公开(公告)号：US20180211992A1

公开(公告)日：2018-07-26

申请号：US15804823

申请日：2017-11-06

Applicant: International Business Machines Corporation

Inventor： Stephen W. Bedell ,  Ning Li ,  Frank R. Libsch ,  Devendra K. Sadana ,  Bing Dang

IPC: H01L27/15 ,  H01L33/48 ,  H01L33/00

CPC classification number: H01L27/156 ,  H01L24/95 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/62 ,  H01L2933/0066

Abstract: Magnetic regions of at least one of a chiplet or a receiving substrate are used to permit magnetically guided precision placement of a plurality of chiplets on the receiving substrate. In the present application, a solution containing dispersed chiplets is employed to facilitate the placement of the dispersed chiplets on bond pads that are present on a receiving substrate.

公开(公告)号：US10033081B2

公开(公告)日：2018-07-24

申请号：US15222169

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/02 ,  H01P3/12 ,  H01P3/08 ,  H01P5/08 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01P3/16 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01L23/538 ,  H01L23/00 ,  H05K1/02

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US10002856B1

公开(公告)日：2018-06-19

申请号：US15416439

申请日：2017-01-26

Applicant: International Business Machines Corporation

Inventor： Stephen W. Bedell ,  Bing Dang ,  Ning Li ,  Frank R. Libsch ,  Devendra K. Sadana

IPC: H01L21/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/00

Abstract: Methods of transferring micro-array LEDs of various colors onto a surface of a display substrate are provided. The transferring includes releasing micro-LEDs of a specific color from a structure that includes a releasable material onto a display substrate. The releasable material may be a laser ablatable material or a material that is readily dissolved in a specific etchant.

公开(公告)号：US20180133152A1

公开(公告)日：2018-05-17

申请号：US15852943

申请日：2017-12-22

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61K9/00 ,  A61N1/04 ,  A61M31/00

CPC classification number: A61K9/0097 ,  A61M31/002 ,  A61M2205/0244 ,  A61N1/0428 ,  A61N1/0444 ,  A61N1/0448

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US20180095125A1

公开(公告)日：2018-04-05

申请号：US15821403

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: G01R31/28 ,  G01R31/309 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K3/34 ,  H05K3/30 ,  H05K3/00

CPC classification number: G01R31/2818 ,  G01R31/309 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US09798886B2

公开(公告)日：2017-10-24

申请号：US14794399

申请日：2015-07-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Joana Sofia Branquinho Teresa Maria ,  Sufi Zafar

IPC: G06F21/00 ,  G06F21/60 ,  H04W12/02

CPC classification number: G06F21/606 ,  H04W4/38 ,  H04W4/80 ,  H04W12/02

Abstract: Methods, devices, systems, and computer program products for implementing a bio-medical sensing platform are provided herein. A method includes receiving one or more items of sensed biological data and/or sensor-related information from one or more sensor devices via a communication link established with the one or more sensor devices, wherein the one or more sensor devices are associated with a given user; analyzing the one or more items of sensed biological data and/or sensor-related information to perform one or more characterization functions pertaining to the one or more items of biological data and/or the given user; and transferring the one or more items of sensed biological data and/or sensor-related information and/or a result of the one or more characterization functions to a private storage component via a communication link established with the private storage component, wherein said transferring comprises implementing one or more security functions in conjunction with said transferring.

公开(公告)号：US20170199222A1

公开(公告)日：2017-07-13

申请号：US15469501

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: G01R1/04 ,  H01L21/66 ,  H01L23/498 ,  G01R1/067

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US20170175280A1

公开(公告)日：2017-06-22

申请号：US15203869

申请日：2016-07-07

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yang Liu ,  Steven L. Wright

IPC: C25D1/22 ,  C23C14/34 ,  C23C14/14 ,  B23K1/00 ,  A61B5/042 ,  A61B5/0478 ,  A61B5/00 ,  C25D1/00 ,  B05D1/00

CPC classification number: A61B5/0478 ,  A61B5/0022 ,  A61B5/0408 ,  A61B5/6833 ,  A61B5/6839 ,  A61B2562/0215 ,  A61B2562/028 ,  A61B2562/125 ,  A61N1/0492 ,  A61N1/0502 ,  C25D1/003 ,  G16H40/67

Abstract: An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

公开(公告)号：US09636782B2

公开(公告)日：2017-05-02

申请号：US14226966

申请日：2014-03-27

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/36 ,  G01R31/26 ,  H01L21/302 ,  H01L21/683

CPC classification number: B23K26/36 ,  G01R31/2607 ,  H01L21/302 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1158 ,  Y10T156/1917 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

公开(公告)号：US09606142B2

公开(公告)日：2017-03-28

申请号：US14495606

申请日：2014-09-24

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: H01L21/8242 ,  G01R1/04

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.