利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

143 条记录 (耗时 0.033 秒)

    Through Substrate Via Semiconductor Components
    21.
    发明申请
    Through Substrate Via Semiconductor Components 有权
    通过基板通过半导体元件

    公开(公告)号：US20090134497A1

    公开(公告)日：2009-05-28

    申请号：US11944846

    申请日：2007-11-26

    申请人： Hans-Joachim Barth ,  Jens Pohl

    发明人： Hans-Joachim Barth ,  Jens Pohl

    IPC分类号： H01L29/417 ,  H01L21/441

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2224/05552

    摘要： A structure and method of forming landing pads for through substrate vias in forming stacked semiconductor components are described. In various embodiments, the current invention describes landing pad structures that includes multiple levels of conductive plates connected by vias such that the electrical connection between a through substrate etch and landing pad is independent of the location of the bottom of the through substrate trench.

    摘要翻译： 描述了在形成堆叠的半导体部件中形成通过衬底通孔的着陆焊盘的结构和方法。 在各种实施例中，本发明描述着陆焊盘结构，其包括通过通孔连接的多层导电板，使得贯穿衬底蚀刻和着陆焊盘之间的电连接独立于贯穿衬底沟槽的底部的位置。

    Encasing arrangement for a semiconductor component
    28.
    发明授权
    Encasing arrangement for a semiconductor component 有权
    半导体元件的封装结构

    公开(公告)号：US07208827B2

    公开(公告)日：2007-04-24

    申请号：US10149892

    申请日：2000-12-13

    申请人： Christian Hauser ,  Simon Muff ,  Jens Pohl ,  Friedrich Wanninger

    发明人： Christian Hauser ,  Simon Muff ,  Jens Pohl ,  Friedrich Wanninger

    IPC分类号： H01L23/22 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L24/32 ,  H01L23/3107 ,  H01L23/3677 ,  H01L2224/27013 ,  H01L2224/83051 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025

    摘要： A semiconductor component package configuration includes a semiconductor chip mounted to a printed circuit board, and a substrate arranged between the semiconductor chip and the printed circuit board. The substrate is for routing the wiring terminals of the semiconductor chip to the printed circuit board. The substrate is connected to the printed circuit board by solder joints. A filler between the semiconductor chip and the substrate mechanically isolates the semiconductor chip and the solder joints. A metal layer, which is connected to solder joints, is applied to the substrate. At least one molded element of heat-dissipating material is applied to the metal layer and is connected in a heat-conducting manner to the metal layer. This provides the package configuration with an improved capability of conducting the lost power that is dissipated from the installed semiconductor chip, and the desired mechanical properties of the package arrangement are retained.

    摘要翻译： 半导体部件封装构造包括安装到印刷电路板的半导体芯片和布置在半导体芯片和印刷电路板之间的基板。 基板用于将半导体芯片的布线端子布线到印刷电路板。 基板通过焊点连接到印刷电路板。 半导体芯片和基板之间的填充物机械地隔离半导体芯片和焊点。 将连接到焊接点的金属层施加到基板。 将至少一个散热材料的模制元件施加到金属层，并以导热方式连接到金属层。 这提供了封装配置，其具有改进的能够从所安装的半导体芯片散发的损失功率的能力，并且保持了封装布置的期望的机械特性。

    Package for an electronic component and method for its production
    29.
    发明申请
    Package for an electronic component and method for its production 有权
    电子元件封装及其生产方法

    公开(公告)号：US20060273443A1

    公开(公告)日：2006-12-07

    申请号：US11444530

    申请日：2006-06-01

    申请人： Michael Bauer ,  Jens Pohl

    发明人： Michael Bauer ,  Jens Pohl

    IPC分类号： H01L23/24

    CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

    摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

    摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。