公开(公告)号：US20140349511A1

公开(公告)日：2014-11-27

申请号：US14283963

申请日：2014-05-21

Applicant: Dieter LUDWIG ,  Reiner HEROLD

Inventor： Dieter LUDWIG ,  Reiner HEROLD

IPC: H01R12/70 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/75 ,  H01R13/41 ,  H01R13/631 ,  H05K3/303 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A plug connector set-up for a control unit includes: a pin support having a pin; and a guide element having a lead-through for positioning the pin at a circuit board of the control unit. The lead-through has an entrance opening on the side facing the pin support and an outlet opening on the side facing away from the pin support. A diameter of the entrance opening is greater than a diameter of the outlet opening. The pin includes a centering region having a diameter which is less than the diameter of the entrance opening and greater than the diameter of the outlet opening.

Abstract translation: 用于控制单元的插头连接器装置包括：具有销的销支撑件; 以及具有用于将销定位在控制单元的电路板处的引导件的引导元件。 引导件在面向销支撑的一侧上具有入口开口，并且在远离销支撑件的一侧上具有出口开口。 入口的直径大于出口的直径。 该销包括具有小于入口开口直径的直径并大于出口开口直径的定心区域。

公开(公告)号：US20140254124A1

公开(公告)日：2014-09-11

申请号：US13790141

申请日：2013-03-08

Applicant: Milind Raje ,  Robert Bennett ,  Andrew Mudie ,  Gary Mark Ignacio

Inventor： Milind Raje ,  Robert Bennett ,  Andrew Mudie ,  Gary Mark Ignacio

IPC: H05K5/06 ,  B23K26/20 ,  H05K13/04

CPC classification number: H05K13/0465 ,  A61N1/36032 ,  A61N1/36036 ,  A61N1/3754 ,  B23K1/06 ,  B23K20/004 ,  B23K26/21 ,  H01L2224/78301 ,  H01L2924/0002 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0379 ,  H05K2201/0979 ,  H05K2201/10318 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/107 ,  H01L2924/0001

Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

Abstract translation: 这里呈现的是用于将细长导体（例如导线或针）电连接到接合焊盘的凸起焊接技术。 多个柱形凸起结合到接合焊盘的表面上，并且细长电导体位于多个柱形凸起附近。 细长导体结合到一个或多个螺柱凸块。

公开(公告)号：US20140251670A1

公开(公告)日：2014-09-11

申请号：US14200743

申请日：2014-03-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio SAKAI ,  Yoshihito OTSUBO

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/18 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/181 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4015 ,  H05K2201/10318 ,  Y10T29/4913

Abstract: A module includes a wiring board; a component mounted on the wiring board; a columnar conductor for external connection, the columnar conductor being connected at one end thereof to the wiring board; and a resin layer disposed on the wiring board and configured to cover the columnar conductor and the component, with an end face of the columnar conductor exposed from a surface of the resin layer, the end face being at the other end of the columnar conductor. A gap to be filled with solder is formed between the resin layer and a periphery of an end portion of the columnar conductor, the end portion being at the other end of the columnar conductor.

Abstract translation: 模块包括布线板; 安装在所述布线板上的部件; 用于外部连接的柱状导体，所述柱状导体的一端连接到所述布线板; 以及设置在所述布线板上并被构造成覆盖所述柱状导体和所述部件的树脂层，所述柱状导体的端面从所述树脂层的表面露出，所述端面位于所述柱状导体的另一端。 在树脂层和柱状导体的端部的周边之间形成填充有焊料的间隙，端部位于柱状导体的另一端。

公开(公告)号：US20130343023A1

公开(公告)日：2013-12-26

申请号：US13920375

申请日：2013-06-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo NAKAGOSHI ,  Yoichi TAKAGI ,  Nobuaki OGAWA ,  Hidekiyo TAKAOKA ,  Kosuke NAKANO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/284 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10477 ,  H01L2924/00

Abstract: In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based intermetallic compound are produced is arranged so as to be present at a connection terminal member side. In this intermetallic compound producing region, when a cross section of the bond portion is equally defined into 10 boxes in a longitudinal direction and a lateral direction to define 100 boxes in total, a ratio of the number of boxes in each of which at least two types of intermetallic compounds having different constituent elements are present to the total number of boxes other than boxes in each of which only a Sn-based metal component is present is about 70% or more.

Abstract translation: 在导电性接地部和连接端子部件之间的接合部分中，至少具有Cu-Sn系，M-Sn系（M表示Ni和/或Mn）以及Cu 制造的M-Sn系金属间化合物被配置成存在于连接端子部件侧。 在该金属间化合物的制造区域中，当将接合部分的横截面在长度方向和横向方向等同地限定为10个盒子以总共限定100个盒子时，每个盒子的至少两个 具有不同组成元素的金属间化合物的类型存在于除了盒中除了仅存在Sn基金属成分之外的盒子总数的约70％以上。

公开(公告)号：US08536696B2

公开(公告)日：2013-09-17

申请号：US12546950

申请日：2009-08-25

Applicant: Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

Inventor： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC: H01L23/12 ,  H01L21/00 ,  H05K7/00

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Abstract translation: 包括最外层间树脂绝缘层，形成在最外层间树脂绝缘层上的焊盘结构的封装基板，用于与另一基板建立电连接的导电连接引脚，所述导电连接引脚通过焊料固定在焊盘结构上， 以及通过最外层间树脂绝缘层形成的通孔，并且将焊盘结构电连接到在最外层间树脂绝缘层下形成的一个或多个导电电路，通孔位于焊盘结构的正下方。

公开(公告)号：US20130223031A1

公开(公告)日：2013-08-29

申请号：US13880348

申请日：2011-10-10

Applicant: Sabine Schmideder ,  Torsten Thelemann ,  Josef Nagl ,  Heinrich Aschenbrenner ,  Reinhold Hoenicka

Inventor： Sabine Schmideder ,  Torsten Thelemann ,  Josef Nagl ,  Heinrich Aschenbrenner ,  Reinhold Hoenicka

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K1/181 ,  B81B7/0006 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/32 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10356 ,  Y10T29/49128 ,  H01L2924/00

Abstract: A sensor comprises a preferably multi-layer ceramic substrate (2) and at least one sensor element (1) arranged in, at, or on the ceramic substrate (2). The sensor element (1) can be contacted via a metallic contact (6), with the metallic contact (6) being produced via a soldering connection, which electrically connects the contact (6) with the sensor element (1) and here generates a fixed mechanic connection of the contact (6) in reference to the ceramic substrate (2). Furthermore, a method is claimed for producing the sensor according to the invention.

Abstract translation: 传感器包括优选多层陶瓷衬底（2）和布置在陶瓷衬底（2）上，之中或之上的至少一个传感器元件（1）。 传感器元件（1）可以经由金属触点（6）接触，金属触点（6）通过焊接连接产生，焊接连接将触点（6）与传感器元件（1）电连接，并且这里产生 触点（6）相对于陶瓷基板（2）的固定机械连接。 此外，要求保护用于制造根据本发明的传感器的方法。

公开(公告)号：US08460014B2

公开(公告)日：2013-06-11

申请号：US13283482

申请日：2011-10-27

Applicant: Chang-Hsing Yeh ,  Wei-Chun Tsai

Inventor： Chang-Hsing Yeh ,  Wei-Chun Tsai

IPC: H01R12/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/4015 ,  H05K2201/10318 ,  H01L2924/00

Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of electrodes, a soldering material and a plurality of pins. The electrodes are formed in the substrate. The soldering material is disposed on the electrodes. The pins contact the soldering material and electrically connect to the electrodes, wherein at least one of the pins includes a post and a base. The post has a fixing end. The base is disposed on the fixing end of the post, wherein a plurality of openings are formed on the base, passing through the base along an axis, and the axis is parallel to the post.

Abstract translation: 提供电子设备。 电子装置包括基板，多个电极，焊接材料和多个销。 电极形成在基板中。 焊接材料设置在电极上。 引脚接触焊接材料并电连接到电极，其中至少一个引脚包括柱和基座。 该职位有固定结束。 底座设置在柱的固定端上，其中多个开口形成在基座上，沿着轴线穿过底座，并且该轴线平行于柱体。

公开(公告)号：US08426748B2

公开(公告)日：2013-04-23

申请号：US12725546

申请日：2010-03-17

Applicant: Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

Inventor： Masanori Kawade ,  Hiroyuki Tsuruga ,  Makoto Ebina

IPC: H05K1/11

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A lead pin comprising including a body having a shaft portion and a flange portion. The flange portion has at least one flat portion configured to face a connection pad and groove portions positioned to face toward the connection pad and extending from a peripheral portion toward a center portion of the flange portion, the flat portion includes extending portions extending from a center of the flange toward the peripheral portion of the flange and connected at the center of the flange, and the groove portions are tilted to become deeper toward the peripheral portion of the flange.

Abstract translation: 一种引导销，包括包括具有轴部分的主体和凸缘部分。 凸缘部具有至少一个平坦部分，其被构造成面对连接焊盘和定位成面向连接焊盘并从周边部分朝向凸缘部分的中心部分延伸的凹槽部分，平坦部分包括从中心延伸的延伸部分 凸缘朝向凸缘的周边部分并且连接在凸缘的中心，并且槽部倾斜以朝向凸缘的周边部分变深。

公开(公告)号：US08283763B2

公开(公告)日：2012-10-09

申请号：US11762276

申请日：2007-06-13

Applicant: Kazuhiro Oyama ,  Mutsuhiro Mori ,  Katsuaki Saito ,  Yoshihiko Koike

Inventor： Kazuhiro Oyama ,  Mutsuhiro Mori ,  Katsuaki Saito ,  Yoshihiko Koike

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An elastic printed board is provided so that stress applied by the silicon gel is absorbed by the printed board. Further, the printed board is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate.

Abstract translation: 设置弹性印刷电路板，使得由硅胶施加的应力被印刷板吸收。 此外，印刷板形成为如此狭窄，使得应力可能逸出。 另一方面，施加了高电压的电线在各自的印刷电路板上被图案化。 这用于防止通过作为当前通道的相同印刷电路板的表面的放电。 该设计使得可以密封电源模块，防止潮湿或污染的侵入以及盖板的位移，转换和裂纹。

公开(公告)号：US20120153473A1

公开(公告)日：2012-06-21

申请号：US13046396

申请日：2011-03-11

Applicant: Sang Yul LEE

Inventor： Sang Yul LEE

IPC: H01L23/49 ,  H01B5/00

CPC classification number: H05K3/4015 ,  H01L23/49811 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2201/10318 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.

Abstract translation: 本文公开了一种用于包括连接销的封装基板的引脚，以及包括形成在连接销的一端并且具有一个表面接合到连接销的凸缘部分的头部，以及形成在连接销的另一个表面上的平坦部分 所述凸缘部分具有沿其外圆周形成的至少一个凹槽。 根据本发明，沿着引脚的头部的平坦部分的外圆周形成沟槽以增加接合面积，从而可以提高引脚的接合强度。