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21.发明申请公开(公告)号：US20140133111A1
公开(公告)日：2014-05-15
申请号：US14077563
申请日：2013-11-12
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Michimasa TAKAHASHI
CPC classification number: H05K3/00 , H05K3/0097 , H05K2201/096 , H05K2201/10545 , H05K2203/0169 , H05K2203/167 , Y10T29/49124
Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.
Abstract translation: 一种组合布线板的制造方法，其特征在于，具备：具有容纳开口部的金属框架，将金属框架的容纳开口部配置布线基板，使金属框架发生塑性变形，使布线基板的侧壁成为 连接到金属框架的侧壁在金属框架的容纳开口部分内。
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公开(公告)号：US20140133110A1
公开(公告)日：2014-05-15
申请号：US14076586
申请日：2013-11-11
Applicant: IBIDEN CO., LTD.
Inventor： Michimasa TAKAHASHI , Teruyuki ISHIHARA
IPC: H05K1/02
CPC classification number: H05K1/0271 , H05K1/14 , H05K1/183 , H05K3/0097 , H05K2201/068 , H05K2201/09145 , H05K2201/209 , H05K2203/0169
Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.
Abstract translation: 组合电路板具有多个片状部件，每个部件包括布线板和具有容纳开口部分的框架部件，并且将多个部件保持在容纳开口部分中，使得每个零件部件在外部固定到框架部件 每个零件的边缘。 框架部件在平面方向上具有比多个部件在平面方向上的热膨胀系数高的热膨胀系数。
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公开(公告)号：US20190327830A1
公开(公告)日：2019-10-24
申请号：US16502170
申请日：2019-07-03
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Hiroyuki BAN , Haiying MEI
IPC: H05K1/02 , H01L23/498 , H01L21/48 , H05K3/00 , H05K3/46
Abstract: A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate.
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公开(公告)号：US20180054888A1
公开(公告)日：2018-02-22
申请号：US15681948
申请日：2017-08-21
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Hiroyuki BAN , Haiying MEI
IPC: H05K1/02
CPC classification number: H05K1/0284 , H01L21/4853 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L2224/16225 , H01L2924/15174 , H05K1/0296 , H05K3/007 , H05K3/205 , H05K3/3436 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/10674
Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surface of the laminate respectively.
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公开(公告)号：US20170263571A1
公开(公告)日：2017-09-14
申请号：US15453964
申请日：2017-03-09
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Hiroyuki BAN , Kosuke IKEDA , Haiying MEI
IPC: H01L23/552 , H01L21/768 , H01L23/053 , H01L23/48
CPC classification number: H01L23/552 , H01L21/561 , H01L21/568 , H01L21/76895 , H01L21/76898 , H01L23/053 , H01L23/295 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/0655 , H01L2224/0401 , H01L2224/131 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/16237 , H01L2224/81005 , H01L2224/81815 , H01L2224/97 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2924/014 , H01L2924/00014
Abstract: An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in the through hole of the substrate and exposing a terminal of the electronic component on a first side of the substrate, and a shield layer structure including a first metal film and a second metal film formed such that the first metal film is formed on the inner wall of the substrate and surrounding the through hole of the substrate and that the second metal film is formed on a second side of the substrate on the opposite side with respect to the first side and covering an opening of the through hole on the second side of the substrate.
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Patent Agency Ranking
公开(公告)号：US20170245365A1
公开(公告)日：2017-08-24
申请号：US15441540
申请日：2017-02-24
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Hiroyuki BAN , Haiying MEI
CPC classification number: H05K1/115 , H01L23/49534 , H01L2224/16225 , H01L2924/181 , H05K1/112 , H05K1/113 , H05K3/0061 , H05K3/025 , H05K3/205 , H05K3/243 , H05K3/284 , H05K3/303 , H05K3/388 , H05K3/4007 , H05K3/4038 , H05K3/4682 , H05K2201/0367 , H05K2201/09527 , H05K2201/10674 , H01L2924/00012
Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.
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公开(公告)号：US20170196096A1
公开(公告)日：2017-07-06
申请号：US15398935
申请日：2017-01-05
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Ayumi SHIBATA , Kosuke IKEDA
CPC classification number: H05K3/4682 , H05K1/113 , H05K1/115 , H05K1/116 , H05K1/181 , H05K3/0035 , H05K3/0097 , H05K3/061 , H05K3/4007 , H05K3/4038 , H05K3/4647 , H05K2201/04 , H05K2201/09863 , H05K2203/1536
Abstract: A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and including a via conductor portion and an embedded conductor layer portion such that the embedded conductor layer portion is embedded in the resin insulating layer on the opposite side of the resin insulating layer with respect to the projecting conductor layer and has an exposed surface exposed from the resin insulating layer and the via conductor portion is formed through the resin insulating layer and is connecting the embedded conductor layer portion and projecting conductor layer. The projecting conductor layer and integral conductor structure are formed such that the projecting conductor layer and integral conductor structure are individual conductor structures.
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公开(公告)号：US20170053878A1
公开(公告)日：2017-02-23
申请号：US15239865
申请日：2016-08-18
Applicant: IBIDEN CO., LTD.
Inventor： Kazuki KAJIHARA , Takema ADACHI , Teruyuki ISHIHARA , Kosuke IKEDA
IPC: H01L23/00 , H01L21/48 , H01L25/10 , H01L23/498 , H01L23/31
CPC classification number: H01L23/49822 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/3121 , H01L23/49827 , H01L23/5389 , H01L25/105 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/1058 , H01L2924/00014
Abstract: A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.
Abstract translation: 印刷电路板包括包含绝缘层和导体层的堆积层，形成在堆积层的表面上的焊盘，并且包括用于连接电子部件的第一焊盘和将外部布线板连接到建筑物的表面上的第二焊盘 上层，形成在堆积层的表面上的模制树脂层，使得模制层覆盖积层的表面并且具有暴露第一焊盘和暴露第二焊盘的开口的腔，以及导体 形成在开口中并包括电镀材料的柱，使得柱连接到第二垫。 柱的电镀材料包括无电解镀层和电解镀层，并且柱形成为使得每个柱具有相对于第二焊盘在相对侧的表面暴露于模具层的端面。
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公开(公告)号：US20150136454A1
公开(公告)日：2015-05-21
申请号：US14542753
申请日：2014-11-17
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Michimasa TAKAHASHI
CPC classification number: H05K1/142 , H05K1/0228 , H05K1/0271 , H05K1/144 , H05K3/0052 , H05K3/0097 , H05K3/368 , H05K2201/068 , H05K2201/2018 , H05K2201/2072 , H05K2203/0169 , Y10T29/49126
Abstract: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
Abstract translation: 组合布线板包括多个布线板，以及具有多个金属框架和一个或多个连接部分的连接的金属框架，使得金属框架通过连接部分或连接部分彼此连接，并具有容纳布线的容纳开口部分 板。
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30.发明申请公开(公告)号：US20140063770A1
公开(公告)日：2014-03-06
申请号：US14014654
申请日：2013-08-30
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki ISHIHARA , Michimasa Takahashi
CPC classification number: H05K1/142 , H05K3/0032 , H05K3/0097 , H05K3/225 , H05K3/36 , H05K2203/0169 , H05K2203/0554 , H05K2203/107 , H05K2203/1572 , Y10T29/49126
Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.
Abstract translation: 插入式电路板的更换方法包括：准备具有单板的板，在所述板的第一表面上形成第一导电图案，在相对侧的第二表面上形成第二导电图案，使得所述第二图案位于所述板的相对侧上 第一图案，沿着第一图案和第二图案在第一表面和第二表面上照射激光，使得该片从板上切出，并将该件装配到另一个板中。 所述照射包括沿着所述第一图案将激光照射在所述第一表面上，使得沿着所述第二图案沿着所述第一图案的边缘部分和所述第一表面之间的边界处的激光照射激光，并且沿着所述第二图案激光沿所述第二表面照射激光， 在所述第二图案的边缘部分和所述第二表面之间，使得所述片材通过所述板被切出。
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