-
21.发明授权公开(公告)号：US08994259B2
公开(公告)日：2015-03-31
申请号：US13852332
申请日：2013-03-28
Applicant: Nichia Corporation
Inventor： Hiroto Tamaki , Takayoshi Wakaki , Tadao Hayashi , Yoshiki Sato , Daisuke Oyamatsu , Takafumi Sugiyama , Takao Kosugi
CPC classification number: F21V9/30 , B05D5/06 , C23C16/45525 , F21K9/60 , F21V7/00 , F21V13/08 , F21Y2115/10 , F21Y2115/30 , H01L31/055 , H01L33/502 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H05B33/12 , Y02E10/52 , Y10T428/24364 , Y10T428/24372 , Y10T428/24413 , Y10T428/24421 , H01L2924/00014
Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.
Abstract translation: 波长转换无机部件可以在基体上包括基体和无机粒子层。 无机粒子层可以包括被配置为吸收第一波长的光并发射与第一波长不同的第二波长的光的无机波长转换物质的粒子。 无机颗粒层可以包括多个颗粒的附聚物。 多个颗粒中的每一个与至少一个其它颗粒或基体接触。 覆盖层包括无机材料，并且覆盖层连续地覆盖基体的表面和颗粒的表面。 无机颗粒层具有由颗粒包围的空隙，或由颗粒和基体和覆盖层之一组成的间隙。
-
公开(公告)号：US08975100B2
公开(公告)日：2015-03-10
申请号：US14059243
申请日：2013-10-21
Applicant: Nichia Corporation
Inventor： Masato Fujitomo , Hiroto Tamaki , Shinji Nishijima , Yuichiro Tanda , Tomohide Miki
IPC: H01L21/00 , H01L33/48 , H01L23/00 , H01L31/0203 , H01L25/16
CPC classification number: H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
-
公开(公告)号：US10600942B2
公开(公告)日：2020-03-24
申请号：US16218292
申请日：2018-12-12
Applicant: NICHIA CORPORATION
Inventor： Suguru Beppu , Yoichi Bando , Hiroto Tamaki , Takuya Nakabayashi
IPC: H01L33/60 , H01L33/50 , H01L21/3213
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
-
公开(公告)号：US10347797B2
公开(公告)日：2019-07-09
申请号：US15805402
申请日：2017-11-07
Applicant: NICHIA CORPORATION
Inventor： Yuta Oka , Hiroto Tamaki
Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.
-
公开(公告)号：US10069054B2
公开(公告)日：2018-09-04
申请号：US15591112
申请日：2017-05-10
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Hiroto Tamaki
IPC: H01L33/62 , H01L33/64 , H01L33/60 , H01L33/28 , H01L33/32 , H01L33/30 , H01L33/56 , H01L33/50 , H05K1/03 , H05K1/11 , H05K1/09 , H05K1/02 , H05K1/18
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer, an internal conductive layer, a lower conductive layer, vias, and a covering layer. The upper conductive layer is disposed on an upper surface of the uppermost ceramic layer. The internal conductive layer is interposed between the ceramic layers. The lower conductive layer is disposed on a lower surface of the lowermost ceramic layer. The vias connect the upper conductive layer, the internal conductive layer, and the lower connective layer. The covering layer covers a portion of the upper conductive layer. The upper conductive layer includes a covered region covered with the covering layer and an element mount region. An upper surface of the element mount region is higher than an upper surface of the covered portion.
-
Patent Agency Ranking
公开(公告)号：US10069045B2
公开(公告)日：2018-09-04
申请号：US15483269
申请日：2017-04-10
Applicant: NICHIA CORPORATION
Inventor： Takeshi Ikegami , Tadao Hayashi , Hiroto Tamaki
Abstract: A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.
-
公开(公告)号：US09728689B2
公开(公告)日：2017-08-08
申请号：US15241076
申请日：2016-08-19
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki
CPC classification number: H01L33/56 , H01L33/48 , H01L33/502 , H01L33/507 , H01L33/62 , H01L2224/16245 , H01L2224/97 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A method of manufacturing a light emitting device includes: providing on a mounting substrate a soluble member which is soluble in a solvent and which has a lower surface, an upper surface opposite to the lower surface in a height direction, and an outer side surface provided between the lower surface and the upper surface, the lower surface contacting the mounting substrate; providing a light blocking member made of resin to cover the outer side surface of the soluble member so that an inner side wall of the light blocking member contacts the outer side surface of the soluble member; removing the soluble member using the solvent to provide a recess surrounded by the inner side wall of the light blocking member; and mounting a light emitting element in the recess.
-
公开(公告)号：US09680078B2
公开(公告)日：2017-06-13
申请号：US14950136
申请日：2015-11-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Hiroto Tamaki
IPC: H01L33/60 , H01L33/62 , H05K1/18 , H01L33/48 , H05K1/03 , H05K1/09 , H05K1/02 , H05K3/28 , H05K1/11 , H01L25/16
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.
-
公开(公告)号：US09660151B2
公开(公告)日：2017-05-23
申请号：US14716627
申请日：2015-05-19
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki
CPC classification number: H01L33/504 , H01L33/502 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73253 , H01L2924/16195 , H01L2933/0041 , H01L2924/00014
Abstract: A method for manufacturing a light emitting device has: forming a first phosphor layer including a first phosphor that is based on KSF or quantum dots on a light emitting element by a method other than spraying, and forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.
-
公开(公告)号：US09640734B2
公开(公告)日：2017-05-02
申请号：US14568256
申请日：2014-12-12
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Takeshi Ikegami , Tadaaki Ikeda , Tadao Hayashi , Hiroto Tamaki
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/387 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.
-
-
-
-
-
-
-
-
-
Search Results
50
records
(took 0.023 seconds)
