并且在导电图案上形成第三层生物相容性材料。 通过去除第三层的一部分来暴露传感器电极。

公开(公告)号：US20150065820A1

公开(公告)日：2015-03-05

申请号：US14011478

申请日：2013-08-27

Applicant: Google Inc.

Inventor： Harvey Ho ,  James Etzkorn ,  Huanfen Yao

IPC: A61B5/145

CPC classification number: A61B5/14503 ,  A61B5/002 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/6821 ,  A61B2560/0214 ,  A61B2562/125 ,  G02C7/04

Abstract: A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.

Abstract translation: 一种方法可以包括：在工作衬底上形成牺牲层; 在所述牺牲层上形成第一生物相容层，使得所述第一生物相容层附着于所述牺牲层; 在所述第一生物相容层上形成导电图案; 将电子部件安装到所述导电图案上; 在所述第一生物相容层，所述电子部件和所述导电图案上形成第二生物相容层; 以及去除所述牺牲层以从所述工作衬底释放所述生物相容性装置。 第一生物相容层限定生物相容装置的第一侧。 第二生物相容层限定生物相容装置的第二侧。

公开(公告)号：US20140296674A1

公开(公告)日：2014-10-02

申请号：US14034303

申请日：2013-09-23

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: A61B5/145 ,  A61B5/00 ,  H05K3/32 ,  A61B5/1473

CPC classification number: A61B5/14546 ,  A61B3/101 ,  A61B5/0002 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/1477 ,  A61B5/6813 ,  A61B5/6821 ,  A61B2560/0214 ,  A61B2562/12 ,  B29D11/00817 ,  C12Q1/006 ,  G01N27/3272 ,  G02B1/043 ,  G02C7/04 ,  G02C7/049 ,  G02C7/083 ,  H01L2224/04105 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/32 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1469 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49163

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.

公开(公告)号：US20140296673A1

公开(公告)日：2014-10-02

申请号：US14032428

申请日：2013-09-20

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: A61B5/145 ,  A61B5/00 ,  H05K3/32 ,  A61B5/1473

CPC classification number: A61B5/14546 ,  A61B3/10 ,  A61B3/101 ,  A61B5/0002 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/1477 ,  A61B5/6813 ,  A61B5/6821 ,  A61B2560/0214 ,  A61B2562/12 ,  G02C7/04 ,  H05K1/186 ,  H05K3/048 ,  H05K3/4682 ,  Y10T29/49002 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.

公开(公告)号：US20140296672A1

公开(公告)日：2014-10-02

申请号：US13850753

申请日：2013-03-26

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: A61B3/10 ,  H05K3/32

CPC classification number: A61B5/14546 ,  A61B3/10 ,  A61B3/101 ,  A61B5/0002 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/1477 ,  A61B5/6813 ,  A61B5/6821 ,  A61B2560/0214 ,  A61B2562/12 ,  G02C7/04 ,  H05K1/186 ,  H05K3/048 ,  H05K3/4682 ,  Y10T29/49002 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.

Abstract translation: 可安装的装置包括嵌入在聚合物中的生物相容结构，其限定至少一个安装表面。 生物相容结构具有由第一生物相容材料层限定的第一侧，由第二生物相容材料层限定的第二侧，电子部件和限定传感器电极的导电图案。 第二层生物相容性材料的一部分通过蚀刻去除，以在传感器电极暴露的第二侧产生至少一个开口。 蚀刻进一步去除生物相容性材料的第一层的一部分，以便在第一侧中形成连接到第二侧中的至少开口的至少一个开口。 通过这种开口布置，分析物可以从生物相容结构的第一侧或第二侧到达传感器电极。

公开(公告)号：US20140085601A1

公开(公告)日：2014-03-27

申请号：US13626589

申请日：2012-09-25

Applicant: GOOGLE INC.

Inventor： James Etzkorn

IPC: G02C7/04 ,  H01L21/50 ,  H01L21/56

CPC classification number: G02C7/04 ,  H01L21/563 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Contact lenses and methods of manufacture are provided. In one aspect, a method includes: positioning components in predefined locations on a first surface; applying pressure on the components employing a second surface; providing molten material between the first surface and the second surface and around the components; embedding the components in a substrate by cooling the molten material and causing the molten material to harden, the substrate being a substantially solid form of molten material; and removing the first surface and the second surface after embedding the components in the substrate. The method can also include: providing, on or within a contact lens, one of the components and the substrate into which the component is embedded. The first surface can include molds sized to receive and maintain the components at the predefined locations. The first surface and/or the second surface can be pre-treated with a non-stick coating such as Polytetrafluoroethylene.

Abstract translation: 提供隐形眼镜和制造方法。 一方面，一种方法包括：将组件定位在第一表面上的预定位置中; 对采用第二表面的部件施加压力; 在所述第一表面和所述第二表面之间以及所述部件周围提供熔融材料; 通过冷却熔融材料并使熔融材料硬化来将组分嵌入衬底中，衬底是基本上固体形式的熔融材料; 以及在将所述部件嵌入所述基板之后移除所述第一表面和所述第二表面。 该方法还可以包括：在隐形眼镜上或内部提供组件嵌入其中的组件和衬底之一。 第一表面可以包括尺寸适于在预定位置处接收和维持部件的模具。 第一表面和/或第二表面可以用不粘涂层例如聚四氟乙烯进行预处理。

公开(公告)号：US20140085599A1

公开(公告)日：2014-03-27

申请号：US14025581

申请日：2013-09-12

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: G02C7/04 ,  H01L23/00

CPC classification number: G02C11/10 ,  A61B5/6821 ,  A61B2562/12 ,  B29D11/00048 ,  B29D11/00807 ,  G02C7/04 ,  G02C7/049 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/08225 ,  H01L2224/11312 ,  H01L2224/13109 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8012 ,  H01L2224/8085 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2924/20646 ,  H01L2924/20647 ,  H01L2924/20648 ,  H01L2924/20649 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2224/83104 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00013 ,  H01L2924/20105 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

Abstract translation: 集成有薄硅芯片的隐形眼镜与隐形眼镜中的硅芯片的组装方法一起提供。 一方面，一种方法包括在透镜基板上形成多个透镜接触焊盘并在芯片上产生多个芯片接触焊盘。 该方法还包括将组装接合材料施加到多个透镜接触焊盘或芯片接触焊盘中的每一个上，将多个透镜接触焊盘与多个芯片接触焊盘对准，通过组装接合材料将芯片粘合到透镜基板 使用倒装芯片接合，并且与透镜基板形成隐形眼镜。

公开(公告)号：US20140084489A1

公开(公告)日：2014-03-27

申请号：US13627574

申请日：2012-09-26

Applicant: Google Inc.

Inventor： James Etzkorn

IPC: H01L23/48 ,  H01L21/56

CPC classification number: G02C11/10 ,  A61B5/6821 ,  A61B2562/12 ,  B29D11/00048 ,  B29D11/00807 ,  G02C7/04 ,  G02C7/049 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/528 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/08225 ,  H01L2224/11312 ,  H01L2224/13109 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8012 ,  H01L2224/8085 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2924/20646 ,  H01L2924/20647 ,  H01L2924/20648 ,  H01L2924/20649 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2224/83104 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/00013 ,  H01L2924/20105 ,  H01L2924/00012 ,  H01L2924/0665

Abstract: A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

公开(公告)号：US09320460B2

公开(公告)日：2016-04-26

申请号：US14030756

申请日：2013-09-18

Applicant: Google Inc.

Inventor： Zenghe Liu ,  James Etzkorn

IPC: A61B5/00 ,  A61B5/05 ,  A61B5/145

CPC classification number: A61B5/14507 ,  A61B5/14532 ,  A61B5/6821

Abstract: Apparatus, systems and methods employing contact lenses having one or more sensor that sense an analyte in tear fluid and one or more recesses that collect the tear fluid. In some aspects, a contact lens includes a substrate that forms at least part of a body of the contact lens and a recess formed within the substrate configured to collect tear fluid when the contact lens is worn. The contact lens further includes at least one sensor disposed within the substrate configured to sense presence of an analyte in the collected tear fluid.

Abstract translation: 使用具有感测泪液中的分析物的一个或多个传感器的隐形眼镜的装置，系统和方法以及收集泪液的一个或多个凹部。 在一些方面，隐形眼镜包括形成隐形眼镜的主体的至少一部分的基底和形成在基底内的凹陷，构造成当佩戴隐形眼镜时收集泪液。 隐形眼镜还包括布置在基底内的至少一个传感器，其配置成感测所收集的泪液中分析物的存在。